{"id":463843,"date":"2024-10-27T11:18:59","date_gmt":"2024-10-27T10:18:59","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=463843"},"modified":"2024-10-27T11:18:59","modified_gmt":"2024-10-27T10:18:59","slug":"etape-importante-vers-une-electronique-imprimee-en-3d","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/","title":{"rendered":"Etape importante vers une \u00e9lectronique imprim\u00e9e en 3D"},"content":{"rendered":"<h2>En fabriquant des portes logiques sans semi-conducteur, qui peuvent \u00eatre utilis\u00e9es pour effectuer des calculs, les chercheurs esp\u00e8rent rationaliser la fabrication de composants \u00e9lectroniques.<\/h2>\n<p>L&rsquo;\u00e9lectronique active, c&rsquo;est-\u00e0-dire les composants capables de contr\u00f4ler les signaux \u00e9lectriques, contient g\u00e9n\u00e9ralement des composants semi-conducteurs qui re\u00e7oivent, stockent et traitent les informations. Ces composants, qui doivent \u00eatre fabriqu\u00e9s dans une salle blanche, n\u00e9cessitent une technologie de fabrication avanc\u00e9e qui n&rsquo;est pas largement disponible en dehors de quelques centres de fabrication sp\u00e9cialis\u00e9s, les Fabs qui co\u00fbtent des milliards de d&rsquo;euros.<\/p>\n<p>Pendant la pand\u00e9mie de Covid-19, la p\u00e9nurie d&rsquo;installations de fabrication de semi-conducteurs \u00e0 grande \u00e9chelle a \u00e9t\u00e9 l&rsquo;une des causes de la p\u00e9nurie mondiale d&rsquo;\u00e9lectronique, qui a fait grimper les co\u00fbts pour les consommateurs et a eu des r\u00e9percussions dans tous les domaines, de la croissance \u00e9conomique \u00e0 la d\u00e9fense nationale. La possibilit\u00e9 d&rsquo;imprimer en 3D un dispositif \u00e9lectronique actif complet sans avoir recours \u00e0 des semi-conducteurs pourrait permettre aux entreprises, aux laboratoires et aux particuliers du monde entier de fabriquer des appareils \u00e9lectroniques.<\/p>\n<p>Bien que cette id\u00e9e soit encore lointaine, les chercheurs du MIT ont fait un pas important dans cette direction en d\u00e9montrant des fusibles r\u00e9initialisables enti\u00e8rement imprim\u00e9s en 3D, qui sont des composants cl\u00e9s de l&rsquo;\u00e9lectronique active n\u00e9cessitant habituellement des semi-conducteurs.<\/p>\n<p>Ces dispositifs sans semi-conducteurs des chercheurs, fabriqu\u00e9s \u00e0 l&rsquo;aide de mat\u00e9riel d&rsquo;impression 3D standard et d&rsquo;un mat\u00e9riau biod\u00e9gradable peu co\u00fbteux, peuvent ex\u00e9cuter les m\u00eames fonctions de commutation que les transistors \u00e0 base de semi-conducteurs utilis\u00e9s pour les op\u00e9rations de traitement dans l&rsquo;\u00e9lectronique active.<\/p>\n<p><img decoding=\"async\" class=\"alignnone size-medium wp-image-463537 lazyload\" data-src=\"https:\/\/www.eenewseurope.com\/wp-content\/uploads\/2024\/10\/Screen-Shot-2024-10-22-at-14.19.56-300x218.png\" alt=\"\" width=\"300\" height=\"218\" data-srcset=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2024\/10\/Screen-Shot-2024-10-22-at-14.19.56-300x218.png 300w, https:\/\/www.ecinews.fr\/wp-content\/uploads\/2024\/10\/Screen-Shot-2024-10-22-at-14.19.56.png 709w\" data-sizes=\"(max-width: 300px) 100vw, 300px\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" style=\"--smush-placeholder-width: 300px; --smush-placeholder-aspect-ratio: 300\/218;\" \/><\/p>\n<div class=\"news-article--media--image--caption\" style=\"padding-left: 40px;\"><span style=\"font-size: 12px;\"><em>Les dispositifs sont fabriqu\u00e9s \u00e0 partir de fines traces de polym\u00e8re dop\u00e9 au cuivre imprim\u00e9es en 3D. Ils contiennent des r\u00e9gions conductrices entrecrois\u00e9es qui permettent aux chercheurs de r\u00e9guler la r\u00e9sistance en contr\u00f4lant la tension alimentant le commutateur. <\/em><\/span><\/div>\n<div class=\"news-article--media--image--credits\" style=\"padding-left: 40px;\">\n<div class=\"visually-hidden\"><span style=\"font-size: 12px;\"><em><span class=\"label\">Cr\u00e9dits<\/span><span class=\"visually-hidden\">:<\/span><\/em><\/span><\/div>\n<p><span style=\"font-size: 12px;\"><em>Image : Avec l&rsquo;aimable autorisation des chercheurs<\/em><\/span><\/div>\n<p>Bien qu&rsquo;ils soient encore loin d&rsquo;atteindre les performances des transistors \u00e0 semi-conducteurs, les dispositifs imprim\u00e9s en 3D pourraient \u00eatre utilis\u00e9s pour des op\u00e9rations de contr\u00f4le de base telles que la r\u00e9gulation de la vitesse d&rsquo;un moteur \u00e9lectrique.<\/p>\n<p style=\"padding-left: 40px;\"><em>\u00ab\u00a0Cette technologie a de v\u00e9ritables atouts. Bien que nous ne puissions pas rivaliser avec le silicium en tant que semi-conducteur, notre id\u00e9e n&rsquo;est pas n\u00e9cessairement de remplacer ce qui existe, mais de pousser la technologie de l&rsquo;impression 3D vers des territoires inexplor\u00e9s. En un mot, il s&rsquo;agit vraiment de d\u00e9mocratiser la technologie. Cela pourrait permettre \u00e0 n&rsquo;importe qui de cr\u00e9er du mat\u00e9riel intelligent loin des centres de fabrication traditionnels\u00a0\u00bb, explique Luis Fernando Vel\u00e1squez-Garc\u00eda, chercheur principal aux Microsystems Technology Laboratories (MTL) du MIT et auteur principal d&rsquo;un <a href=\"https:\/\/www.tandfonline.com\/doi\/full\/10.1080\/17452759.2024.2404157\" target=\"_blank\" rel=\"noopener\">article d\u00e9crivant les dispositifs<\/a>, qui para\u00eet dans Virtual and Physical Prototyping (Prototypage physique et virtuel).<\/em><\/p>\n<p>Il est rejoint par l&rsquo;auteur principal, Jorge Ca\u00f1ada, \u00e9tudiant dipl\u00f4m\u00e9 en g\u00e9nie \u00e9lectrique et en informatique.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>En fabriquant des portes logiques sans semi-conducteur, qui peuvent \u00eatre utilis\u00e9es pour effectuer des calculs, les chercheurs esp\u00e8rent rationaliser la fabrication de composants \u00e9lectroniques. L&rsquo;\u00e9lectronique active, c&rsquo;est-\u00e0-dire les composants capables de contr\u00f4ler les signaux \u00e9lectriques, contient g\u00e9n\u00e9ralement des composants semi-conducteurs qui re\u00e7oivent, stockent et traitent les informations. Ces composants, qui doivent \u00eatre fabriqu\u00e9s dans une [&hellip;]<\/p>\n","protected":false},"author":7,"featured_media":463538,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[3669,883],"tags":[8051,8052],"domains":[47],"ppma_author":[1139,1153],"class_list":["post-463843","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouvelles","category-technologies","tag-electronique-3d","tag-impression-3d-electronique","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Etape importante vers une \u00e9lectronique imprim\u00e9e en 3D ...<\/title>\n<meta name=\"description\" content=\"Des chercheurs on cr\u00e9\u00e9 des portes logiques sans semi-conducteur, qui peuvent \u00eatre utilis\u00e9es pour effectuer des calculs.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, 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3D\",\"isPartOf\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\"},\"datePublished\":\"2024-10-27T10:18:59+00:00\",\"dateModified\":\"2024-10-27T10:18:59+00:00\",\"description\":\"Des chercheurs on cr\u00e9\u00e9 des portes logiques sans semi-conducteur, qui peuvent \u00eatre utilis\u00e9es pour effectuer des calculs.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.ecinews.fr\/fr\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Etape importante vers une \u00e9lectronique 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name=search_term_string\"}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\",\"name\":\"EENewsEurope\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"contentUrl\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"width\":283,\"height\":113,\"caption\":\"EENewsEurope\"},\"image\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/c6b626c6c65f5e1e7794ce2d17b2ca82\",\"name\":\"Wisse Hettinga\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/5dc5f564ca306d7cb8b22735be49a465\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/24a36fe68de56eac2a45cbaf9aa4bb58?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/24a36fe68de56eac2a45cbaf9aa4bb58?s=96&d=mm&r=g\",\"caption\":\"Wisse Hettinga\"}}]}<\/script>","yoast_head_json":{"title":"Etape importante vers une \u00e9lectronique imprim\u00e9e en 3D ...","description":"Des chercheurs on cr\u00e9\u00e9 des portes logiques sans semi-conducteur, qui peuvent \u00eatre utilis\u00e9es pour effectuer des calculs.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/463843\/","og_locale":"fr_FR","og_type":"article","og_title":"Etape importante vers une \u00e9lectronique imprim\u00e9e en 3D","og_description":"Des chercheurs on cr\u00e9\u00e9 des portes logiques sans semi-conducteur, qui peuvent \u00eatre utilis\u00e9es pour effectuer des calculs.","og_url":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/463843\/","og_site_name":"EENewsEurope","article_published_time":"2024-10-27T10:18:59+00:00","og_image":[{"width":709,"height":516,"url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2024\/10\/Screen-Shot-2024-10-22-at-14.19.56.png","type":"image\/png"}],"author":"Wisse Hettinga, A Delapalisse","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Wisse Hettinga","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/#article","isPartOf":{"@id":"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/"},"author":{"name":"Wisse Hettinga","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/c6b626c6c65f5e1e7794ce2d17b2ca82"},"headline":"Etape importante vers une \u00e9lectronique imprim\u00e9e en 3D","datePublished":"2024-10-27T10:18:59+00:00","dateModified":"2024-10-27T10:18:59+00:00","mainEntityOfPage":{"@id":"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/"},"wordCount":537,"publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"keywords":["\u00c9lectronique 3D","Impression 3d \u00e9lectronique"],"articleSection":["Nouvelles","Technologies"],"inLanguage":"fr-FR"},{"@type":"WebPage","@id":"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/","url":"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/","name":"Etape importante vers une \u00e9lectronique imprim\u00e9e en 3D","isPartOf":{"@id":"https:\/\/www.eenewseurope.com\/en\/#website"},"datePublished":"2024-10-27T10:18:59+00:00","dateModified":"2024-10-27T10:18:59+00:00","description":"Des chercheurs on cr\u00e9\u00e9 des portes logiques sans semi-conducteur, qui peuvent \u00eatre utilis\u00e9es pour effectuer des calculs.","breadcrumb":{"@id":"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.ecinews.fr\/fr\/etape-importante-vers-une-electronique-imprimee-en-3d\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.ecinews.fr\/fr\/"},{"@type":"ListItem","position":2,"name":"Etape importante vers une \u00e9lectronique imprim\u00e9e en 3D"}]},{"@type":"WebSite","@id":"https:\/\/www.eenewseurope.com\/en\/#website","url":"https:\/\/www.eenewseurope.com\/en\/","name":"EENewsEurope","description":"Just another WordPress site","publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"fr-FR"},{"@type":"Organization","@id":"https:\/\/www.eenewseurope.com\/en\/#organization","name":"EENewsEurope","url":"https:\/\/www.eenewseurope.com\/en\/","logo":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/","url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","contentUrl":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","width":283,"height":113,"caption":"EENewsEurope"},"image":{"@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/c6b626c6c65f5e1e7794ce2d17b2ca82","name":"Wisse Hettinga","image":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/5dc5f564ca306d7cb8b22735be49a465","url":"https:\/\/secure.gravatar.com\/avatar\/24a36fe68de56eac2a45cbaf9aa4bb58?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/24a36fe68de56eac2a45cbaf9aa4bb58?s=96&d=mm&r=g","caption":"Wisse Hettinga"}}]}},"authors":[{"term_id":1139,"user_id":7,"is_guest":0,"slug":"wisse-hettinga","display_name":"Wisse Hettinga","avatar_url":"https:\/\/secure.gravatar.com\/avatar\/24a36fe68de56eac2a45cbaf9aa4bb58?s=96&d=mm&r=g","0":null,"1":"","2":"","3":"","4":"","5":"","6":"","7":"","8":""},{"term_id":1153,"user_id":34,"is_guest":0,"slug":"adelapalisse","display_name":"A Delapalisse","avatar_url":"https:\/\/secure.gravatar.com\/avatar\/ad45a8c5da24bc9c7c4940dd1c48a695?s=96&d=mm&r=g","0":null,"1":"","2":"","3":"","4":"","5":"","6":"","7":"","8":""}],"_links":{"self":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/463843"}],"collection":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/users\/7"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/comments?post=463843"}],"version-history":[{"count":0,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/463843\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media\/463538"}],"wp:attachment":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media?parent=463843"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/categories?post=463843"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/tags?post=463843"},{"taxonomy":"domains","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/domains?post=463843"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/ppma_author?post=463843"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}