{"id":468166,"date":"2024-12-17T09:41:07","date_gmt":"2024-12-17T08:41:07","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=468166"},"modified":"2024-12-17T09:41:07","modified_gmt":"2024-12-17T08:41:07","slug":"la-ligne-pilote-europeenne-de-chiplets-demarre-ses-activites","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/la-ligne-pilote-europeenne-de-chiplets-demarre-ses-activites\/","title":{"rendered":"La ligne pilote europ\u00e9enne de chiplets d\u00e9marre ses activit\u00e9s"},"content":{"rendered":"<h2>Une ligne pilote pour le packaging avanc\u00e9 et l&rsquo;int\u00e9gration h\u00e9t\u00e9rog\u00e8ne, financ\u00e9e \u00e0 hauteur de 730 millions d&rsquo;euros par l&rsquo;Union europ\u00e9enne et plusieurs autorit\u00e9s nationales de financement, est entr\u00e9e en service.<\/h2>\n<p>La ligne est connue sous le nom d&rsquo;APECs &#8211; pour Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) &#8211; et ne semble pas \u00eatre bas\u00e9e en un seul endroit. Il s&rsquo;agit plut\u00f4t d&rsquo;un r\u00e9seau d&rsquo;op\u00e9rations de fabrication bas\u00e9es dans les instituts de recherche de toute l&rsquo;Europe qui peuvent \u00eatre financ\u00e9s par le m\u00e9canisme.<\/p>\n<p>La ligne pilote de l&rsquo;APECS fait partie du r\u00e9seau Research Fab Microelectronics Germany (FMD), qui comprend plusieurs instituts Fraunhofer et d&rsquo;autres instituts de recherche \u00e0 travers l&rsquo;Allemagne, notamment \u00e0 Dresde, Berlin et Munich. Elle devrait fournir un large \u00e9ventail de technologies et devenir une plaque tournante pour le d\u00e9veloppement du packaging avanc\u00e9 et de l&rsquo;int\u00e9gration h\u00e9t\u00e9rog\u00e8ne. \u00c0 cette fin, il pr\u00e9voit \u00e9galement la participation de dix partenaires de recherche issus de huit pays. Ces partenaires comprennent les suivants : IMEC, CEA-Leti, Fraunhofer et VTT.<\/p>\n<p>L&rsquo;APECS devrait fournir des capacit\u00e9s de conception et de production pilote de bout en bout, depuis la R&amp;D jusqu&rsquo;\u00e0 des solutions de fabrication pratiques et \u00e9volutives. Il sera en mesure de fournir un acc\u00e8s en petites quantit\u00e9s \u00e0 des entreprises qui ne pourraient pas autrement se permettre d&rsquo;acc\u00e9der \u00e0 la technologie.<\/p>\n<p>L&rsquo;APECS est cofinanc\u00e9 par l&rsquo;entreprise commune Chips et les autorit\u00e9s nationales de financement d&rsquo;Autriche, de Belgique, de Finlande, de France, d&rsquo;Allemagne, de Gr\u00e8ce, du Portugal et d&rsquo;Espagne. Le financement global de l&rsquo;APECS s&rsquo;\u00e9l\u00e8ve \u00e0 730 millions d&rsquo;euros sur 4,5 ans.<\/p>\n<p>Dans un communiqu\u00e9, le Fraunhofer IPMS a ajout\u00e9 que gr\u00e2ce \u00e0 un financement substantiel du minist\u00e8re f\u00e9d\u00e9ral allemand de l&rsquo;\u00e9ducation et de la recherche (BMBF) et des \u00c9tats f\u00e9d\u00e9raux allemands, il est pr\u00e9vu d&rsquo;\u00e9tendre l&rsquo;infrastructure de R&amp;D dans les ann\u00e9es \u00e0 venir dans le cadre de la ligne pilote APECS.<\/p>\n<p>Le professeur Holger Hanselka, pr\u00e9sident de la Fraunhofer-Gesellschaft, a d\u00e9clar\u00e9 : \u00ab\u00a0Gr\u00e2ce \u00e0 nos recherches ax\u00e9es sur la pratique et \u00e0 notre \u00e9troite collaboration avec l&rsquo;industrie, le monde universitaire et les partenaires politiques, nous jetons les bases non seulement du d\u00e9veloppement de technologies de pointe, mais aussi de leur application industrielle.\u00a0\u00bb<\/p>\n<h4>Liens et articles connexes :<\/h4>\n<p><a href=\"http:\/\/www.ipms.fraunhofer.de\">www.ipms.fraunhofer.de<\/a><\/p>\n<h4>Articles de presse :<\/h4>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/1-6bn-for-us-defense-chiplets\/\">1,6 milliard de dollars pour des projets de d\u00e9fense am\u00e9ricains<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/300m-for-us-chiplet-packaging\/\">300 millions de dollars pour l&#8217;emballage des chiplets aux \u00c9tats-Unis<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/462683\/\">L&rsquo;imec recrute des entreprises europ\u00e9ennes pour un programme de chiplets automobiles<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/glass-chiplets-will-propel-advanced-ic-substrate-market-says-yole\/\">Selon Yole, le verre et les puces propulseront le march\u00e9 des substrats pour circuits int\u00e9gr\u00e9s avanc\u00e9s<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Une ligne pilote pour le packaging avanc\u00e9 et l&rsquo;int\u00e9gration h\u00e9t\u00e9rog\u00e8ne, financ\u00e9e \u00e0 hauteur de 730 millions d&rsquo;euros par l&rsquo;Union europ\u00e9enne et plusieurs autorit\u00e9s nationales de financement, est entr\u00e9e en service. La ligne est connue sous le nom d&rsquo;APECs &#8211; pour Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) &#8211; et ne semble [&hellip;]<\/p>\n","protected":false},"author":40,"featured_media":468111,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[884,883],"tags":[889,891,3699,3301,6775,913,2224],"domains":[47],"ppma_author":[3631,6199],"class_list":["post-468166","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-partenaires","category-technologies","tag-analog-fr","tag-automotive-fr","tag-capteurs-fr","tag-chiplets-fr","tag-initiative-europeenne-chips-act-fr","tag-materials-processes-fr","tag-mems-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>La ligne pilote europ\u00e9enne de chiplets d\u00e9marre ses activit\u00e9s ...<\/title>\n<meta name=\"description\" content=\"Une 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