{"id":443590,"date":"2024-02-12T10:05:09","date_gmt":"2024-02-12T09:05:09","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=443590"},"modified":"2024-02-12T10:07:21","modified_gmt":"2024-02-12T09:07:21","slug":"nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/","title":{"rendered":"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU"},"content":{"rendered":"

Selon un rapport ta\u00efwanais, Nvidia, fournisseur de puces GPU pour l’IA, ne peut obtenir suffisamment de de services de packaging avanc\u00e9s de son principal fondeur, TSMC, et se tourne vers Intel pour obtenir de l’aide.<\/h2>\n

Le site d’information en langue chinoise United Daily News<\/em> a rapport\u00e9 que Nvidia ajoutera Intel \u00e0 sa liste de fournisseurs pour fournir des services de packaging avanc\u00e9s, avec une capacit\u00e9 de production mensuelle d’environ 5 000 pi\u00e8ces. Selon le rapport, Intel commencera \u00e0 fournir ses produits au plus t\u00f4t au deuxi\u00e8me trimestre de l’ann\u00e9e 24.<\/p>\n

Toutefois, la contribution d’Intel n’augmentera la capacit\u00e9 totale de production de packaging avanc\u00e9s de Nvidia que de moins de 10 %. Il est donc probable que l’offre de puces d’IA reste limit\u00e9e. La capacit\u00e9 de production mensuelle de TSMC devrait \u00eatre de 50 000 pi\u00e8ces, contre 40 000 en d\u00e9cembre 2023.<\/p>\n

Jusqu’\u00e0 pr\u00e9sent, Nvidia n’a pas utilis\u00e9 Intel comme fonderie pour sa production de puces et de chiplets avanc\u00e9s, mais Intel esp\u00e8re que l’obtention de Nvidia comme client pour le packaging pourrait ouvrir des opportunit\u00e9s \u00e0 l’avenir.<\/p>\n

Ouverture de l’usine de packaging Intel<\/h4>\n

En janvier 2024, Intel a officiellement ouvert une usine \u00e0 Rio Rancho, au Nouveau-Mexique, d\u00e9di\u00e9e \u00e0 la fabrication de technologies avanc\u00e9es de packaging de semiconducteurs, y compris sa technologie de packaging 3D Foveros.<\/p>\n

Cette ouverture s’inscrit dans le cadre d’un investissement de 3,5 milliards de dollars annonc\u00e9 pr\u00e9c\u00e9demment dans la fabrication de packaging de semiconducteurs avanc\u00e9s. Foveros permet \u00e0 un composant d’inclure plusieurs puces optimis\u00e9es individuellement en termes de puissance, de performance et de co\u00fbt.<\/p>\n

\u00ab\u00a0Aujourd’hui, nous c\u00e9l\u00e9brons l’ouverture des premi\u00e8res activit\u00e9s d’Intel dans le domaine des semi-conducteurs \u00e0 haut volume et de la seule usine am\u00e9ricaine produisant \u00e0 grande \u00e9chelle les solutions de packaging les plus avanc\u00e9es au monde. Cette technologie de pointe distingue Intel et donne \u00e0 nos clients de r\u00e9els avantages en termes de performance, de facteur de forme et de flexibilit\u00e9 dans les applications de conception, le tout au sein d’une cha\u00eene d’approvisionnement r\u00e9siliente\u00a0\u00bb, a d\u00e9clar\u00e9 \u00e0 l’\u00e9poque Keyvan Esfarjani, directeur des op\u00e9rations mondiales chez Intel.<\/p>\n

Liens et articles connexes :<\/h4>\n

Article du United Daily News<\/a><\/em><\/p>\n

www.nvidia.com<\/a><\/p>\n

www.intel.com<\/a><\/p>\n

Articles de presse :<\/h4>\n

Selon TSMC, l’IA sera le moteur d’une forte croissance du march\u00e9 des puces en 2024<\/a><\/p>\n

Gartner diff\u00e8re des autres analystes sur l’importance de Nvidia <\/a><\/p>\n

Des chercheurs chinois font \u00e9tat d’un processeur \u00e0 256 c\u0153urs bas\u00e9 sur des chiplets<\/a><\/p>\n

AMD lance le MI300 et revendique une longueur d’avance sur Nvidia en mati\u00e8re de performances d’IA<\/a><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Selon un rapport ta\u00efwanais, Nvidia, fournisseur de puces GPU pour l’IA, ne peut obtenir suffisamment de de services de packaging avanc\u00e9s de son principal fondeur, TSMC, et se tourne vers Intel pour obtenir de l’aide. Le site d’information en langue chinoise United Daily News a rapport\u00e9 que Nvidia ajoutera Intel \u00e0 sa liste de fournisseurs […]<\/p>\n","protected":false},"author":34,"featured_media":443011,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[880],"tags":[3950,2721,3951,4166],"domains":[47],"ppma_author":[1153,3631],"class_list":["post-443590","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites-economiques","tag-gpu-fr","tag-intel-fr","tag-nvidia-fr","tag-packaging-fr","domains-electronique-eci"],"acf":[],"yoast_head":"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU ...<\/title>\n<meta name=\"description\" content=\"Nvidia, fournisseur de puces GPU pour l'IA, ne peut obtenir suffisamment de packaging avanc\u00e9 de TSMC, et se tourne vers Intel.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/443590\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU\" \/>\n<meta property=\"og:description\" content=\"Nvidia, fournisseur de puces GPU pour l'IA, ne peut obtenir suffisamment de packaging avanc\u00e9 de TSMC, et se tourne vers Intel.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/443590\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2024-02-12T09:05:09+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2024-02-12T09:07:21+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2024\/02\/Intel-New-Mexico-Fabs-1-scaled.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1080\" \/>\n\t<meta property=\"og:image:height\" content=\"608\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"A Delapalisse, Peter Clarke\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"A Delapalisse\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/\"},\"author\":{\"name\":\"A Delapalisse\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#\/schema\/person\/0aa2cfb0bd8949724a68cbac8d8321b4\"},\"headline\":\"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU\",\"datePublished\":\"2024-02-12T09:05:09+00:00\",\"dateModified\":\"2024-02-12T09:07:21+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/\"},\"wordCount\":466,\"publisher\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#organization\"},\"keywords\":[\"GPU\",\"Intel\",\"Nvidia\",\"Packaging\"],\"articleSection\":[\"Actualit\u00e9s \u00e9conomiques\"],\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/\",\"url\":\"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/\",\"name\":\"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU\",\"isPartOf\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#website\"},\"datePublished\":\"2024-02-12T09:05:09+00:00\",\"dateModified\":\"2024-02-12T09:07:21+00:00\",\"description\":\"Nvidia, fournisseur de puces GPU pour l'IA, ne peut obtenir suffisamment de packaging avanc\u00e9 de TSMC, et se tourne vers Intel.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.ecinews.fr\/fr\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#website\",\"url\":\"https:\/\/www.ecinews.fr\/fr\/\",\"name\":\"EENewsEurope\",\"description\":\"Just another WordPress site\",\"publisher\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.ecinews.fr\/fr\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#organization\",\"name\":\"EENewsEurope\",\"url\":\"https:\/\/www.ecinews.fr\/fr\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"contentUrl\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"width\":283,\"height\":113,\"caption\":\"EENewsEurope\"},\"image\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#\/schema\/person\/0aa2cfb0bd8949724a68cbac8d8321b4\",\"name\":\"A Delapalisse\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#\/schema\/person\/image\/211ac42237c2e9683c0964086c393cb4\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/ad45a8c5da24bc9c7c4940dd1c48a695?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/ad45a8c5da24bc9c7c4940dd1c48a695?s=96&d=mm&r=g\",\"caption\":\"A Delapalisse\"},\"sameAs\":[\"http:\/\/ECI\"]}]}<\/script>","yoast_head_json":{"title":"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU ...","description":"Nvidia, fournisseur de puces GPU pour l'IA, ne peut obtenir suffisamment de packaging avanc\u00e9 de TSMC, et se tourne vers Intel.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/443590\/","og_locale":"fr_FR","og_type":"article","og_title":"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU","og_description":"Nvidia, fournisseur de puces GPU pour l'IA, ne peut obtenir suffisamment de packaging avanc\u00e9 de TSMC, et se tourne vers Intel.","og_url":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/443590\/","og_site_name":"EENewsEurope","article_published_time":"2024-02-12T09:05:09+00:00","article_modified_time":"2024-02-12T09:07:21+00:00","og_image":[{"width":1080,"height":608,"url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2024\/02\/Intel-New-Mexico-Fabs-1-scaled.jpg","type":"image\/jpeg"}],"author":"A Delapalisse, Peter Clarke","twitter_card":"summary_large_image","twitter_misc":{"Written by":"A Delapalisse","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/#article","isPartOf":{"@id":"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/"},"author":{"name":"A Delapalisse","@id":"https:\/\/www.ecinews.fr\/fr\/#\/schema\/person\/0aa2cfb0bd8949724a68cbac8d8321b4"},"headline":"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU","datePublished":"2024-02-12T09:05:09+00:00","dateModified":"2024-02-12T09:07:21+00:00","mainEntityOfPage":{"@id":"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/"},"wordCount":466,"publisher":{"@id":"https:\/\/www.ecinews.fr\/fr\/#organization"},"keywords":["GPU","Intel","Nvidia","Packaging"],"articleSection":["Actualit\u00e9s \u00e9conomiques"],"inLanguage":"fr-FR"},{"@type":"WebPage","@id":"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/","url":"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/","name":"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU","isPartOf":{"@id":"https:\/\/www.ecinews.fr\/fr\/#website"},"datePublished":"2024-02-12T09:05:09+00:00","dateModified":"2024-02-12T09:07:21+00:00","description":"Nvidia, fournisseur de puces GPU pour l'IA, ne peut obtenir suffisamment de packaging avanc\u00e9 de TSMC, et se tourne vers Intel.","breadcrumb":{"@id":"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.ecinews.fr\/fr\/nvidia-ferait-appel-a-intel-pour-le-packaging-de-ses-gpu\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.ecinews.fr\/fr\/"},{"@type":"ListItem","position":2,"name":"Nvidia ferait appel \u00e0 Intel pour le packaging de ses GPU"}]},{"@type":"WebSite","@id":"https:\/\/www.ecinews.fr\/fr\/#website","url":"https:\/\/www.ecinews.fr\/fr\/","name":"EENewsEurope","description":"Just another WordPress site","publisher":{"@id":"https:\/\/www.ecinews.fr\/fr\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.ecinews.fr\/fr\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"fr-FR"},{"@type":"Organization","@id":"https:\/\/www.ecinews.fr\/fr\/#organization","name":"EENewsEurope","url":"https:\/\/www.ecinews.fr\/fr\/","logo":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.ecinews.fr\/fr\/#\/schema\/logo\/image\/","url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","contentUrl":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","width":283,"height":113,"caption":"EENewsEurope"},"image":{"@id":"https:\/\/www.ecinews.fr\/fr\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.ecinews.fr\/fr\/#\/schema\/person\/0aa2cfb0bd8949724a68cbac8d8321b4","name":"A Delapalisse","image":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.ecinews.fr\/fr\/#\/schema\/person\/image\/211ac42237c2e9683c0964086c393cb4","url":"https:\/\/secure.gravatar.com\/avatar\/ad45a8c5da24bc9c7c4940dd1c48a695?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/ad45a8c5da24bc9c7c4940dd1c48a695?s=96&d=mm&r=g","caption":"A Delapalisse"},"sameAs":["http:\/\/ECI"]}]}},"authors":[{"term_id":1153,"user_id":34,"is_guest":0,"slug":"adelapalisse","display_name":"A Delapalisse","avatar_url":"https:\/\/secure.gravatar.com\/avatar\/ad45a8c5da24bc9c7c4940dd1c48a695?s=96&d=mm&r=g","0":null,"1":"","2":"","3":"","4":"","5":"","6":"","7":"","8":""},{"term_id":3631,"user_id":0,"is_guest":1,"slug":"peter-clarke","display_name":"Peter Clarke","avatar_url":"https:\/\/secure.gravatar.com\/avatar\/?s=96&d=mm&r=g","0":null,"1":"","2":"","3":"","4":"","5":"","6":"","7":"","8":""}],"_links":{"self":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/443590"}],"collection":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/users\/34"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/comments?post=443590"}],"version-history":[{"count":0,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/443590\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media\/443011"}],"wp:attachment":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media?parent=443590"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/categories?post=443590"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/tags?post=443590"},{"taxonomy":"domains","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/domains?post=443590"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/ppma_author?post=443590"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}