{"id":456561,"date":"2024-07-22T14:19:06","date_gmt":"2024-07-22T12:19:06","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=456561"},"modified":"2024-07-22T14:20:21","modified_gmt":"2024-07-22T12:20:21","slug":"tsmc-produit-a-titre-experimental-des-composants-2-nm-pour-apple","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/tsmc-produit-a-titre-experimental-des-composants-2-nm-pour-apple\/","title":{"rendered":"TSMC produit \u00e0 titre exp\u00e9rimental des composants 2 nm pour Apple"},"content":{"rendered":"<h2>Selon des informations en provenance de Ta\u00efwan, le principal fondeur de puces, TSMC, commencera cette semaine la production de puces fabriqu\u00e9es \u00e0 l&rsquo;aide de son process de fabrication \u00e0 2 nm.<\/h2>\n<p>Apple devrait \u00eatre le premier client et le flux de production comprendra \u00e9galement un packaging avanc\u00e9 pour assembler le processeur M5 destin\u00e9 \u00e0 \u00eatre utilis\u00e9 dans les ordinateurs Mac et les serveurs AI. Le processus se d\u00e9roulera dans l&rsquo;usine de fabrication de wafers Baoshan de TSMC \u00e0 Hsinchu, \u00e0 Ta\u00efwan. D&rsquo;autres rapports indiquent que les puces de 2 nm entrant en production pourraient \u00eatre utilis\u00e9es dans le prochain iPhone 17 d&rsquo;Apple.<\/p>\n<p>La production exp\u00e9rimentale devrait commencer au quatri\u00e8me trimestre de l&rsquo;ann\u00e9e 24, avant la production de masse en 2025. La d\u00e9cision de commencer la production plus t\u00f4t est consid\u00e9r\u00e9e comme faisant partie d&rsquo;un effort pour assurer de meilleurs rendements avant les besoins complets de ses clients.<\/p>\n<p>Apple aurait \u00e9galement r\u00e9serv\u00e9 la totalit\u00e9 de la capacit\u00e9 de production initiale de TSMC en 2 nm.<\/p>\n<p>TSMC devrait appliquer la technologie \u00ab\u00a0nanosheet gate-all-around\u00a0\u00bb (GAA) et introduire la technologie \u00ab\u00a0back-side power supply\u00a0\u00bb (BSPR) avec les puces \u00e0 2 nm.<\/p>\n<p>Au cours des 12 prochains mois, on devrait assister \u00e0 une concurrence intense entre Intel, Samsung et TSMC, qui essaieront tous d&rsquo;am\u00e9liorer leurs process de fabrication 2nm nominalement \u00e9quivalents. La vitesse \u00e0 laquelle chaque entreprise pourra am\u00e9liorer le rendement de production sera un indicateur cl\u00e9. Pour un nouveau process, le rendement commence g\u00e9n\u00e9ralement \u00e0 moins de 50 % et doit \u00eatre port\u00e9 \u00e0 80 ou 90 % le plus rapidement possible. La complexit\u00e9 des derniers proc\u00e9d\u00e9s de fabrication rend cette t\u00e2che de plus en plus difficile.<\/p>\n<h4>Liens et articles connexes :<\/h4>\n<p><a href=\"http:\/\/www.tsmc.com\">www.tsmc.com<\/a><\/p>\n<h4>Articles de presse :<\/h4>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/tsmc-agrees-to-build-third-arizona-fab-make-2nm-chips-in-us\/\">TSMC accepte de construire une troisi\u00e8me usine en Arizona et de fabriquer des puces de 2 nm aux \u00c9tats-Unis<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/applied-gets-copper-wiring-to-work-at-2nm-node\/\">Applied fait fonctionner le c\u00e2blage en cuivre sur le n\u0153ud de 2 nm <\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/samsung-unveils-2nm-and-4nm-process-nodes-ai-platform\/\">Samsung d\u00e9voile des n\u0153uds de traitement 2nm et 4nm, ainsi qu&rsquo;une plateforme d&rsquo;IA<\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/rapidus-expands-ibm-deal-to-cover-chiplet-packaging\/\">Rapidus \u00e9tend son accord avec IBM \u00e0 l&#8217;emballage des chiplets <\/a><\/p>\n<p><a href=\"https:\/\/www.eenewseurope.com\/en\/backside-power-key-to-intel-process\/\">Cl\u00e9 d&rsquo;alimentation arri\u00e8re pour le processus Intel 20A<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Selon des informations en provenance de Ta\u00efwan, le principal fondeur de puces, TSMC, commencera cette semaine la production de puces fabriqu\u00e9es \u00e0 l&rsquo;aide de son process de fabrication \u00e0 2 nm. Apple devrait \u00eatre le premier client et le flux de production comprendra \u00e9galement un packaging avanc\u00e9 pour assembler le processeur M5 destin\u00e9 \u00e0 \u00eatre [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":159215,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[880],"tags":[2159,3695,1558,2541],"domains":[47],"ppma_author":[3631],"class_list":["post-456561","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites-economiques","tag-2nm","tag-apple-fr","tag-semiconducteurs","tag-tsmc","domains-electronique-eci"],"acf":[],"yoast_head":"<title>TSMC produit \u00e0 titre exp\u00e9rimental des composants 2 nm pour Ap...<\/title>\n<meta name=\"description\" content=\"Le fondeur de puces TSMC commencera cette semaine la production de puces fabriqu\u00e9es \u00e0 l&#039;aide de son process de 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