{"id":460989,"date":"2024-09-22T19:50:18","date_gmt":"2024-09-22T17:50:18","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=460989"},"modified":"2024-09-22T19:50:55","modified_gmt":"2024-09-22T17:50:55","slug":"ensilica-integre-design-center-alliance-de-tsmc-open-innovation-platform","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/ensilica-integre-design-center-alliance-de-tsmc-open-innovation-platform\/","title":{"rendered":"EnSilica int\u00e8gre le Design Center Alliance de TSMC Open Innovation Platform"},"content":{"rendered":"<h3><span style=\"font-size: 16px;\">EnSilica, fabricants anglais de puces\u00a0 ASIC \u00e0 signaux mixtes, a rejoint la Design Center Alliance (DCA) de TSMC Open Innovation Platform\u00ae (OIP). <\/span><\/h3>\n<p>Le programme DCA de TSMC se concentre sur les services d&rsquo;impl\u00e9mentation de puces et sur l&rsquo;activation de solutions de conception au niveau du syst\u00e8me, afin de r\u00e9duire les difficult\u00e9s \u00e0 la conception pour les clients qui adoptent la technologie TSMC.\u00a0Ce partenariat\u00a0 renforce la valeur d&rsquo;EnSilica dans la mise en \u0153uvre de syst\u00e8mes sur puce (SoC) de nouvelle g\u00e9n\u00e9ration, allant des dispositifs \u00e0 signaux mixtes pour les applications industrielles et automobiles aux communications et aux puces d&rsquo;intelligence artificielle de pointe utilisant les technologies de processus les plus avanc\u00e9es de TSMC.<\/p>\n<p><strong>Un \u00e9cosyst\u00e8me complet<\/strong><\/p>\n<p>L&rsquo;OIP\u00a0 es un \u00e9cosyst\u00e8me de conception complet qui inclut tous les domaines critiques de mise en \u0153uvre des circuits int\u00e9gr\u00e9s afin de r\u00e9duire les obstacles \u00e0 la conception et d&rsquo;am\u00e9liorer le succ\u00e8s de la premi\u00e8re mise en \u0153uvre du silicium. L&rsquo;OIP permet la mise en \u0153uvre rapide de l&rsquo;innovation au sein de la communaut\u00e9 des concepteurs de semiconducteurs, ce qui permet d&rsquo;exploiter les technologies de pointe de TSMC en mati\u00e8re de processus et de \u00ab\u00a03DFabric\u00a0\u00bb afin d&rsquo;atteindre un niveau de performance et d&rsquo;efficacit\u00e9 \u00e9nerg\u00e9tique pour les applications d&rsquo;IA, de calcul \u00e0 haute performance (HPC) et mobiles de la prochaine g\u00e9n\u00e9ration.<\/p>\n<p>Ian Lankshear, DG d&rsquo;EnSilica, a comment\u00e9 : \u00ab L&rsquo;adh\u00e9sion au programme DCA de TSMC est une \u00e9tape importante pour EnSilica. Notre solide expertise en mati\u00e8re de conception de circuits signaux mixtes et de RF, associ\u00e9e \u00e0 la technologie de TSMC, nous permet de fournir des solutions innovantes \u00e0 nos clients. \u00bb<\/p>\n<p>Pour Dan Kochpatcharin, responsable de la division EAM chez TSMC,: \u00ab EnSilica au sein de l&rsquo;alliance TSMC OIP Design Center, fournit des services et des solutions \u00e0 valeur ajout\u00e9e pour la conception de semiconducteurs \u00e0 l&rsquo;aide des technologies de pointe de TSMC. \u00bb<\/p>\n<p><a href=\"https:\/\/www.ensilica.com\/\">EnSilica<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>EnSilica, fabricants anglais de puces\u00a0 ASIC \u00e0 signaux mixtes, a rejoint la Design Center Alliance (DCA) de TSMC Open Innovation Platform\u00ae (OIP). Le programme DCA de TSMC se concentre sur les services d&rsquo;impl\u00e9mentation de puces et sur l&rsquo;activation de solutions de conception au niveau du syst\u00e8me, afin de r\u00e9duire les difficult\u00e9s \u00e0 la conception pour [&hellip;]<\/p>\n","protected":false},"author":11,"featured_media":461001,"comment_status":"closed","ping_status":"closed","sticky":true,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[886],"tags":[6682,2541],"domains":[47],"ppma_author":[1143],"class_list":["post-460989","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news-fr","tag-asic-fr","tag-tsmc","domains-electronique-eci"],"acf":[],"yoast_head":"<title>EnSilica int\u00e8gre le Design Center Alliance de TSMC Open Innova...<\/title>\n<meta name=\"description\" content=\"EnSilica, fabricants anglais de puces\u00a0 ASIC \u00e0 signaux mixtes, a rejoint la Design Center Alliance (DCA) de TSMC Open Innovation Platform\u00ae (OIP). 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