{"id":450223,"date":"2024-05-02T16:07:43","date_gmt":"2024-05-02T14:07:43","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=450223"},"modified":"2024-05-02T16:10:42","modified_gmt":"2024-05-02T14:10:42","slug":"dissipateurs-thermiques-pour-bga","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/dissipateurs-thermiques-pour-bga\/","title":{"rendered":"Dissipateurs thermiques pour BGA"},"content":{"rendered":"<h3><span style=\"font-size: 16px;\">Le groupe gestion thermique de CUI Devices a annonc\u00e9 l&rsquo;extension de sa gamme de dissipateurs thermiques pour BGA. <\/span><\/h3>\n<p>Compatible avec les dispositifs BGA (ball grid array), la famille HSB propose d\u00e9sormais des options de mat\u00e9riaux en aluminium et en cuivre, avec des finitions anodis\u00e9s purs ou noirs et des types de montage par adh\u00e9sif ou par vis sur circuit imprim\u00e9. Tous les mod\u00e8les de dissipateurs de chaleur BGA sont dimensionn\u00e9s selon quatre param\u00e8tres de r\u00e9sistance thermique, ce qui permet aux concepteurs de s\u00e9lectionner plus facilement le dissipateur le mieux adapt\u00e9 au syst\u00e8me de refroidissement souhait\u00e9 par convection naturelle ou par air forc\u00e9.<\/p>\n<p>La\u00a0 gamme de dissipateurs de chaleur BGA offre de formats allant de 8,5 x 8,5 mm \u00e0 69,7 x 69,7 mm avec des profils de 5 \u00e0 25 mm, et proposent en convection naturelle des r\u00e9sistances thermiques allant de 3,45 \u00e0 39,1\u00b0C\/W \u00e0 75\u00b0C et des puissances dissip\u00e9es allant de 1,92 \u00e0 21,74 W \u00e0 75\u00b0C.<\/p>\n<p><a href=\"https:\/\/www.cuidevices.com\/\">CUI Devices\u00a0<\/a> &#8211;\u00a0 <a href=\"https:\/\/www.cuidevices.com\/catalog\/thermal-management\/heat-sinks\/bga-heat-sinks\">Dissipateurs thermiques<\/a><\/p>\n<p><u><a href=\"https:\/\/news.google.com\/publications\/CAAqBwgKMJbcwQswuPfYAw?hl=fr&amp;gl=BE&amp;ceid=BE:fr\" target=\"news.google.com\" rel=\"noopener\">Suivre ECInews sur Google news<\/a><\/u><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Le groupe gestion thermique de CUI Devices a annonc\u00e9 l&rsquo;extension de sa gamme de dissipateurs thermiques pour BGA. Compatible avec les dispositifs BGA (ball grid array), la famille HSB propose d\u00e9sormais des options de mat\u00e9riaux en aluminium et en cuivre, avec des finitions anodis\u00e9s purs ou noirs et des types de montage par adh\u00e9sif ou [&hellip;]<\/p>\n","protected":false},"author":11,"featured_media":450273,"comment_status":"closed","ping_status":"closed","sticky":true,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[6290],"domains":[47],"ppma_author":[1143],"class_list":["post-450223","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","tag-dissipation-thermique","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Dissipateurs thermiques pour BGA ...<\/title>\n<meta name=\"description\" content=\"La\u00a0 gamme de dissipateurs de chaleur BGA offre de formats allant de 8,5 x 8,5 mm \u00e0 69,7 x 69,7 mm avec des profils de 5 \u00e0 25 mm\" \/>\n<meta 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