{"id":451619,"date":"2024-05-20T23:52:00","date_gmt":"2024-05-20T21:52:00","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=451619"},"modified":"2024-05-20T23:52:00","modified_gmt":"2024-05-20T21:52:00","slug":"tsmc-prevoit-un-procede-chiplet-pour-lautomobile-a-lhorizon-2025","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/tsmc-prevoit-un-procede-chiplet-pour-lautomobile-a-lhorizon-2025\/","title":{"rendered":"TSMC pr\u00e9voit un proc\u00e9d\u00e9 chiplet pour l’automobile \u00e0 l’horizon 2025"},"content":{"rendered":"

TSMC pr\u00e9voit des versions qualifi\u00e9es pour l’automobile de sa technologie 3D fabric chiplet d’ici \u00e0 la fin de 2025.<\/span><\/h3>\n

La technologie InFO-oS fanout prendra en charge plusieurs dispositifs SoC sur un substrat, avec le premier kit de conception de processus (PDK) chiplet automobile vers la fin de cette ann\u00e9e et le PDK complet au d\u00e9but de 2026.<\/p>\n

Le processus CoWoS-R prendra en charge les SOC avec une m\u00e9moire HBM haute performance via un module sur le substrat. Le PDK initial sera disponible sous peu et le PDK complet sera disponible au d\u00e9but de l’ann\u00e9e 2026.<\/p>\n

Les processus seront qualifi\u00e9s AEC Q100 Grade2 d’ici le quatri\u00e8me trimestre 25, a d\u00e9clar\u00e9 TSMC lors de son symposium europ\u00e9en sur la technologie qui s’est tenu il y a quelques jours.<\/p>\n

La plateforme CoWoS comprend le CoWoS-S, bas\u00e9 sur un module Si, le plus mature, et le CoWoS-L et R, bas\u00e9 sur un interposeur organique. Les processus automobiles s’appuient sur l’exp\u00e9rience acquise avec plus de 150 produits CoWoS pour plus de 25 clients d’ici \u00e0 la fin de l’ann\u00e9e.\"\"<\/p>\n

L’automobile est \u00e9galement un \u00e9l\u00e9ment cl\u00e9 pour l’entreprise commune ESMC fab, dont la construction d\u00e9butera dans le courant de l’ann\u00e9e et dont la production en s\u00e9rie commencera en 2027. L’ESMC est une collaboration strat\u00e9gique et un engagement de Bosch, Infineon, NXP et TSMC pour soutenir les clients europ\u00e9ens avec les technologies de processus N28 et N16.<\/p>\n

www.tsmc.com<\/a><\/p>\n

Suivre ECInews sur Google news<\/a><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

TSMC pr\u00e9voit des versions qualifi\u00e9es pour l’automobile de sa technologie 3D fabric chiplet d’ici \u00e0 la fin de 2025. La technologie InFO-oS fanout prendra en charge plusieurs dispositifs SoC sur un substrat, avec le premier kit de conception de processus (PDK) chiplet automobile vers la fin de cette ann\u00e9e et le PDK complet au d\u00e9but […]<\/p>\n","protected":false},"author":11,"featured_media":451262,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[1640,6319],"domains":[47],"ppma_author":[1143,3640],"class_list":["post-451619","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","tag-automobile","tag-production-et-processus","domains-electronique-eci"],"acf":[],"yoast_head":"TSMC pr\u00e9voit un proc\u00e9d\u00e9 chiplet pour l'automobile \u00e0 l'horiz...<\/title>\n<meta name=\"description\" content=\"TSMC pr\u00e9voit des versions qualifi\u00e9es pour l'automobile de ses technologies 3D fabric CoWoS et InFO chiplet 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