{"id":418667,"date":"2023-04-10T18:29:36","date_gmt":"2023-04-10T16:29:36","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=418667"},"modified":"2023-04-10T20:56:27","modified_gmt":"2023-04-10T18:56:27","slug":"rapidus-obtient-us2-3-milliards-pour-sa-wafer-fab-2nm","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/rapidus-obtient-us2-3-milliards-pour-sa-wafer-fab-2nm\/","title":{"rendered":"Rapidus obtient US$2.3 milliards pour sa wafer fab 2nm"},"content":{"rendered":"

Selon le Hokkaido Shimbun, le minist\u00e8re japonais de l’\u00c9conomie, du Commerce et de l’Industrie (METI) est en train de finaliser ses plans pour fournir \u00e0 Rapidus Co. Ltd. environ 2,3 milliards de dollars pour construire une fab de wafers sur l’\u00eele d’Hokkaido.<\/span><\/span><\/span><\/h2>\n

\u00a0Le journal local a cit\u00e9 des responsables du METI comme sources.<\/span><\/span> \u00ab\u00a0Nous soutiendrons le d\u00e9veloppement de la ligne de prototypes que la soci\u00e9t\u00e9 pr\u00e9voit de commencer \u00e0 exploiter en 2025\u00a0\u00bb, a d\u00e9clar\u00e9 l’un d’eux cit\u00e9 par le journal.<\/span><\/span><\/span><\/p>\n

Rapidus (Tokyo, Japon) est une fonderie de composants logique nouvellement cr\u00e9\u00e9e qui, selon le gouvernement japonais, pourra aider le pays \u00e0 se remettre dans la fabrication de puces avanc\u00e9es.<\/span><\/span> La soci\u00e9t\u00e9 vise une production \u00e0 2 nm et a annonc\u00e9 la s\u00e9lection de Chitose City, pr\u00e8s de Sapporo sur l’\u00eele d’Hokkaido, comme emplacement pour sa fab de wafers en f\u00e9vrier 2023 (voir Rapidus s\u00e9lectionne Hokkaido pour le site de fabrication de plaquettes de 2 nm).<\/span><\/span> Rapidus travaille avec IBM et l’institut de recherche IMEC pour d\u00e9velopper une capacit\u00e9 logique ind\u00e9pendante de 2 nm (Rapidus selects Hokkaido for 2nm wafer fab site)<\/a><\/span><\/span><\/span><\/p>\n

Rapidus travaille avec IBM et l’institut de recherche IMEC en Belgique pour d\u00e9velopper une capacit\u00e9 de fabrication de composants logiques ind\u00e9pendante avec une technologie 2 nm (voir Japan’s 2nm hope Rapidus, joins IMEC’s ‘Core’ research program<\/a> <\/span><\/span><\/span><\/p>\n

Deux phases distinctes dans le d\u00e9veloppement
\n<\/span><\/span><\/span><\/strong><\/p>\n

La soci\u00e9t\u00e9 a d\u00e9clar\u00e9 qu’elle pr\u00e9voyait de mettre en place une cha\u00eene de production prototype en 2025, puis d’entrer dans la production de masse \u00e0 la fin des ann\u00e9es 2020.<\/span><\/span> Le projet de fabrication de wafers devrait co\u00fbter jusqu’\u00e0 5 000 milliards de yens (environ 37 milliards de dollars).<\/span><\/span> <\/span><\/p>\n

Atsuyoshi Koike, PDG de Rapidus, a d\u00e9clar\u00e9 que la fab de wafers devrait occuper un site de plusieurs dizaines d’hectares.<\/span><\/span> Il a d\u00e9clar\u00e9 que la soci\u00e9t\u00e9 aurait besoin de 2 000 milliards de yens pour la recherche et le d\u00e9veloppement avant de pouvoir commencer la production d’essai, puis de 3 000 milliards de yens pour commencer \u00e0 produire en masse des semiconducteurs.<\/span><\/span><\/span><\/p>\n

Rapidus a \u00e9t\u00e9 form\u00e9 par un consortium de huit soci\u00e9t\u00e9s japonaises – dont Toyota, Sony, NEC, Kioxia et SoftBank – avec un financement initial de 7,3 milliards de yens (environ 51,5 millions de dollars) pour cr\u00e9er la soci\u00e9t\u00e9.<\/span><\/span> Rapidus s’est \u00e9galement vu promettre 70 milliards de yens (environ 490 millions de dollars) de subventions pour soutenir le travail avec IBM pour d\u00e9velopper des puces 2 nm.<\/span><\/span><\/span><\/p>\n

 <\/p>\n

Related links and articles:<\/h4>\n

www.rapidus.inc<\/a><\/p>\n

News articles:<\/h4>\n

Japan’s 2nm hope Rapidus, joins IMEC’s ‘Core’ research program<\/a><\/p>\n

Rapidus selects Hokkaido for 2nm wafer fab site<\/a><\/p>\n

Rapidus seeks billions of dollars to use IBM\u2019s 2nm process<\/a><\/p>\n

Consortium forms Rapidus to get Japan back into chip race at 2nm<\/a><\/p>\n

Japan, US make plans for independent 2nm production<\/a><\/p>\n

IBM announces 2nm chip, and manufacturing process<\/a><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Selon le Hokkaido Shimbun, le METI est en train de finaliser ses plans pour fournir \u00e0 Rapidus Co. Ltd. environ 2,3 milliards de dollars pour construire une fab de wafers sur l’\u00eele d’Hokkaido.<\/p>\n","protected":false},"author":34,"featured_media":401959,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[880,883],"tags":[3251,1558,2421],"domains":[47],"ppma_author":[1153,1136],"class_list":["post-418667","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites-economiques","category-technologies","tag-imec","tag-semiconducteurs","tag-wafer-fabs","domains-electronique-eci"],"acf":[],"yoast_head":"Rapidus obtient US$2.3 milliards pour sa wafer fab 2nm ...<\/title>\n<meta name=\"description\" content=\"Selon le Hokkaido Shimbun, le METI a finalis\u00e9 ses plans pour fournir \u00e0 Rapidus Co. 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