{"id":449076,"date":"2024-04-18T18:46:11","date_gmt":"2024-04-18T16:46:11","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=449076"},"modified":"2024-04-18T21:26:11","modified_gmt":"2024-04-18T19:26:11","slug":"octavo-double-le-systeme-sip-dans-lintegration-du-packaging","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/octavo-double-le-systeme-sip-dans-lintegration-du-packaging\/","title":{"rendered":"Octavo double son syst\u00e8me SiP dans un packaging int\u00e9gr\u00e9"},"content":{"rendered":"<h3>Octavo, pionnier du packaging avanc\u00e9, envisage de combiner deux de ses syst\u00e8mes pour renforcer l&rsquo;int\u00e9gration.<\/h3>\n<p>Octavo a d\u00e9velopp\u00e9 deux types de SiP pour le processeur STM32MP2 avec IA int\u00e9gr\u00e9e. L&rsquo;OSD32MP2-PM (module processeur) monte le processeur MP2 sur la DRAM DDR4 avec un encombrement de 9 x 14 mm. Le second utilise le processeur nu et la DRAM avec gestion de l&rsquo;\u00e9nergie dans un bo\u00eetier de 21 x 21 mm.<\/p>\n<ul>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/system-in-package-for-the-stm32mp2-embedded-ai-processor\/\">Syst\u00e8me en bo\u00eetier pour le processeur d&rsquo;intelligence artificielle embarqu\u00e9 STM32MP2<\/a><\/li>\n<\/ul>\n<p>La soci\u00e9t\u00e9 envisage de remplacer la DRAM et le processeur dans le module de 21 x 21 mm par le SiP MP, lib\u00e9rant ainsi l&rsquo;espace occup\u00e9 par le processeur ST. Cela pourrait \u00eatre utilis\u00e9 pour une puce sans fil, un FPGA pour une puce de gestion de l&rsquo;\u00e9nergie, explique Erik Walsh, directeur technique d&rsquo;Octavo.<\/p>\n<p>\u00ab\u00a0Il s&rsquo;agit d&rsquo;une nouvelle architecture\u00a0\u00bb, explique M. Walsh \u00e0 eeNews Europe. \u00ab\u00a0Le circuit int\u00e9gr\u00e9 laisse un grand espace et nous \u00e9tudions ce que nous pouvons y faire.<\/p>\n<p>Des \u00e9chantillons de l&rsquo;OSD32MP2-PM seront disponibles \u00e0 la fin de 2024, et les \u00e9chantillons de l&rsquo;OSD32MP2 suivront au d\u00e9but de 2025, de sorte que tout d\u00e9veloppement se fera apr\u00e8s cela, mais la soci\u00e9t\u00e9 cherche \u00e0 standardiser l&#8217;empreinte de 21 x 21 mm.<\/p>\n<p><a href=\"http:\/\/www.octavo.com\">www.octavo.com<\/a><\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Octavo, pionnier du packaging avanc\u00e9, envisage de combiner deux de ses syst\u00e8mes pour renforcer l&rsquo;int\u00e9gration. Octavo a d\u00e9velopp\u00e9 deux types de SiP pour le processeur STM32MP2 avec IA int\u00e9gr\u00e9e. L&rsquo;OSD32MP2-PM (module processeur) monte le processeur MP2 sur la DRAM DDR4 avec un encombrement de 9 x 14 mm. Le second utilise le processeur nu et [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":449058,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[3679,906,2280],"domains":[47],"ppma_author":[3640],"class_list":["post-449076","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","tag-ai-fr","tag-mpus-mcus-fr","tag-sip-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Octavo double son syst\u00e8me SiP dans un packaging int\u00e9gr\u00e9 ...<\/title>\n<meta name=\"description\" content=\"Octavo cherche \u00e0 combiner deux de ses syst\u00e8mes en bo\u00eetier SiP afin d&#039;am\u00e9liorer l&#039;int\u00e9gration dans une empreinte standard de 21 x 21 mm.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link 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