{"id":47506,"date":"2020-09-09T19:14:55","date_gmt":"2020-09-09T19:14:55","guid":{"rendered":"https:\/\/\/memoire-7nm-empilee-en-boitier-3d\/"},"modified":"2020-09-09T19:14:55","modified_gmt":"2020-09-09T19:14:55","slug":"memoire-7nm-empilee-en-boitier-3d","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/memoire-7nm-empilee-en-boitier-3d\/","title":{"rendered":"M\u00e9moire 7nm empil\u00e9e en bo\u00eetier 3D"},"content":{"rendered":"<p>La technologie eXtended-Cube (X-Cube), qui sera pr\u00e9sent\u00e9e lors de la conf\u00e9rence HotChips et sur la vid\u00e9o ci-dessous, utilise la technologie TSV ( through-silicon via ) de Samsung et vise des applications comme la 5G, l&rsquo;intelligence artificielle, le calcul de performance, ainsi que les \u00e9quipements mobile et portable.<\/p>\n<p>Pour Moonsoo Kang, vice-pr\u00e9sident senior strat\u00e9gie du march\u00e9 de la fonderie chez Samsung Electronics : \u00abNotre &nbsp;technologie d\u2019int\u00e9gration 3D garantit des interconnexions TSV fiables, m\u00eame au niveau des n\u0153uds de processus EUV de pointe. Nous nous engageons \u00e0 apporter davantage d\u2019innovations dans le packaging &nbsp;des circuits int\u00e9gr\u00e9s 3D afin de repousser les limites des semiconducteurs.\u00bb<\/p>\n<p>La puce de test X-Cube produite en 7 nm utilise la technologie TSV pour empiler la SRAM sur une puce logique, lib\u00e9rant de l&rsquo;espace pour contenir &nbsp;plus de m\u00e9moire dans une empreinte r\u00e9duite. La conception du bo\u00eetier ultra-mince offre des chemins de signal nettement plus courts entre les matrices pour une vitesse de transfert de donn\u00e9es et une efficacit\u00e9 \u00e9nerg\u00e9tique maximis\u00e9es. Les clients peuvent \u00e9galement adapter la bande passante et la densit\u00e9 de la m\u00e9moire aux sp\u00e9cifications souhait\u00e9es.<\/p>\n<p>La m\u00e9thodologie et le flux de conception de Samsung X-Cube sont d\u00e9sormais disponibles pour les n\u0153uds avanc\u00e9s, y compris 7 nm et 5 nm. S&rsquo;appuyant sur la conception initiale, Samsung pr\u00e9voit de continuer \u00e0 collaborer avec des clients mondiaux afin de faciliter le d\u00e9ploiement de solutions 3D de circuits int\u00e9gr\u00e9s dans les applications haute performance de nouvelle g\u00e9n\u00e9ration.<\/p>\n<p style=\"text-align:center\"><a href=\"https:\/\/youtu.be\/-RvXJVHG4jE\"><img decoding=\"async\" alt=\"\" height=\"301\" data-src=\"https:\/\/eenews.cdnartwhere.eu\/sites\/default\/files\/images\/01-picture-library\/samsung_boitier_3d_video.jpg\" width=\"549\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" class=\"lazyload\" style=\"--smush-placeholder-width: 549px; --smush-placeholder-aspect-ratio: 549\/301;\" \/><\/a><\/p>\n<p><a href=\"http:\/\/www.samsung.com\">Samsung<\/a><\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Samsung Electronics a \u00a0lanc\u00e9 une technologie de bo\u00eetier de circuits int\u00e9gr\u00e9s 3D \u00a0pour la m\u00e9moire SRAM \u00e0 7 nm et au-del\u00e0.<\/p>\n","protected":false},"author":11,"featured_media":47507,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[],"domains":[47],"ppma_author":[1143],"class_list":["post-47506","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","domains-electronique-eci"],"acf":[],"yoast_head":"<title>M\u00e9moire 7nm empil\u00e9e en bo\u00eetier 3D ...<\/title>\n<meta name=\"description\" content=\"Samsung Electronics a \u00a0lanc\u00e9 une technologie de bo\u00eetier de circuits int\u00e9gr\u00e9s 3D \u00a0pour la m\u00e9moire SRAM \u00e0 7 nm et au-del\u00e0.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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