{"id":406910,"date":"2022-11-28T19:15:31","date_gmt":"2022-11-28T18:15:31","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=406910"},"modified":"2022-11-29T09:48:28","modified_gmt":"2022-11-29T08:48:28","slug":"integration-3d-le-leti-et-intel-cherchent-a-quadrupler-les-vitesses-de-liaison-hybride","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/integration-3d-le-leti-et-intel-cherchent-a-quadrupler-les-vitesses-de-liaison-hybride\/","title":{"rendered":"Int\u00e9gration 3D : le Leti et Intel cherchent \u00e0 quadrupler les vitesses des liaisons hybrides"},"content":{"rendered":"<p><strong>Le Leti vient de porter \u00e0 maturit\u00e9 industrielle avec l&rsquo;\u00e9quipementier SET (Smart Equipment Technology bas\u00e9 \u00e0 Saint Jeoire) un proc\u00e9d\u00e9 de \u00ab\u00a0<em style=\"font-weight: inherit;\">direct hybrid bonding<\/em> puce\u00a0\u00bb sur wafer qui associe une\u00a0 pr\u00e9cision d&rsquo;alignement inf\u00e9rieure au micron et un haut rendement. En parall\u00e8le, le Leti explore avec Intel un autre proc\u00e9d\u00e9 puce sur wafer susceptible de quadrupler les cadences actuelles.\u00a0<\/strong><\/p>\n<p>La collaboration avec SET a port\u00e9 sur du collage hybride, entre des puces et un wafer dont les surfaces \u00e9taient constitu\u00e9es de cuivre et d\u2019oxydes. On retrouve notamment ce cas de figure sur des processeurs d\u2019intelligence artificielle qui empilent des mat\u00e9riaux III-V (LED, capteur d\u2019images\u2026) sur des composants silicium tels que m\u00e9moires et circuits CMOS.<\/p>\n<p><strong>Un \u00e9quipement industriel disponible<\/strong><\/p>\n<p>Le projet a donn\u00e9 naissance \u00e0 un \u00e9quipement industriel au rendement \u00e9lev\u00e9 et \u00e0 la pr\u00e9cision d\u2019alignement inf\u00e9rieure au micron, assur\u00e9e par un proc\u00e9d\u00e9 optique. Il est d\u00e9sormais utilis\u00e9 en routine dans les salles blanches du CEA-Leti.\u00a0La principale contrainte portait sur l\u2019ultra-propret\u00e9 de l\u2019environnement, afin de garantir que les deux surfaces \u00e0 assembler seraient exemptes de toute contamination particulaire. L\u2019\u00e9quipement con\u00e7u avec SET r\u00e9pond \u00e0 cette exigence, avec notamment une adaptation de la partie robotique qui \u00e9vite cette contamination.\u00a0<\/p>\n<p>Pour am\u00e9liorer la productivit\u00e9, les chercheurs se sont pench\u00e9s en particulier sur le nettoyage des puces apr\u00e8s leur d\u00e9coupe. La dur\u00e9e de cette \u00e9tape tr\u00e8s co\u00fbteuse en temps a \u00e9t\u00e9 raccourcie gr\u00e2ce au d\u00e9veloppement d\u2019une strat\u00e9gie de nettoyage optimis\u00e9e.<\/p>\n<p><strong>Avec Intel, goutte d\u2019eau et hauts rendements<\/strong><\/p>\n<p>Toujours dans le domaine de l\u2019assemblage puce sur wafer, le CLeti \u00e9tudie avec Intel une autre voie : obtenir des alignements ultra-pr\u00e9cis gr\u00e2ce aux forces de capillarit\u00e9 d\u2019une goutte d\u2019eau. De nombreux laboratoires \u00e9tudient ce sujet depuis des ann\u00e9es, mais aucun ne l\u2019a port\u00e9 jusqu\u2019ici \u00e0 maturit\u00e9 industrielle. La solution envisag\u00e9e : r\u00e9aliser un pr\u00e9positionnement avec un robot de \u00ab\u00a0pick and place\u00a0\u00bb tr\u00e8s rapide, mais peu pr\u00e9cis en alignement (plus de 200 microns) ; puis laisser les forces de capillarit\u00e9 de la goutte d\u2019eau terminer le travail, sachant qu\u2019elles sont capables d\u2019aligner la puce sur le wafer \u00e0 400 nm pr\u00e8s.<\/p>\n<p>Cette solution est pour l\u2019instant exploratoire, et n\u00e9cessiterait le d\u00e9veloppement d\u2019un \u00e9quipement d\u00e9di\u00e9. Certains points restent \u00e0 valider, par exemple la compatibilit\u00e9 du cuivre avec l\u2019eau.\u00a0<\/p>\n<p>Il faut noter toutefois que la pr\u00e9cision d\u2019alignement obtenue correspond aux exigences annonc\u00e9es pour les prochaines g\u00e9n\u00e9rations de circuits, soit 500 nm. Quant au recours au robot de \u00ab\u00a0pick and place\u00a0\u00bb, il laisse esp\u00e9rer des cadences de 2000 puces\/heure, quatre fois sup\u00e9rieures \u00e0 celles des lignes industrielles d\u2019aujourd\u2019hui.<\/p>\n<p><a href=\"https:\/\/www.leti-cea.fr\/cea-tech\/leti\">CEA-Leti<\/a>\u00a0 \u00a0&#8211;\u00a0 \u00a0<a href=\"https:\/\/set-sas.fr\/\">SET\u00a0<\/a> &#8211;\u00a0 <a href=\"https:\/\/www.intel.fr\/content\/www\/fr\/fr\/homepage.html\">Intel<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Le Leti vient de porter \u00e0 maturit\u00e9 industrielle avec l&rsquo;\u00e9quipementier SET (Smart Equipment Technology bas\u00e9 \u00e0 Saint Jeoire) un proc\u00e9d\u00e9 de \u00ab\u00a0direct hybrid bonding puce\u00a0\u00bb sur wafer qui associe une\u00a0 pr\u00e9cision d&rsquo;alignement inf\u00e9rieure au micron et un haut rendement. En parall\u00e8le, le Leti explore avec Intel un autre proc\u00e9d\u00e9 puce sur wafer susceptible de quadrupler [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":406930,"comment_status":"closed","ping_status":"closed","sticky":true,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[2316,1974,2317],"domains":[47],"ppma_author":[2315],"class_list":["post-406910","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","tag-liaison-hybride","tag-materiaux","tag-waffer","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Int\u00e9gration 3D : le Leti et Intel cherchent \u00e0 quadrupler les ...<\/title>\n<meta name=\"description\" content=\"Le Leti vient de porter \u00e0 maturit\u00e9 industrielle avec l&rsquo;\u00e9quipementier SET (Smart Equipment Technology bas\u00e9 \u00e0 Saint Jeoire) un proc\u00e9d\u00e9 de...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/406910\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Int\u00e9gration 3D : le Leti et Intel cherchent \u00e0 quadrupler les vitesses des liaisons hybrides\" \/>\n<meta property=\"og:description\" content=\"Le Leti vient de porter \u00e0 maturit\u00e9 industrielle avec l&rsquo;\u00e9quipementier SET (Smart Equipment Technology bas\u00e9 \u00e0 Saint Jeoire) un proc\u00e9d\u00e9 de \u00ab\u00a0direct hybrid bonding puce\u00a0\u00bb sur wafer qui associe une\u00a0 pr\u00e9cision d&rsquo;alignement inf\u00e9rieure au micron et un haut rendement. 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