{"id":460201,"date":"2024-09-10T09:37:09","date_gmt":"2024-09-10T07:37:09","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=460201"},"modified":"2024-09-10T09:37:09","modified_gmt":"2024-09-10T07:37:09","slug":"samsung-et-tsmc-sassocient-pour-la-dram-hbm4","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/samsung-et-tsmc-sassocient-pour-la-dram-hbm4\/","title":{"rendered":"Samsung et TSMC s&rsquo;associent pour la DRAM HBM4"},"content":{"rendered":"<h2>Selon le <em>Korea Economic Daily<\/em>, qui cite Dan Kochpatcharin, responsable de la gestion de l&rsquo;\u00e9cosyst\u00e8me et des alliances chez TSMC, Samsung et TSMC s&rsquo;associent pour produire une m\u00e9moire DRAM \u00e0 grande largeur de bande (HBM) sans m\u00e9moire tampon.<\/h2>\n<p>M. Kochpatcharin s&rsquo;exprimait la semaine derni\u00e8re lors du forum Semicon Taiwan 2024, a indiqu\u00e9 <em>KED<\/em>. Ce serait la premi\u00e8re fois que Samsung et TSMC s&rsquo;associent dans le domaine des m\u00e9moires.<\/p>\n<p>Le rapport ajoute qu&rsquo;un HBM4 sans m\u00e9moire tampon aura une efficacit\u00e9 \u00e9nerg\u00e9tique sup\u00e9rieure de 40 % et une latence inf\u00e9rieure de 10 % par rapport aux mod\u00e8les existants. La technologie HBM a \u00e9t\u00e9 largement adopt\u00e9e pour l&rsquo;informatique de l&rsquo;intelligence artificielle.<\/p>\n<p>Dans le domaine de la logique de fonderie, Samsung est en concurrence avec TSMC, mais la soci\u00e9t\u00e9 ta\u00efwanaise ne fabrique pas de DRAM. Toutefois, l&rsquo;adoption du packaging multi-die et du packaging avanc\u00e9 dit \u00ab\u00a0chiplet\u00a0\u00bb pour la collaboration en mati\u00e8re de processeurs d&rsquo;intelligence artificielle est en augmentation.<\/p>\n<p>SK Hynix, Samsung et Micron introduisent tous trois des DRAM HBM3E et pr\u00e9voient d&rsquo;introduire le format HBM4 en 2025. SK Hynix a r\u00e9cemment annonc\u00e9 son intention de d\u00e9velopper des produits aux performances 30 fois sup\u00e9rieures \u00e0 celles des m\u00e9moires DRAM \u00e0 large bande passante (HBM) et de proposer des produits sp\u00e9cifiques aux clients.<\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"2iIH9V0H2Q\"><p><a href=\"https:\/\/www.eenewseurope.com\/en\/sk-hynix-plans-30x-improvement-on-hbm-with-custom-variants\/\">SK Hynix plans 30x improvement on HBM with custom variants<\/a><\/p><\/blockquote>\n<p><iframe class=\"wp-embedded-content lazyload\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; visibility: hidden;\" title=\"&#8220;SK Hynix plans 30x improvement on HBM with custom variants&#8221; &#8212; eeNews Europe\" data-src=\"https:\/\/www.eenewseurope.com\/en\/sk-hynix-plans-30x-improvement-on-hbm-with-custom-variants\/embed\/#?secret=6Uxqz0RE5x#?secret=2iIH9V0H2Q\" data-secret=\"2iIH9V0H2Q\" width=\"500\" height=\"282\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" data-load-mode=\"1\"><\/iframe><\/p>\n<p>La collaboration entre Samsung et TSMC permettra de fournir des \u00ab\u00a0puces et des services personnalis\u00e9s\u00a0\u00bb demand\u00e9s par des clients tels que Nvidia et Google, a d\u00e9clar\u00e9 KED.<\/p>\n<p>Bien que Samsung soit capable de fournir des services HBM4 complets, y compris la production de m\u00e9moire, la fonderie et le packaging avanc\u00e9, elle esp\u00e8re tirer parti de la technologie de TSMC pour s&rsquo;assurer davantage de clients, selon les sources rapport\u00e9es par KED.<\/p>\n<p>Cette d\u00e9cision s&rsquo;inscrit dans le cadre des efforts d\u00e9ploy\u00e9s par Samsung pour lutter contre son rival SK Hynix, qui s&rsquo;est impos\u00e9 comme le principal fournisseur de HBM avec 53 % du march\u00e9, contre 35 % pour Samsung.<\/p>\n<h4>Liens et articles connexes :<\/h4>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/sk-hynix-plans-30x-improvement-on-hbm-with-custom-variants\/\">SK Hynix pr\u00e9voit d&rsquo;am\u00e9liorer de 30 fois la m\u00e9moire HBM avec des variantes personnalis\u00e9es <\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/jedec-preps-finalization-of-hbm4-standard\/\">Le JEDEC pr\u00e9pare la finalisation de la norme HBM4<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/samsung-denies-hbm-chips-have-failed-nvidia-tests\/\">Samsung nie que les puces HBM ont \u00e9chou\u00e9 aux tests de Nvidia<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Selon le Korea Economic Daily, qui cite Dan Kochpatcharin, responsable de la gestion de l&rsquo;\u00e9cosyst\u00e8me et des alliances chez TSMC, Samsung et TSMC s&rsquo;associent pour produire une m\u00e9moire DRAM \u00e0 grande largeur de bande (HBM) sans m\u00e9moire tampon. M. Kochpatcharin s&rsquo;exprimait la semaine derni\u00e8re lors du forum Semicon Taiwan 2024, a indiqu\u00e9 KED. Ce serait [&hellip;]<\/p>\n","protected":false},"author":40,"featured_media":454979,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[880],"tags":[2074,7420,4283,3744,2541],"domains":[47],"ppma_author":[3631,6199],"class_list":["post-460201","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites-economiques","tag-dram-2","tag-hbm4-fr","tag-memoire-fr","tag-samsung-fr","tag-tsmc","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Samsung et TSMC s&#039;associent pour la DRAM HBM4 ...<\/title>\n<meta name=\"description\" content=\"Selon le Korea Economic Daily, Samsung et TSMC s&#039;associent pour produire une m\u00e9moire DRAM HBM4 sans m\u00e9moire tampon.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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