{"id":463211,"date":"2024-10-17T11:42:31","date_gmt":"2024-10-17T09:42:31","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=463211"},"modified":"2024-10-17T11:45:17","modified_gmt":"2024-10-17T09:45:17","slug":"le-marche-des-chiplets-depassera-411-milliards-en-2035","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/le-marche-des-chiplets-depassera-411-milliards-en-2035\/","title":{"rendered":"Le march\u00e9 des chiplets d\u00e9passera $400 milliards en 2035"},"content":{"rendered":"<h3><a href=\"https:\/\/www.eenewseurope.com\/en\/chiplets-drive-new-automated-design-tools-at-leti\/\">Le march\u00e9 des chiplets atteindra 411 milliards de dollars am\u00e9ricains d&rsquo;ici 2035, selon un rapport de l&rsquo;institut d&rsquo;\u00e9tudes de march\u00e9 IDTechEx.<\/a><\/h3>\n<p>Le rapport IDTechEx examine l&rsquo;impact transformateur de la technologie chiplet sur la conception des semi-conducteurs, motiv\u00e9 par le besoin de flexibilit\u00e9 et de rentabilit\u00e9 \u00e0 mesure que la loi de Moore ralentit. Il met en \u00e9vidence les progr\u00e8s r\u00e9alis\u00e9s par les acteurs concern\u00e9s de la cha\u00eene d&rsquo;approvisionnement, en relevant des d\u00e9fis tels que l&rsquo;int\u00e9gration, l&rsquo;interconnexion et la communication, ainsi que la gestion thermique.<\/p>\n<p>Le rapport fournit des pr\u00e9visions de march\u00e9 sur dix ans, pr\u00e9voyant une croissance \u00e0 411 milliards USD d&rsquo;ici 2035 pour les serveurs, les t\u00e9l\u00e9communications, les PC, les t\u00e9l\u00e9phones mobiles et les puces pour l&rsquo;automobile.<\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"EilTjl2cB6\"><p><a href=\"https:\/\/www.eenewseurope.com\/en\/e2-5bn-for-european-1nm-chiplet-pilot-line-at-imec\/\">\u20ac2.5bn for European 1nm chiplet pilot line at imec<\/a><\/p><\/blockquote>\n<p><iframe class=\"wp-embedded-content lazyload\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; visibility: hidden;\" title=\"&#8220;\u20ac2.5bn for European 1nm chiplet pilot line at imec&#8221; &#8212; eeNews Europe\" data-src=\"https:\/\/www.eenewseurope.com\/en\/e2-5bn-for-european-1nm-chiplet-pilot-line-at-imec\/embed\/#?secret=G5efZEbYkp#?secret=EilTjl2cB6\" data-secret=\"EilTjl2cB6\" width=\"500\" height=\"282\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" data-load-mode=\"1\"><\/iframe><\/p>\n<p>L&rsquo;adoption de la technologie des chiplets est motiv\u00e9e par sa capacit\u00e9 \u00e0 r\u00e9pondre \u00e0 plusieurs limitations critiques inh\u00e9rentes aux conceptions traditionnelles de puces monolithiques. L&rsquo;un des avantages est sa capacit\u00e9 \u00e0 surmonter des contraintes telles que la taille des r\u00e9ticules et le mur de m\u00e9moire, qui entravent traditionnellement les performances et l&rsquo;\u00e9volutivit\u00e9 des composants semi-conducteurs.<\/p>\n<ul>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/egis-group-collaborates-with-arm-to-drive-ai-hpc-chiplet-technology\/\">Egis et ARM s&rsquo;associent pour les puces HPC AIO<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/baya-systems-emerges-from-stealth-with-chiplet-interconnect\/\">Baya sort de la clandestinit\u00e9 gr\u00e2ce \u00e0 l&rsquo;interconnexion de chiplets<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/chiplets-drive-new-automated-design-tools-at-leti\/\">Les chiplets sont \u00e0 l&rsquo;origine de nouveaux outils de conception automatis\u00e9s<\/a><\/li>\n<\/ul>\n<p>En modularisant les fonctions des puces en chiplets discrets, les fabricants peuvent optimiser l&rsquo;utilisation des mat\u00e9riaux semi-conducteurs et des n\u0153uds de traitement de mani\u00e8re plus efficace. En outre, les chiplets peuvent permettre une meilleure utilisation de l&rsquo;espace des coins du wafer et un taux de d\u00e9faut plus faible sur les puces, qui sont souvent sous-utilis\u00e9es dans les conceptions de puces conventionnelles, en particulier dans les grands SoC qui exigent un nombre croissant de fonctions.<\/p>\n<p>Les composants discrets peuvent \u00eatre test\u00e9s et valid\u00e9s individuellement avant l&rsquo;int\u00e9gration, ce qui augmente le rendement de la fabrication, permet d&rsquo;obtenir une meilleure qualit\u00e9 de production et de r\u00e9duire les co\u00fbts par unit\u00e9.<\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"RGL1bBI9Nj\"><p><a href=\"https:\/\/www.eenewseurope.com\/en\/462683\/\">imec signs up European firms for automotive chiplet programme<\/a><\/p><\/blockquote>\n<p><iframe class=\"wp-embedded-content lazyload\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; visibility: hidden;\" title=\"&#8220;imec signs up European firms for automotive chiplet programme&#8221; &#8212; eeNews Europe\" data-src=\"https:\/\/www.eenewseurope.com\/en\/462683\/embed\/#?secret=U8om06ZqqA#?secret=RGL1bBI9Nj\" data-secret=\"RGL1bBI9Nj\" width=\"500\" height=\"282\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" data-load-mode=\"1\"><\/iframe><\/p>\n<p>Les chiplets permettent \u00e9galement un processus de conception plus flexible, permettant l&rsquo;int\u00e9gration de diverses fonctionnalit\u00e9s adapt\u00e9es \u00e0 des applications sp\u00e9cifiques sans qu&rsquo;il soit n\u00e9cessaire de concevoir des puces enti\u00e8rement nouvelles. Cette flexibilit\u00e9 permet non seulement de r\u00e9duire les d\u00e9lais et les co\u00fbts de d\u00e9veloppement, mais aussi de s&rsquo;adapter rapidement \u00e0 l&rsquo;\u00e9volution des exigences technologiques.<\/p>\n<p>Si les chiplets offrent de nombreux avantages, ils posent \u00e9galement de nouveaux d\u00e9fis. L&rsquo;int\u00e9gration de plusieurs chiplets n\u00e9cessite des technologies et des normes d&rsquo;interconnexion avanc\u00e9es pour assurer une communication transparente entre les composants.<\/p>\n<p>La gestion thermique est un autre domaine critique, car l&rsquo;augmentation de la densit\u00e9 des fonctions peut entra\u00eener une surchauffe si elle n&rsquo;est pas correctement g\u00e9r\u00e9e. Ces d\u00e9fis ouvrent des opportunit\u00e9s pour les diff\u00e9rents acteurs de la cha\u00eene d&rsquo;approvisionnement. Par exemple, les diff\u00e9rentes zones du bo\u00eetier dans la conception des chiplets n\u00e9cessitent des types distincts de mat\u00e9riaux de remplissage pour r\u00e9pondre \u00e0 des besoins sp\u00e9cifiques, par exemple pour prot\u00e9ger les puces elles-m\u00eames, en fournissant un support m\u00e9canique et une stabilit\u00e9 thermique, ainsi que pour prot\u00e9ger les fils d\u00e9licats et les billes de soudure qui relient les chiplets, en \u00e9vitant des probl\u00e8mes tels que la d\u00e9lamination ou la s\u00e9paration. Il en r\u00e9sulte une demande de mat\u00e9riaux innovants qui am\u00e9liorent la fiabilit\u00e9 et les performances.<\/p>\n<p><a href=\"http:\/\/www.idtechex.com\/en\/research-report\/chiplet-technology-2025\/1041\">www.idtechex.com\/en\/research-report\/chiplet-technology-2025\/1041<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Le march\u00e9 des chiplets atteindra 411 milliards de dollars am\u00e9ricains d&rsquo;ici 2035, selon un rapport de l&rsquo;institut d&rsquo;\u00e9tudes de march\u00e9 IDTechEx. Le rapport IDTechEx examine l&rsquo;impact transformateur de la technologie chiplet sur la conception des semi-conducteurs, motiv\u00e9 par le besoin de flexibilit\u00e9 et de rentabilit\u00e9 \u00e0 mesure que la loi de Moore ralentit. Il met [&hellip;]<\/p>\n","protected":false},"author":40,"featured_media":463194,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[888],"tags":[1640,4511,5127],"domains":[47],"ppma_author":[3640,6199],"class_list":["post-463211","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-marche","tag-automobile","tag-chiplet-fr","tag-hpc-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Le march\u00e9 des chiplets d\u00e9passera $400 milliards en 2035 ...<\/title>\n<meta name=\"description\" content=\"Le march\u00e9 des chiplets atteindra $411 milliards d&#039;ici 2035, selon un rapport d&#039;IDTechEx portant sur le HPC, l&#039;automobile et le mobile.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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