{"id":459806,"date":"2024-09-04T11:40:19","date_gmt":"2024-09-04T09:40:19","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=459806"},"modified":"2024-09-04T11:54:30","modified_gmt":"2024-09-04T09:54:30","slug":"lesia-demande-plus-de-fonds-via-un-european-chips-act-2-0","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/lesia-demande-plus-de-fonds-via-un-european-chips-act-2-0\/","title":{"rendered":"L&rsquo;ESIA demande plus de fonds via un European Chips Act 2.0"},"content":{"rendered":"<h2>L&rsquo;Association europ\u00e9enne de l&rsquo;industrie des semi-conducteurs (ESIA) a demand\u00e9 \u00e0 l&rsquo;Union europ\u00e9enne d&rsquo;\u00e9laborer un Chips Act 2.0 et d&rsquo;acc\u00e9l\u00e9rer la distribution des subventions et de cr\u00e9er un \u00ab\u00a0envoy\u00e9 pour les puces\u00a0\u00bb charg\u00e9 de d\u00e9fendre le secteur.<\/h2>\n<p>Selon une d\u00e9claration de l&rsquo;ESIA, la politique europ\u00e9enne en mati\u00e8re de puces devrait comprendre moins de restrictions \u00e0 l&rsquo;exportation, d&rsquo;apr\u00e8s un rapport de <em>Reuters.<\/em><\/p>\n<p>L&rsquo;ESIA repr\u00e9sente toutes les grandes entreprises europ\u00e9ennes de fabrication de puces &#8211; Infineon, NXP, ST et la soci\u00e9t\u00e9 d&rsquo;\u00e9quipement de fabrication de puces AMSL &#8211; ainsi que les instituts de recherche IMEC, Fraunhofer et CEA-Leti. Elle a appel\u00e9 \u00e0 un \u00ab\u00a0Chips Act 2.0 imm\u00e9diat\u00a0\u00bb.<\/p>\n<p>La premi\u00e8re loi de l&rsquo;Union europ\u00e9enne sur les puces \u00e9lectroniques est entr\u00e9e en vigueur en septembre 2023. Le plan \u00e9tait dot\u00e9 d&rsquo;un budget de 43 milliards d&rsquo;euros comprenant les fonds des gouvernements nationaux, mais avec l&rsquo;objectif de doubler la part de l&rsquo;Europe dans la fabrication mondiale de puces pour la porter \u00e0 20 % d&rsquo;ici \u00e0 2030.<\/p>\n<blockquote class=\"wp-embedded-content\" data-secret=\"ng6PMYCSWo\"><p><a href=\"https:\/\/www.eenewseurope.com\/en\/european-chips-act-amended-softened-approved\/\">European Chips Act amended, softened, approved<\/a><\/p><\/blockquote>\n<p><iframe class=\"wp-embedded-content lazyload\" sandbox=\"allow-scripts\" security=\"restricted\" style=\"position: absolute; visibility: hidden;\" title=\"&#8220;European Chips Act amended, softened, approved&#8221; &#8212; eeNews Europe\" data-src=\"https:\/\/www.eenewseurope.com\/en\/european-chips-act-amended-softened-approved\/embed\/#?secret=pJ7ENzqdbu#?secret=ng6PMYCSWo\" data-secret=\"ng6PMYCSWo\" width=\"500\" height=\"282\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" src=\"data:image\/svg+xml;base64,PHN2ZyB3aWR0aD0iMSIgaGVpZ2h0PSIxIiB4bWxucz0iaHR0cDovL3d3dy53My5vcmcvMjAwMC9zdmciPjwvc3ZnPg==\" data-load-mode=\"1\"><\/iframe><\/p>\n<p>Dans le cadre du premier European Chips Act, la Commission europ\u00e9enne a r\u00e9cemment approuv\u00e9 les plans allemands visant \u00e0 soutenir la construction et l&rsquo;exploitation d&rsquo;une usine de fabrication de wafers, dont le co\u00fbt est estim\u00e9 \u00e0 10 milliards d&rsquo;euros. Le premier coup de pioche a \u00e9t\u00e9 donn\u00e9 en ao\u00fbt pour European Semiconductor Manufacturing Co. (ESMC).<\/p>\n<p>Toutefois, un projet de 32 milliards de dollars US pr\u00e9vu par Intel pour ouvrir deux usines de fabrication de wafers \u00e0 Magdebourg, en Allemagne, pourrait \u00eatre menac\u00e9. Intel a commenc\u00e9 \u00e0 enregistrer des pertes et \u00e9tudie ses options strat\u00e9giques. Le calendrier de l&rsquo;implantation d&rsquo;Intel \u00e0 Dresde a d\u00e9j\u00e0 \u00e9t\u00e9 repouss\u00e9, les plans de production n&rsquo;\u00e9tant pas pr\u00e9vus avant quatre ou cinq ans, apr\u00e8s que l&rsquo;Union europ\u00e9enne ait donn\u00e9 son accord \u00e0 des subventions d&rsquo;environ 10 milliards de dollars US devant \u00eatre accord\u00e9es par le gouvernement allemand.<\/p>\n<p>Par ailleurs, ST et Globalfoundries ont convenu de collaborer \u00e0 la construction d&rsquo;une usine de fabrication de wafers subventionn\u00e9e pr\u00e8s de Grenoble.<\/p>\n<p>L&rsquo;ESIA a \u00e9galement critiqu\u00e9 le manque de soutien accord\u00e9 aux fabricants de puces qui se voient bloquer l&rsquo;acc\u00e8s aux march\u00e9s chinois pour un grand nombre de leurs produits.<\/p>\n<p>\u00ab\u00a0Une approche plus positive de la s\u00e9curit\u00e9 \u00e9conomique est n\u00e9cessaire, bas\u00e9e sur le soutien et les incitations, plut\u00f4t qu&rsquo;une approche d\u00e9fensive reposant sur des mesures restrictives et protectrices\u00a0\u00bb, a d\u00e9clar\u00e9 l&rsquo;ESIA cit\u00e9e par Reuters dans sa d\u00e9claration.<\/p>\n<h4>Liens et articles connexes :<\/h4>\n<p><a href=\"http:\/\/www.eusemiconductors.eu\">www.eusemiconductors.eu<\/a><\/p>\n<h4>Articles de presse :<\/h4>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/intel-considers-foundry-split-fab-cancellations\/\">Intel envisage une scission de la fonderie et des annulations d&rsquo;usines <\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/e5n-subsidy-approved-as-esmc-breaks-ground-for-dresden-fab\/\">Une subvention de 5 milliards d&rsquo;euros est approuv\u00e9e alors que l&rsquo;ESMC entame la construction de l&rsquo;usine de Dresde <\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/st-looks-at-joint-european-wafer-fab-with-globalfoundries\/\">ST envisage de cr\u00e9er une usine europ\u00e9enne de fabrication de plaquettes en commun avec GlobalFoundries<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>L&rsquo;Association europ\u00e9enne de l&rsquo;industrie des semi-conducteurs (ESIA) a demand\u00e9 \u00e0 l&rsquo;Union europ\u00e9enne d&rsquo;\u00e9laborer un Chips Act 2.0 et d&rsquo;acc\u00e9l\u00e9rer la distribution des subventions et de cr\u00e9er un \u00ab\u00a0envoy\u00e9 pour les puces\u00a0\u00bb charg\u00e9 de d\u00e9fendre le secteur. Selon une d\u00e9claration de l&rsquo;ESIA, la politique europ\u00e9enne en mati\u00e8re de puces devrait comprendre moins de restrictions \u00e0 l&rsquo;exportation, [&hellip;]<\/p>\n","protected":false},"author":40,"featured_media":275877,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[3669],"tags":[6011,7539,3544],"domains":[47],"ppma_author":[3631,6199],"class_list":["post-459806","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouvelles","tag-chips-act-fr","tag-esia-fr","tag-europe","domains-electronique-eci"],"acf":[],"yoast_head":"<title>L&#039;ESIA demande plus de fonds via un European Chips Act 2.0 ...<\/title>\n<meta name=\"description\" content=\"L&#039;ESIA a demand\u00e9 \u00e0 l&#039;UE de cr\u00e9er un European Chips Act 2.0 et de cr\u00e9er un &quot;envoy\u00e9 des puces&quot; pour d\u00e9fendre le secteur.\" 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