{"id":445168,"date":"2024-03-02T08:36:25","date_gmt":"2024-03-02T07:36:25","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=445168"},"modified":"2024-03-02T08:37:26","modified_gmt":"2024-03-02T07:37:26","slug":"sk-hynix-a-deja-epuise-toutes-ses-dram-hbm-pour-2024","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/sk-hynix-a-deja-epuise-toutes-ses-dram-hbm-pour-2024\/","title":{"rendered":"SK Hynix a d\u00e9j\u00e0 \u00e9puis\u00e9 toutes ses DRAM HBM pour 2024"},"content":{"rendered":"

Selon un cadre sup\u00e9rieur, SK Hynix a \u00e9puis\u00e9 ses stocks de DRAM au format HBM (m\u00e9moire \u00e0 grande largeur de bande) utilis\u00e9e dans les processeurs d’intelligence artificielle pour les centres de donn\u00e9es pour l’ensemble de l’ann\u00e9e 2024.<\/h2>\n

\u00ab\u00a0Le volume de production de HBM pr\u00e9vu cette ann\u00e9e est d\u00e9j\u00e0 \u00e9puis\u00e9\u00a0\u00bb, a d\u00e9clar\u00e9 Kitae Kim, r\u00e9cemment nomm\u00e9 vice-pr\u00e9sident et responsable des ventes et du marketing de HBM, dans une interview publi\u00e9e sur le site web de SK Hynix le 21 f\u00e9vrier.<\/p>\n

Le manque de puces aux formats HBM3 et HBM3E pourrait limiter la croissance des parties m\u00e9moire et logique de l’industrie des semiconducteurs en 2024.<\/p>\n

HBM est un produit bas\u00e9 sur la DRAM qui permet d’atteindre des vitesses de traitement des donn\u00e9es plus \u00e9lev\u00e9es que les DRAM \u00e0 plan unique en connectant verticalement plusieurs DRAM avec des via \u00e0 travers le silicium (TSV) et des bumps. Il existe cinq g\u00e9n\u00e9rations de HBM, \u00e0 commencer par le HBM original, suivi du HBM2, du HBM2E, du HBM3 et du HBM3E – une version \u00e9tendue du HBM3.<\/p>\n

Il convient de noter que M. Kim a parl\u00e9 de \u00ab\u00a0production planifi\u00e9e\u00a0\u00bb, de sorte que l’entreprise s’efforce sans doute de mettre en place des capacit\u00e9s suppl\u00e9mentaires. Toutefois, la complexit\u00e9 du composant multi-fili\u00e8re empil\u00e9, \u00e0 la pointe de la technologie, rend une telle \u00e9volution presque impossible \u00e0 court terme.<\/p>\n

En 2022, les trois principaux fournisseurs de m\u00e9moire \u00e0 large bande (HBM) \u00e9taient SK Hynix (50 %), Samsung (40 %) et Micron (10 %), selon les estimations de l’analyste de march\u00e9 TrendForce. En tant que seul fabricant \u00e0 proposer le HBM3 en 2023, SK Hynix devrait avoir consid\u00e9rablement renforc\u00e9 son avance.<\/p>\n

Micron a choisi de ne pas produire de m\u00e9moires au format HBM3 et de passer directement au format HBM3E, qu’il a commenc\u00e9 \u00e0 fabriquer en volume (voir Micron commence \u00e0 produire une \u00ab\u00a0meilleure\u00a0\u00bb m\u00e9moire HBM3E<\/a>).<\/p>\n

Samsung a annonc\u00e9 une DRAM HBM3E 12-high d’une capacit\u00e9 de 36 Gbyte qui a commenc\u00e9 \u00e0 \u00eatre \u00e9chantillonn\u00e9e pour les clients et dont la production de masse est pr\u00e9vue pour le premier semestre de l’ann\u00e9e 24. SK Hynix devrait \u00e9galement commencer \u00e0 produire en masse des m\u00e9moires HBM3E au cours du premier semestre de l’ann\u00e9e 24.<\/p>\n

\u00ab\u00a0Bien que 2024 vienne juste de commencer, nous avons d\u00e9j\u00e0 commenc\u00e9 \u00e0 pr\u00e9parer 2025 pour rester en t\u00eate du march\u00e9.\u00a0\u00bb<\/p>\n

Liens et articles connexes :<\/h4>\n

www.skhynix.com<\/a><\/p>\n

Articles de presse :<\/h4>\n

Micron lance la production d’une \u00ab\u00a0meilleure\u00a0\u00bb m\u00e9moire HBM3E<\/a><\/p>\n

Samsung passe \u00e0 la vitesse sup\u00e9rieure avec une DRAM HBM3E de 36 gigaoctets<\/a><\/p>\n

SK Hynix rebondit sur la demande en mati\u00e8re d’IA <\/a><\/p>\n

CES 2024 : SK hynix pr\u00e9sentera des produits de m\u00e9moire de pointe pour l’IA<\/a><\/p>\n

Les puces d’acc\u00e9l\u00e9ration de l’IA renforcent la m\u00e9moire \u00e0 large bande passante<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Selon un cadre sup\u00e9rieur, SK Hynix a \u00e9puis\u00e9 ses stocks de DRAM au format HBM (m\u00e9moire \u00e0 grande largeur de bande) utilis\u00e9e dans les processeurs d’intelligence artificielle pour les centres de donn\u00e9es pour l’ensemble de l’ann\u00e9e 2024. \u00ab\u00a0Le volume de production de HBM pr\u00e9vu cette ann\u00e9e est d\u00e9j\u00e0 \u00e9puis\u00e9\u00a0\u00bb, a d\u00e9clar\u00e9 Kitae Kim, r\u00e9cemment nomm\u00e9 […]<\/p>\n","protected":false},"author":34,"featured_media":444827,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[880,3669],"tags":[2074,5945,2198],"domains":[47],"ppma_author":[3631,1153],"class_list":["post-445168","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites-economiques","category-nouvelles","tag-dram-2","tag-hbm-fr","tag-ia","domains-electronique-eci"],"acf":[],"yoast_head":"SK Hynix a "\u00e9puis\u00e9" ses DRAM HBM pour 2024 ...<\/title>\n<meta name=\"description\" content=\"SK Hynix a \u00e9puis\u00e9 ses stocks de DRAM au format HBM utilis\u00e9s dans les processeurs d'IA pour les centres de donn\u00e9es pour l'ann\u00e9e 2024.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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