{"id":453693,"date":"2024-06-14T09:24:12","date_gmt":"2024-06-14T07:24:12","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=453693"},"modified":"2024-06-14T09:24:12","modified_gmt":"2024-06-14T07:24:12","slug":"soitec-et-umc-sassocient-pour-les-premieres-puces-rf-soi-en-3d","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/soitec-et-umc-sassocient-pour-les-premieres-puces-rf-soi-en-3d\/","title":{"rendered":"Soitec et UMC s&rsquo;associent pour les premi\u00e8res puces RF-SOI en 3D"},"content":{"rendered":"<h3>Soitec, d\u00e9veloppeur fran\u00e7ais de substrats, travaille avec UMC sur la premi\u00e8re solution de circuit int\u00e9gr\u00e9 en 3D pour la technologie RF-SOI (Radio Frequency Silicon-on-Insulator) pour les conceptions 5G et ondes millim\u00e9triques.<\/h3>\n<p>La technologie 3D IC d&rsquo;UMC pour le RF-SOI utilise des substrats techniques de Soitec pour incorporer plus de modules frontaux RF dans un seul composant en empilant verticalement les wafers avec un collage de wafer \u00e0 wafer.<\/p>\n<p>Cette approche 3D RF-SOI r\u00e9duit la taille des puces de plus de 45 %, ce qui permet aux concepteurs d&rsquo;int\u00e9grer davantage de composants RF pour r\u00e9pondre aux exigences de la 5G en mati\u00e8re de largeur de bande, y compris le nouveau spectre pour les bandes d&rsquo;ondes millim\u00e9triques.<\/p>\n<p>Les substrats RF-SOI de Soitec offrent les performances m\u00e9caniques et \u00e9lectriques n\u00e9cessaires pour assurer la fabrication en grand volume de la solution d&rsquo;UMC sans d\u00e9gradation des performances RF. UMC \u00e0 Ta\u00efwan travaille avec ces substrats depuis 2013.<\/p>\n<ul>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/x-fab-and-soitec-team-upon-sic-wafers\/\">X-Fab et Soitec s&rsquo;associent pour les plaques de SiC<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/stmicroelectronics-and-soitec-cooperate-on-sic\/\">STMicroelectronics et Soitec coop\u00e8rent dans le domaine du SiC<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/soitec-expands-sic-and-soi-wafer-production-in-france\/\">Soitec \u00e9tend sa production de plaques de SiC et de SOI en France<\/a><\/li>\n<\/ul>\n<p>\u00ab\u00a0Nous sommes tr\u00e8s fiers de notre partenariat de longue date avec UMC, qui s&rsquo;\u00e9tend d\u00e9sormais au premier circuit int\u00e9gr\u00e9 3D pour RF-SOI de l&rsquo;industrie. L&rsquo;exp\u00e9rience et l&rsquo;expertise combin\u00e9es d&rsquo;UMC et de Soitec nous placent dans une position privil\u00e9gi\u00e9e pour stimuler l&rsquo;innovation et r\u00e9pondre aux d\u00e9fis futurs des frontaux RF \u00e0 faible consommation d&rsquo;\u00e9nergie et \u00e0 faible volume. En \u00e9tendant le domaine des solutions RF-SOI \u00e0 l&rsquo;int\u00e9gration 3D, les futurs smartphones s&rsquo;adapteront aux nouvelles bandes de fr\u00e9quences envisag\u00e9es pour l&rsquo;\u00e8re 5G-Advance et 6G, tout en faisant de la place pour les nouvelles fonctionnalit\u00e9s \u00e0 venir. Dans le m\u00eame temps, les futurs appareils XR et autres appareils IoT b\u00e9n\u00e9ficieront de frontaux RF compacts, offrant des d\u00e9bits de donn\u00e9es accrus tout en garantissant une consommation d&rsquo;\u00e9nergie efficace \u00ab\u00a0, d\u00e9clare Jean-Marc Le Meil, vice-pr\u00e9sident ex\u00e9cutif de la division Communications mobiles de Soitec.<\/p>\n<p>\u00ab\u00a0Soitec a \u00e9t\u00e9 un partenaire cl\u00e9 d&rsquo;UMC pour faire progresser les communications sans fil au fil des ans gr\u00e2ce \u00e0 ses substrats techniques de pointe. S&rsquo;appuyant sur notre solide partenariat avec Soitec, la solution innovante de circuits int\u00e9gr\u00e9s 3D d&rsquo;UMC pour le RF-SOI a suscit\u00e9 un vif int\u00e9r\u00eat de la part des clients qui cherchent \u00e0 int\u00e9grer davantage de composants RF dans les appareils sans fil compatibles avec la 5G sans faire de compromis sur le facteur de forme ou les performances. Nous sommes ravis de poursuivre notre collaboration avec Soitec pour cibler le march\u00e9 de la 5G mmWave et au-del\u00e0 \u00ab\u00a0, a d\u00e9clar\u00e9 Raj Verma, vice-pr\u00e9sident associ\u00e9 du d\u00e9veloppement technologique chez UMC.<\/p>\n<p>www.soitec.com <a href=\"http:\/\/www.soitec.com\">;<\/a> <a href=\"http:\/\/www.umc.com\">www.umc.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Soitec, d\u00e9veloppeur fran\u00e7ais de substrats, travaille avec UMC sur la premi\u00e8re solution de circuit int\u00e9gr\u00e9 en 3D pour la technologie RF-SOI (Radio Frequency Silicon-on-Insulator) pour les conceptions 5G et ondes millim\u00e9triques. La technologie 3D IC d&rsquo;UMC pour le RF-SOI utilise des substrats techniques de Soitec pour incorporer plus de modules frontaux RF dans un seul [&hellip;]<\/p>\n","protected":false},"author":34,"featured_media":453677,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[880],"tags":[2122,2123,6602],"domains":[47],"ppma_author":[1153,3640],"class_list":["post-453693","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites-economiques","tag-5g-fr-2","tag-6g-fr","tag-soitec","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Soitec et UMC s&#039;associent pour les premi\u00e8res puces RF-SOI en 3D ...<\/title>\n<meta name=\"description\" content=\"Soitec travaille avec UMC sur le premier CI 3D de l&#039;industrie pour la technologie RF-SOI, destin\u00e9 aux conceptions 5G et ondes millim\u00e9triques.\" \/>\n<meta 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