{"id":460152,"date":"2024-09-09T16:03:28","date_gmt":"2024-09-09T14:03:28","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=460152"},"modified":"2024-09-09T16:04:17","modified_gmt":"2024-09-09T14:04:17","slug":"alliance-dans-les-substrats-en-verre-pour-les-puces-dia","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/","title":{"rendered":"Alliance dans les substrats en verre pour les puces d&rsquo;IA"},"content":{"rendered":"<h3>Une alliance d&rsquo;entreprises vise \u00e0 stimuler l&rsquo;utilisation de substrats en verre pour les puces et les chiplets d&rsquo;intelligence artificielle plus complexes.<\/h3>\n<p>L&rsquo;alliance E-Core est dirig\u00e9e par E&amp;R Engineering \u00e0 Ta\u00efwan et rassemble plus de 15 entreprises pour stimuler le d\u00e9veloppement de substrats en verre de grande taille.<\/p>\n<p>Avec la croissance rapide de la demande de puces d&rsquo;intelligence artificielle, de dispositifs de communication \u00e0 haute fr\u00e9quence et \u00e0 grande vitesse, les substrats en verre dans les technologies de packaging avanc\u00e9es deviennent de plus en plus importants. Par rapport \u00e0 l&rsquo;utilisation r\u00e9pandue des substrats en feuilles de cuivre, les substrats en verre offrent une plus grande densit\u00e9 de c\u00e2blage et de meilleures performances en mati\u00e8re de signaux. En outre, le verre offre une grande plan\u00e9it\u00e9 et peut supporter des temp\u00e9ratures et des tensions \u00e9lev\u00e9es, ce qui en fait un substitut id\u00e9al aux substrats traditionnels.<\/p>\n<p>Des entreprises telles qu&rsquo;<a href=\"https:\/\/www.eenewseurope.com\/en\/intel-tips-glass-substrate-for-chiplet-packaging\/\">Intel<\/a> ont \u00e9tudi\u00e9 les substrats en verre pour le packaging des puces et il existe <a href=\"https:\/\/www.eenewseurope.com\/en\/absolics-awarded-us75-million-chips-funds-for-glass-substrates\/\">aux \u00c9tats-Unis<\/a> un <a href=\"https:\/\/www.eenewseurope.com\/en\/absolics-awarded-us75-million-chips-funds-for-glass-substrates\/\">financement au titre de la loi CHIPS<\/a> pour le d\u00e9veloppement de substrats en verre.<\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"7TxmfYxG7W\"><p><a href=\"https:\/\/www.eenewseurope.com\/en\/intel-tips-glass-substrate-for-chiplet-packaging\/\">Intel tips glass substrate for chiplet packaging<\/a><\/p><\/blockquote>\n<p><iframe class=\"wp-embedded-content lazyload\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; visibility: hidden;\" title=\"&#8220;Intel tips glass substrate for chiplet packaging&#8221; &#8212; eeNews Europe\" data-src=\"https:\/\/www.eenewseurope.com\/en\/intel-tips-glass-substrate-for-chiplet-packaging\/embed\/#?secret=vONBE1y70L#?secret=7TxmfYxG7W\" data-secret=\"7TxmfYxG7W\" width=\"500\" height=\"282\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" data-load-mode=\"1\"><\/iframe><\/p>\n<p>Ces substrats en verre mesurent 515\u00d7510 mm et n\u00e9cessitent une m\u00e9tallisation du verre, un laminage ABF (Ajinomoto Build-up Film) et une d\u00e9coupe finale du substrat. Les \u00e9tapes cl\u00e9s de la m\u00e9tallisation du verre sont le TGV (Through-Glass Via), la gravure humide, l&rsquo;AOI (Automated Optical Inspection), la pulv\u00e9risation et la m\u00e9tallisation.<\/p>\n<p>L&rsquo;alliance E-Core comprend Manz AG et Scientech pour la gravure humide, ShyaWei Optronics pour l&rsquo;inspection optique AOI, Lincotec, STK, Skytech et Group Up pour la pulv\u00e9risation cathodique et l&rsquo;\u00e9quipement de laminage ABF, ainsi que d&rsquo;autres fournisseurs de composants cl\u00e9s tels que HIWIN, HIWIN Mikrosystem, Keyence Taiwan, Mirle Group, ACE PILLAR, CHD TECH et Coherent.<\/p>\n<p>L&rsquo;aspect critique de la technologie des substrats en verre est la premi\u00e8re \u00e9tape &#8211; la modification du verre par laser (TGV). Bien qu&rsquo;introduite il y a plus de dix ans, sa vitesse n&rsquo;a pas r\u00e9pondu aux exigences de la production de masse, n&rsquo;atteignant que 10 \u00e0 50 vias par seconde, ce qui a limit\u00e9 l&rsquo;impact des substrats en verre sur le march\u00e9.<\/p>\n<p>L&rsquo;alliance vise \u00e0 combiner l&rsquo;expertise et \u00e0 fournir des \u00e9quipements et des mat\u00e9riaux pour le packaging avanc\u00e9 de la prochaine g\u00e9n\u00e9ration avec des substrats en verre \u00e0 des clients nationaux et internationaux.<\/p>\n<p>Le syst\u00e8me TGV (Through-Glass Via) du Glass Core Flow mis au point par E&amp;R permet d&rsquo;obtenir jusqu&rsquo;\u00e0 8 000 vias par seconde pour les configurations matricielles ou de 600 \u00e0 1 000 vias par seconde pour les configurations al\u00e9atoires sur un substrat en verre. L&rsquo;entreprise affirme qu&rsquo;elle continuera \u00e0 diriger le d\u00e9veloppement de la technologie des substrats de verre \u00e0 Ta\u00efwan, \u00e0 optimiser les processus et \u00e0 collaborer avec un plus grand nombre de partenaires industriels pour atteindre l&rsquo;excellence.<\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"38Wp98zsCL\"><p><a href=\"https:\/\/www.eenewseurope.com\/en\/glass-substrate-factory-for-chiplet-packaging-coming-to-georgia\/\">Glass substrate factory for chiplet packaging coming to Georgia<\/a><\/p><\/blockquote>\n<p><iframe class=\"wp-embedded-content lazyload\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; visibility: hidden;\" title=\"&#8220;Glass substrate factory for chiplet packaging coming to Georgia&#8221; &#8212; eeNews Europe\" data-src=\"https:\/\/www.eenewseurope.com\/en\/glass-substrate-factory-for-chiplet-packaging-coming-to-georgia\/embed\/#?secret=Sgh9TRkHKj#?secret=38Wp98zsCL\" data-secret=\"38Wp98zsCL\" width=\"500\" height=\"282\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" data-load-mode=\"1\"><\/iframe><\/p>\n<p>E&amp;R travaille depuis cinq ans avec un client IDM nord-am\u00e9ricain pour d\u00e9velopper la technologie TGV de modification du verre par laser. L&rsquo;ann\u00e9e derni\u00e8re, le processus a pass\u00e9 la validation, E&amp;R ma\u00eetrisant la technologie avec une pr\u00e9cision de +\/- 5 \u03bcm, r\u00e9pondant \u00e0 la norme 3 sigma.<\/p>\n<p>Cela a enfin permis aux substrats en verre d&rsquo;\u00eatre produits en masse.<\/p>\n<p><a href=\"https:\/\/www.enr.com.tw\/\">https:\/\/www.enr.com.tw\/<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Une alliance d&rsquo;entreprises vise \u00e0 stimuler l&rsquo;utilisation de substrats en verre pour les puces et les chiplets d&rsquo;intelligence artificielle plus complexes. L&rsquo;alliance E-Core est dirig\u00e9e par E&amp;R Engineering \u00e0 Ta\u00efwan et rassemble plus de 15 entreprises pour stimuler le d\u00e9veloppement de substrats en verre de grande taille. Avec la croissance rapide de la demande de [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":460048,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[880],"tags":[7588],"domains":[47],"ppma_author":[3640],"class_list":["post-460152","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites-economiques","tag-substrats-en-verre","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Alliance dans les substrats en verre pour les puces d&#039;IA ...<\/title>\n<meta name=\"description\" content=\"L&#039;alliance d&#039;entreprises E-Core vise \u00e0 stimuler l&#039;utilisation de substrats en verre pour les puces et les chiplets d&#039;IA plus complexes.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/460152\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Alliance dans les substrats en verre pour les puces d&#039;IA\" \/>\n<meta property=\"og:description\" content=\"L&#039;alliance d&#039;entreprises E-Core vise \u00e0 stimuler l&#039;utilisation de substrats en verre pour les puces et les chiplets d&#039;IA plus complexes.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/460152\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2024-09-09T14:03:28+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2024-09-09T14:04:17+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2024\/09\/E_R_mastered_key_technology_achieving_8_000_vias_matrix_layouts-scaled.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1080\" \/>\n\t<meta property=\"og:image:height\" content=\"608\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Nick Flaherty\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"NicolasR\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/\"},\"author\":{\"name\":\"NicolasR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/78961bf5e4a331d3b8b2d58fdfef976c\"},\"headline\":\"Alliance dans les substrats en verre pour les puces d&rsquo;IA\",\"datePublished\":\"2024-09-09T14:03:28+00:00\",\"dateModified\":\"2024-09-09T14:04:17+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/\"},\"wordCount\":586,\"publisher\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\"},\"keywords\":[\"substrats en verre\"],\"articleSection\":[\"Actualit\u00e9s \u00e9conomiques\"],\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/\",\"url\":\"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/\",\"name\":\"Alliance dans les substrats en verre pour les puces d'IA -\",\"isPartOf\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\"},\"datePublished\":\"2024-09-09T14:03:28+00:00\",\"dateModified\":\"2024-09-09T14:04:17+00:00\",\"description\":\"L'alliance d'entreprises E-Core vise \u00e0 stimuler l'utilisation de substrats en verre pour les puces et les chiplets d'IA plus complexes.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.ecinews.fr\/fr\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Alliance dans les substrats en verre pour les puces d&rsquo;IA\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"name\":\"EENewsEurope\",\"description\":\"Just another WordPress site\",\"publisher\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\",\"name\":\"EENewsEurope\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"contentUrl\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"width\":283,\"height\":113,\"caption\":\"EENewsEurope\"},\"image\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/78961bf5e4a331d3b8b2d58fdfef976c\",\"name\":\"NicolasR\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/1113513d73c6c997fc7ac1ecedfff8d9\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/8c46107760468ab8a00c814c26c19ab4?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/8c46107760468ab8a00c814c26c19ab4?s=96&d=mm&r=g\",\"caption\":\"NicolasR\"}}]}<\/script>","yoast_head_json":{"title":"Alliance dans les substrats en verre pour les puces d'IA ...","description":"L'alliance d'entreprises E-Core vise \u00e0 stimuler l'utilisation de substrats en verre pour les puces et les chiplets d'IA plus complexes.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/460152\/","og_locale":"fr_FR","og_type":"article","og_title":"Alliance dans les substrats en verre pour les puces d'IA","og_description":"L'alliance d'entreprises E-Core vise \u00e0 stimuler l'utilisation de substrats en verre pour les puces et les chiplets d'IA plus complexes.","og_url":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/460152\/","og_site_name":"EENewsEurope","article_published_time":"2024-09-09T14:03:28+00:00","article_modified_time":"2024-09-09T14:04:17+00:00","og_image":[{"width":1080,"height":608,"url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2024\/09\/E_R_mastered_key_technology_achieving_8_000_vias_matrix_layouts-scaled.jpg","type":"image\/jpeg"}],"author":"Nick Flaherty","twitter_card":"summary_large_image","twitter_misc":{"Written by":"NicolasR","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/#article","isPartOf":{"@id":"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/"},"author":{"name":"NicolasR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/78961bf5e4a331d3b8b2d58fdfef976c"},"headline":"Alliance dans les substrats en verre pour les puces d&rsquo;IA","datePublished":"2024-09-09T14:03:28+00:00","dateModified":"2024-09-09T14:04:17+00:00","mainEntityOfPage":{"@id":"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/"},"wordCount":586,"publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"keywords":["substrats en verre"],"articleSection":["Actualit\u00e9s \u00e9conomiques"],"inLanguage":"fr-FR"},{"@type":"WebPage","@id":"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/","url":"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/","name":"Alliance dans les substrats en verre pour les puces d'IA -","isPartOf":{"@id":"https:\/\/www.eenewseurope.com\/en\/#website"},"datePublished":"2024-09-09T14:03:28+00:00","dateModified":"2024-09-09T14:04:17+00:00","description":"L'alliance d'entreprises E-Core vise \u00e0 stimuler l'utilisation de substrats en verre pour les puces et les chiplets d'IA plus complexes.","breadcrumb":{"@id":"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.ecinews.fr\/fr\/alliance-dans-les-substrats-en-verre-pour-les-puces-dia\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.ecinews.fr\/fr\/"},{"@type":"ListItem","position":2,"name":"Alliance dans les substrats en verre pour les puces d&rsquo;IA"}]},{"@type":"WebSite","@id":"https:\/\/www.eenewseurope.com\/en\/#website","url":"https:\/\/www.eenewseurope.com\/en\/","name":"EENewsEurope","description":"Just another WordPress site","publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"fr-FR"},{"@type":"Organization","@id":"https:\/\/www.eenewseurope.com\/en\/#organization","name":"EENewsEurope","url":"https:\/\/www.eenewseurope.com\/en\/","logo":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/","url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","contentUrl":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","width":283,"height":113,"caption":"EENewsEurope"},"image":{"@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/78961bf5e4a331d3b8b2d58fdfef976c","name":"NicolasR","image":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/1113513d73c6c997fc7ac1ecedfff8d9","url":"https:\/\/secure.gravatar.com\/avatar\/8c46107760468ab8a00c814c26c19ab4?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/8c46107760468ab8a00c814c26c19ab4?s=96&d=mm&r=g","caption":"NicolasR"}}]}},"authors":[{"term_id":3640,"user_id":0,"is_guest":1,"slug":"nick-flaherty","display_name":"Nick Flaherty","avatar_url":"https:\/\/secure.gravatar.com\/avatar\/?s=96&d=mm&r=g","0":null,"1":"","2":"","3":"","4":"","5":"","6":"","7":"","8":""}],"_links":{"self":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/460152"}],"collection":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/comments?post=460152"}],"version-history":[{"count":0,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/460152\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media\/460048"}],"wp:attachment":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media?parent=460152"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/categories?post=460152"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/tags?post=460152"},{"taxonomy":"domains","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/domains?post=460152"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/ppma_author?post=460152"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}