{"id":476988,"date":"2025-04-06T09:33:57","date_gmt":"2025-04-06T07:33:57","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=476988"},"modified":"2025-04-06T09:33:57","modified_gmt":"2025-04-06T07:33:57","slug":"alliance-entre-intel-et-tsmc-dans-la-fonderie-de-puces","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/alliance-entre-intel-et-tsmc-dans-la-fonderie-de-puces\/","title":{"rendered":"Alliance entre Intel et TSMC dans la fonderie de puces"},"content":{"rendered":"<h2>Le g\u00e9ant des puces en difficult\u00e9 Intel et le fondeur ta\u00efwanais TSMC ont conclu un accord pr\u00e9liminaire en vue de la cr\u00e9ation d&rsquo;une entreprise commune charg\u00e9e de g\u00e9rer les usines de fabrication de puces d&rsquo;Intel, selon un rapport de <em>The Information.<\/em><\/h2>\n<p>TSMC devrait prendre une participation de 20 % dans l&rsquo;entreprise, tandis qu&rsquo;Intel et des entreprises am\u00e9ricaines de semi-conducteurs d\u00e9tiendraient la majorit\u00e9, indique le rapport en se r\u00e9f\u00e9rant \u00e0 des sources anonymes. Au moins une partie, mais pas n\u00e9cessairement la totalit\u00e9, des usines de fabrication de plaquettes d&rsquo;Intel seront incluses dans l&rsquo;entreprise, selon le rapport qui pr\u00e9cise que les d\u00e9tails sont en cours d&rsquo;\u00e9laboration.<\/p>\n<p>La possibilit\u00e9 d&rsquo;un accord avait \u00e9t\u00e9 \u00e9voqu\u00e9e le mois dernier, au moment o\u00f9 Lip-Bu Tan prenait ses fonctions de directeur g\u00e9n\u00e9ral.<\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"wJjj97BfAr\"><p><a href=\"https:\/\/www.eenewseurope.com\/en\/intel-appoints-lip-bu-tan-as-ceo-as-tsmc-pitches-jv\/\">Intel appoints Lip-Bu Tan as CEO \u2013 as TSMC pitches JV<\/a><\/p><\/blockquote>\n<p><iframe class=\"wp-embedded-content lazyload\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; visibility: hidden;\" title=\"&#8220;Intel appoints Lip-Bu Tan as CEO \u2013 as TSMC pitches JV&#8221; &#8212; eeNews Europe\" data-src=\"https:\/\/www.eenewseurope.com\/en\/intel-appoints-lip-bu-tan-as-ceo-as-tsmc-pitches-jv\/embed\/#?secret=i9DmDsX6BM#?secret=wJjj97BfAr\" data-secret=\"wJjj97BfAr\" width=\"500\" height=\"282\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" data-load-mode=\"1\"><\/iframe><\/p>\n<p>Il a \u00e9t\u00e9 rapport\u00e9 \u00e0 l&rsquo;\u00e9poque que TSMC avait \u00e9t\u00e9 invit\u00e9 par l&rsquo;administration Trump \u00e0 proposer un plan pour tenter de r\u00e9soudre une crise de longue dur\u00e9e chez Intel, qui avait \u00e9t\u00e9 le premier fabricant de puces au monde.<\/p>\n<p>TSMC a propos\u00e9 de partager certaines de ses technologies de fabrication avec Intel en \u00e9change d&rsquo;une participation de 20 % dans la nouvelle soci\u00e9t\u00e9, selon <em>The Information<\/em>. TSMC prendrait \u00e9galement le contr\u00f4le de la fabrication et de la formation des travailleurs dans les usines de fabrication de plaquettes de l&rsquo;entreprise.<\/p>\n<p>TSMC a eu des entretiens avec des partenaires potentiels tels qu&rsquo;AMD, Broadcom et Nvidia, selon un rapport pr\u00e9c\u00e9dent. Chaque partenaire pourrait d\u00e9tenir une participation minoritaire, mais au total, la majorit\u00e9 serait d\u00e9tenue par des entreprises ayant leur si\u00e8ge aux \u00c9tats-Unis, une condition probablement impos\u00e9e par le gouvernement am\u00e9ricain.<\/p>\n<p>Si l&rsquo;op\u00e9ration se concr\u00e9tise, elle constituera un exemple de prise de d\u00e9cision rapide et radicale de la part de M. Tan. Dans son premier discours en tant que PDG d&rsquo;Intel, M. Tan a d\u00e9clar\u00e9 qu&rsquo;il vendrait les activit\u00e9s non essentielles, mais il a \u00e9galement r\u00e9it\u00e9r\u00e9 sa promesse de cr\u00e9er une fonderie de classe mondiale \u00e0 partir des capacit\u00e9s de fabrication de puces d&rsquo;Intel.<\/p>\n<h4>Liens et articles connexes :<\/h4>\n<p><a href=\"http:\/\/www.intel.com\">www.intel.com<\/a><\/p>\n<p><a href=\"http:\/\/www.tsmc.com\">www.tsmc.com<\/a><\/p>\n<h4>Articles de presse :<\/h4>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/tsmc-opens-up-2nm-wafer-fab-races-to-mass-production\/\">TSMC ouvre une usine de fabrication de plaquettes de silicium de 2 nm et se lance dans la production de masse <\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/intel-appoints-lip-bu-tan-as-ceo-as-tsmc-pitches-jv\/\">Intel nomme Lip-Bu Tan au poste de PDG, alors que TSMC lance une entreprise commune<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/tsmc-grabs-two-thirds-of-the-foundry-market\/\">TSMC s&#8217;empare des deux tiers du march\u00e9 de la fonderie<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/tsmc-trump-announce-an-extra-us100-billion-capex-in-the-us\/\">TSMC et Trump annoncent un investissement suppl\u00e9mentaire de 100 milliards de dollars aux \u00c9tats-Unis<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/tsmc-broadcom-mull-deals-to-carve-up-intel-2\/\">TSMC et Broadcom envisagent de conclure des accords pour diviser Intel<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Le g\u00e9ant des puces en difficult\u00e9 Intel et le fondeur ta\u00efwanais TSMC ont conclu un accord pr\u00e9liminaire en vue de la cr\u00e9ation d&rsquo;une entreprise commune charg\u00e9e de g\u00e9rer les usines de fabrication de puces d&rsquo;Intel, selon un rapport de The Information. TSMC devrait prendre une participation de 20 % dans l&rsquo;entreprise, tandis qu&rsquo;Intel et des [&hellip;]<\/p>\n","protected":false},"author":40,"featured_media":217257,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[880,3669],"tags":[3762,2721,6384,2541],"domains":[47],"ppma_author":[3631,6199],"class_list":["post-476988","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites-economiques","category-nouvelles","tag-fonderie","tag-intel-fr","tag-semi-conducteurs","tag-tsmc","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Alliance entre Intel et TSMC dans la fonderie de puces ...<\/title>\n<meta name=\"description\" content=\"Intel et le fondeur TSMC auraient conclu un accord pr\u00e9liminaire en vue de la cr\u00e9ation d&#039;une entreprise de fonderie commune.\" \/>\n<meta name=\"robots\" content=\"index, follow, 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