{"id":40682,"date":"2020-11-11T09:47:23","date_gmt":"2020-11-11T09:47:23","guid":{"rendered":"https:\/\/\/st-rejoint-lecosysteme-qualcomm-pour-les-wearables-5g\/"},"modified":"2020-11-11T09:47:23","modified_gmt":"2020-11-11T09:47:23","slug":"st-rejoint-lecosysteme-qualcomm-pour-les-wearables-5g","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/st-rejoint-lecosysteme-qualcomm-pour-les-wearables-5g\/","title":{"rendered":"ST rejoint l&rsquo;\u00e9cosyst\u00e8me Qualcomm pour les wearables 5G"},"content":{"rendered":"<p><!-- Global site tag (gtag.js) - Google Analytics --><\/p>\n<p>\u00a0 window.dataLayer = window.dataLayer || [];<\/p>\n<p>\u00a0 function gtag(){dataLayer.push(arguments);}<\/p>\n<p>\u00a0 gtag(&lsquo;js&rsquo;, new Date());\u00a0 gtag(&lsquo;config&rsquo;, &lsquo;UA-160857065-1&rsquo;);<\/p>\n<p><span class=\"tlid-translation translation\" lang=\"fr\">STMicroelectronics a rejoint l&rsquo;\u00e9cosyst\u00e8me autour des wearables et smartphones 5G d\u00e9velopp\u00e9 autour des puces de Qualcomm Technologies<\/span><\/p>\n<p><span class=\"tlid-translation translation\" lang=\"fr\">Dans le cadre du programme Qualcomm Platform Solutions Ecosystem, ST fournit des logiciels pr\u00e9-valid\u00e9s aux OEM pour ses MEMS et autres dispositifs de d\u00e9tection pour la prochaine g\u00e9n\u00e9ration de smartphones, de PC connect\u00e9s, d&rsquo;IoT et de wearables utilisant les puces SnapDragon de Qualcomm.<\/span><\/p>\n<p>&nbsp; <span class=\"tlid-translation translation\" lang=\"fr\">Tout r\u00e9cemment, Qualcomm Technologies a pr\u00e9s\u00e9lectionn\u00e9 le dernier circuit int\u00e9gr\u00e9 de suivi de mouvement haute pr\u00e9cision et faible consommation de ST avec un logiciel de capteur intelligent, ainsi que le capteur de pression le plus pr\u00e9cis de ST, pour une utilisation dans ses derni\u00e8res plates-formes de r\u00e9f\u00e9rence mobiles 5G avanc\u00e9es.<\/span><\/p>\n<p><span class=\"tlid-translation translation\" lang=\"fr\">Ce capteur de suivi de mouvement, l&rsquo;iNEMO LSM6DST, est une unit\u00e9 de mesure inertielle (IMU) \u00e0 6 axes qui int\u00e8gre un acc\u00e9l\u00e9rom\u00e8tre num\u00e9rique \u00e0 3 axes et un gyroscope \u00e0 3 axes dans un syst\u00e8me compact. Cela permet une faible consommation d&rsquo;\u00e9nergie de 0,55 mA en mode haute performance et seulement 4 mA en mode acc\u00e9l\u00e9rom\u00e8tre uniquement pour un suivi de mouvement de haute pr\u00e9cision toujours activ\u00e9 avec un impact minimal sur la consommation d&rsquo;\u00e9nergie. Combin\u00e9e au capteur de pression \u00e0 faible bruit (0,65 Pa), \u00e0 haute pr\u00e9cision (\u00b1 0,5 hPa) de ST et au premier capteur de pression LPS22HH compatible I3C, la paire fournit un suivi de localisation tr\u00e8s pr\u00e9cis tout en respectant les budgets de puissance les plus restrictifs.<\/span><\/p>\n<p><span class=\"tlid-translation translation\" lang=\"fr\">Pour les applications d&rsquo;imagerie, le LSM6DST prend enti\u00e8rement en charge les applications EIS et OIS (stabilisation d&rsquo;image \u00e9lectronique et optique) car le module comprend un chemin de traitement de signal configurable d\u00e9di\u00e9 pour OIS et un SPI auxiliaire, configurable \u00e0 la fois pour le gyroscope et l&rsquo;acc\u00e9l\u00e9rom\u00e8tre et, \u00e0 son tour, le SPI auxiliaire et l&rsquo;interface principale (SPI \/ I\u00b2C &amp; MIPI I3CSM) peuvent configurer l&rsquo;OIS.<\/span><\/p>\n<p><span class=\"tlid-translation translation\" lang=\"fr\">Le composant utilise le proc\u00e9d\u00e9 de micro-usinage de surface exclusif ThELMA (Thick Epitaxial Layer for Micro-gyroscopes and Accelerometer) de ST, qui combine des couches de poly-silicium de diff\u00e9rentes \u00e9paisseurs pour les structures et l&rsquo;interconnexion, permettant l&rsquo;int\u00e9gration d&rsquo;\u00e9l\u00e9ments m\u00e9caniques d&rsquo;acc\u00e9l\u00e9rom\u00e8tre et de gyroscope dans une seule puce.<\/span><\/p>\n<p><span class=\"tlid-translation translation\" lang=\"fr\">Le LSM6DST prend en charge et simplifie l&rsquo;int\u00e9gration dans les conceptions de circuits \u00e0 faible puissance et offre une interface I\u00b2C, MIPI I3C ou SPI du capteur vers l&rsquo;application. Il contient \u00e9galement un FIFO de 9 ko pour permettre le traitement par lots de donn\u00e9es dynamiques et 16 automates \u00e0 \u00e9tats finis qui reconnaissent les s\u00e9quences de donn\u00e9es programm\u00e9es du capteur et r\u00e9duisent encore la consommation d&rsquo;\u00e9nergie au niveau du syst\u00e8me.<\/span><\/p>\n<p><span class=\"tlid-translation translation\" lang=\"fr\">\u00abST reconna\u00eet depuis longtemps l\u2019importance des capteurs dans les solutions de Qualcomm Technologies et est un collaborateur solide depuis de nombreuses ann\u00e9es. Ils ont fait preuve de leadership dans les capteurs avec de nouvelles interfaces telles que MIPI I3C ainsi que la capacit\u00e9 de r\u00e9duire le budget de puissance de ses comp\u00f4sants tout en maintenant ou en augmentant la pr\u00e9cision des capteurs \u00bb, a d\u00e9clar\u00e9 Manvinder Singh, vice-pr\u00e9sident, gestion des produits chez Qualcomm Technologies.<\/span><\/p>\n<p><span class=\"tlid-translation translation\" lang=\"fr\">\u00abNous sommes ravis que ST rejoigne notre programme Qualcomm Platform Solutions Ecosystem pour int\u00e9grer et optimiser ses algorithmes de capteurs avanc\u00e9s sur l&rsquo;\u00eelot toujours actif et \u00e0 faible consommation de nos plates-formes mobiles Qualcomm Snapdragon. La collaboration avec des fournisseurs strat\u00e9giques tels que ST est essentielle pour permettre l&rsquo;adoption rapide des technologies 5G dans diff\u00e9rents secteurs verticaux \u00bb, a-t-il d\u00e9clar\u00e9.<\/span><\/p>\n<p><span class=\"tlid-translation translation\" lang=\"fr\">\u00abAyant travaill\u00e9 en \u00e9troite collaboration avec Qualcomm Technologies pendant de nombreuses ann\u00e9es, nous avons \u00e9t\u00e9 en mesure de garantir des performances de capteur qui r\u00e9pondent aux exigences \u00e9lev\u00e9es des appareils mobiles et portables de nouvelle g\u00e9n\u00e9ration et des solutions logicielles pouvant \u00eatre utilis\u00e9es avec l&rsquo;environnement d&rsquo;ex\u00e9cution de capteur Qualcomm\u00ae. Celles-ci incluent des fonctionnalit\u00e9s avanc\u00e9es &#8211; telles que la d\u00e9tection de l&rsquo;angle de charni\u00e8re ou de pliage pour les smartphones et les ordinateurs portables &#8211; et permettent une int\u00e9gration transparente et une mise sur le march\u00e9 plus rapide de ces fonctionnalit\u00e9s dont les clients du monde entier ont besoin \u00bb, a d\u00e9clar\u00e9 Andrea Onetti, Group Vice-pr\u00e9sident et directeur g\u00e9n\u00e9ral, Division des capteurs MEMS, STMicroelectronics. \u00abLa combinaison de l\u2019IMU haute pr\u00e9cision ayant la plus basse consommation du secteur avec notre capteur de pression de haute pr\u00e9cision, robuste et extr\u00eamement stable dans le temps et la temp\u00e9rature peut permettre la meilleure pr\u00e9cision de localisation possible pour r\u00e9pondre aux exigences e911 et eCall.\u00bb<\/span><\/p>\n<p><strong>Lire aussi: <\/strong><\/p>\n<p><a href=\"https:\/\/www.electronique-eci.com\/news\/fingerprint-cards-choisit-la-technologie-de-securite-de-infineon\">Fingerprint Cards choisit la technologie de s\u00e9curit\u00e9 de Infineon<\/a><\/p>\n<p><a href=\"https:\/\/www.electronique-eci.com\/news\/withings-leve-60m-pour-integrer-lia-dans-ses-wearables\">Withings l\u00e8ve $60m pour int\u00e9grer l&rsquo;IA dans ses wearables<\/a><\/p>\n<p><a href=\"http:\/\/www.st.com\">www.st.com<\/a><\/p>\n<p><strong>Related articles&nbsp;<\/strong><\/p>\n<ul>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/st-make-cartridges-covid-19-tests\">ST TO MAKE CARTRIDGES FOR COVID-19 TESTS<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/st-sees-boost-coming-iphone-12\">ST SEES BOOST COMING FROM IPHONE 12<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/somos-semi-deal-boosts-sts-iot-roadmap\">SOMOS SEMI DEAL BOOSTS ST&rsquo;S IOT ROADMAP<\/a><\/li>\n<li><a 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Ecosystem pour ajouter ses capteurs \u00e0 la plate-forme SnapDragon pour les \u00ab\u00a0wearables\u00a0\u00bb et les smartphones 5G<\/p>\n","protected":false},"author":12,"featured_media":40683,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[1],"tags":[906,916,910,914],"domains":[47],"ppma_author":[1144],"class_list":["post-40682","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-mpus-mcus-fr","tag-rf-transmission-fr","tag-sensing-conditioning-fr","tag-wearables-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>ST rejoint l&#039;\u00e9cosyst\u00e8me Qualcomm pour les wearables 5G ...<\/title>\n<meta name=\"description\" content=\"STMicroelectronics a rejoint le programme Qualcomm Platform Solutions Ecosystem pour ajouter ses capteurs \u00e0 la plate-forme SnapDragon pour les &quot;wearables&quot;...\" 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