{"id":461759,"date":"2024-10-01T21:05:57","date_gmt":"2024-10-01T19:05:57","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=461759"},"modified":"2024-10-02T08:25:53","modified_gmt":"2024-10-02T06:25:53","slug":"le-marche-mondial-des-materiaux-de-packaging-pour-semiconducteurs-renoue-avec-la-croissance-a-partir-de-2024","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/le-marche-mondial-des-materiaux-de-packaging-pour-semiconducteurs-renoue-avec-la-croissance-a-partir-de-2024\/","title":{"rendered":"Le march\u00e9 mondial des mat\u00e9riaux de packaging pour semiconducteurs renoue avec la croissance \u00e0 partir de 2024"},"content":{"rendered":"<h3><span style=\"font-size: 16px;\">Semi, Techcet et TechSearch International dans leur dernier rapport \u00ab\u00a0Global Semiconductor Packaging Materials Outlook (GSPMO)\u00a0\u00bb, ont annonc\u00e9 que le march\u00e9 mondial des mat\u00e9riaux d&rsquo;enrobage des semiconducteurs devrait entamer un cycle de taux de croissance annuel compos\u00e9 (CAGR) de 5,6 % jusqu&rsquo;en 2028,<\/span><\/h3>\n<p>Aliment\u00e9 par une forte demande de semiconducteurs dans diverses applications finales, le rapport souligne que l&rsquo;IA est un moteur de croissance attendu pour les applications de packaging avanc\u00e9es, malgr\u00e9 des volumes unitaires actuellement faibles en raison de la nouveaut\u00e9 du segment de march\u00e9.<\/p>\n<p><strong>Une croissance soutenue<\/strong><\/p>\n<p>Le rapport GSPMO fournit des donn\u00e9es et des pr\u00e9visions compl\u00e8tes pour les substrats, les leadframes, les fils et d&rsquo;autres mat\u00e9riaux de conditionnement avanc\u00e9s. \u00abApr\u00e8s une ann\u00e9e 2023 difficile, qui a vu une baisse de 15,5 % du march\u00e9 des mat\u00e9riaux de packaging de semiconducteurs, notre dernier rapport pr\u00e9voit un retour \u00e0 la croissance en 2024 \u00bb, a d\u00e9clar\u00e9 Lita Shon-Roy, PDG de Techcet. \u00ab Le march\u00e9 mondial de ces mat\u00e9riaux devrait d\u00e9passer les 26 milliards de dollars d&rsquo;ici 2025 et poursuivre une croissance solide jusqu&rsquo;en 2028. \u00bb<\/p>\n<p><img decoding=\"async\" class=\"wp-image-461766 alignleft lazyload\" data-src=\"https:\/\/www.eenewseurope.com\/wp-content\/uploads\/2024\/10\/Techset-300x199.jpg\" alt=\"\" width=\"338\" height=\"224\" data-srcset=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2024\/10\/Techset-300x199.jpg 300w, https:\/\/www.ecinews.fr\/wp-content\/uploads\/2024\/10\/Techset.jpg 619w\" data-sizes=\"(max-width: 338px) 100vw, 338px\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" style=\"--smush-placeholder-width: 338px; --smush-placeholder-aspect-ratio: 338\/224;\" \/><\/p>\n<p>\u00ab Les substrats repr\u00e9sentent une grande partie des revenus du march\u00e9 de ces mat\u00e9riaux et, dans cette cat\u00e9gorie, les substrats FC-BGA constituent la majorit\u00e9 de la croissance des revenus \u00bb, a d\u00e9clar\u00e9 Jan Vardaman, pr\u00e9sident de TechSearch International. \u00ab Le taux de croissance annuel compos\u00e9 (CAGR) pour les revenus des flip chips BGA\/LGA devrait \u00eatre de 7,6 % entre 2023 et 2028. Les di\u00e9lectriques pour le conditionnement au niveau de la plaquette (WLP) et les connexions pour les puces \u00e0 flip sont d&rsquo;autres domaines de croissance cl\u00e9s. Le segment des substrats stratifi\u00e9s devrait cro\u00eetre de 7,3 % par an en volume, tandis que les leadframes et les fils de connexions vont \u00e9galement se redresser, avec une croissance de 5,0 % et 6,4 %, respectivement<\/p>\n<p>Le rapport GSPMO 2024 est un outil d&rsquo;aide aux entreprises pour tirer parti des tendances \u00e9mergentes, \u00e0 relever les d\u00e9fis de la cha\u00eene logistiques et \u00e0 prendre des d\u00e9cisions judicieuses en mati\u00e8re d&rsquo;approvisionnement en mat\u00e9riaux de haute performance.<\/p>\n<p>&nbsp;<\/p>\n<p>Pour plus d&rsquo;informations sur le rapport ou pour s&rsquo;y abonner, consulter le site <a href=\"https:\/\/u7061146.ct.sendgrid.net\/ls\/click?upn=u001.gqh-2BaxUzlo7XKIuSly0rC0BqTe6YKHiASEdCGa5GdM1vqmqjvwUeM-2BB0k5N55oyltIaVCKtXUQZGGAYJKOBQYQ-3D-3DsoKa_GeBvwWZyvhG3oHefulLJAvYhmtW8v5Vuc4BNkWQTzCo4RgEHbISyKU9bnp3ZNyvfQx4veqPcy8VS27D5-2BiNf9dIVXY-2BjWTiwM-2FHhRwDQvnlCH-2B8pLpZnA16w75mseuAV9XxyoruPcGGu3RrBJ2TPaVNaj0wY0rfqRbhNhb7LRouogr4SkthWTtzkoRGB66IMTZx15J9ezsi7mNvLc8AuEmnM5r544tn3uhCMg2r7ajA6Uc-2FAUJhgGnvftWrTuCT2l0iu5ZMAX43-2F7lwU-2FZK3pf2xvFjGYZYOo0rCodEDJelbc0c-2Bl-2FUT1y9QAzCtSPHg-2Ba8vC-2BQa2ZotMouDEtbLkw-3D-3D\">SEMI Market Data<\/a>.<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Semi, Techcet et TechSearch International dans leur dernier rapport \u00ab\u00a0Global Semiconductor Packaging Materials Outlook (GSPMO)\u00a0\u00bb, ont annonc\u00e9 que le march\u00e9 mondial des mat\u00e9riaux d&rsquo;enrobage des semiconducteurs devrait entamer un cycle de taux de croissance annuel compos\u00e9 (CAGR) de 5,6 % jusqu&rsquo;en 2028, Aliment\u00e9 par une forte demande de semiconducteurs dans diverses applications finales, le rapport [&hellip;]<\/p>\n","protected":false},"author":11,"featured_media":461793,"comment_status":"closed","ping_status":"closed","sticky":true,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":"","_ppma_block_editor_authors":""},"categories":[886,888],"tags":[7761,1558],"domains":[47],"ppma_author":[1143],"class_list":["post-461759","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news-fr","category-marche","tag-materiaux-de-packaging","tag-semiconducteurs","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Le march\u00e9 mondial des mat\u00e9riaux de packaging pour semiconduct...<\/title>\n<meta name=\"description\" content=\"Le march\u00e9 mondial des mat\u00e9riaux de packaging pour semiconducteurs renoue avec la croissance \u00e0 partir de 2024\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, 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