{"id":388352,"date":"2022-07-04T20:37:25","date_gmt":"2022-07-04T18:37:25","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=388352"},"modified":"2022-07-29T12:18:08","modified_gmt":"2022-07-29T10:18:08","slug":"intel-booste-leda-dans-le-cloud-pour-son-activite-de-fonderie","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/intel-booste-leda-dans-le-cloud-pour-son-activite-de-fonderie\/","title":{"rendered":"Intel booste l&rsquo;EDA dans le cloud pour son activit\u00e9 de fonderie"},"content":{"rendered":"<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">L&rsquo;IFS Cloud Alliance permettra des environnements de conception s\u00e9curis\u00e9s dans le cloud, qui est l&rsquo;un des principaux obstacles actuels \u00e0 l&rsquo;utilisation de la technologie. Cela contribuera \u00e0 am\u00e9liorer l&rsquo;efficacit\u00e9 de la conception des clients pour son activit\u00e9 de fonderie naissante en fournissant des performances de calcul facilement \u00e9volutives. <\/span><\/span><\/span><\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">Les premiers membres du programme comprennent les principaux fournisseurs de cloud Amazon Web Services et Microsoft Azure, ainsi que les principaux fournisseurs EDA Ansys, Cadence, Siemens EDA et Synopsys.<\/span><\/span><\/span><\/p>\n<h4>Related articles<\/h4>\n<ul>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/eda-moves-to-the-cloud\/\">EDA moves to the cloud<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/synopsys-boosts-chip-design-with-cloud-platform\/\">Synopsys boosts chip design with cloud platform<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/cadence-unifies-its-cfd-design-tools-in-the-cloud\/\">Cadence unifies its CFD design tools in the cloud<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/siemens-certifies-tools-for-tsmc-3nm-process-boosts-cloud-3d-chiplet-tools\/\">Siemens certifies tools for TSMC 3nm process, boosts cloud platform<\/a><\/li>\n<\/ul>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">\u00ab L&rsquo;IFS Cloud Alliance permettra un acc\u00e8s plus large aux technologies de process et de packaging avanc\u00e9es d&rsquo;Intel \u00bb, a d\u00e9clar\u00e9 Randhir Thakur, pr\u00e9sident d&rsquo;Intel Foundry Services. \u00ab Nos partenariats avec les principaux fournisseurs de cloud et les fournisseurs d&rsquo;outils EDA fourniront une plate-forme flexible et s\u00e9curis\u00e9e o\u00f9 les clients pourront adapter leur puissance de calcul instantan\u00e9ment sur des environnements de conception \u00e9prouv\u00e9s en production dans le cloud \u00bb.<\/span><\/span><\/span><\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\"> Les progr\u00e8s des outils EDA et des technologies cloud peuvent assurer la s\u00e9curit\u00e9 et la confidentialit\u00e9 IP, tout en raccourcissant les cycles de conception et en acc\u00e9l\u00e9rant les d\u00e9lais de mise sur le march\u00e9 pour les concepteurs, explique la soci\u00e9t\u00e9.<\/span><\/span><\/span><\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">\u00ab La conception des puces se d\u00e9place vers le cloud \u00e0 la vitesse de l&rsquo;\u00e9clair. Le programme Intel Foundry Services Cloud Alliance acc\u00e9l\u00e9rera encore l&rsquo;adoption par l&rsquo;industrie des semiconducteurs de la conception bas\u00e9e sur le cloud, garantissant que les ing\u00e9nieurs peuvent continuer \u00e0 utiliser les meilleurs technologies, outils et flux lorsqu&rsquo;ils d\u00e9placent la conception vers le cloud. Nous collaborons avec IFS dans le cadre de la Cloud Alliance, pour permettre \u00e0 nos clients communs de d\u00e9ployer nos outils rapidement et efficacement sur le cloud public et les aider \u00e0 fournir de meilleurs produits plus rapidement tout en relevant des d\u00e9fis de conception et de v\u00e9rification de plus en plus complexes \u00bb, a d\u00e9clar\u00e9 Sandeep Mehndiratta, vice-pr\u00e9sident pr\u00e9sident, Enterprise Go-To-Market &amp; Cloud chez Synopsys.<\/span><\/span><\/span><\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">Par le biais de Cloud Alliance, IFS collaborera avec des partenaires pour s&rsquo;assurer que les outils EDA sont optimis\u00e9s pour tirer parti de l&rsquo;\u00e9volutivit\u00e9 du cloud tout en r\u00e9pondant aux exigences des kits de conception de processus (PDK) d&rsquo;Intel. <\/span><\/span><\/span><\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">Cela fournira aux clients un chemin s\u00e9curis\u00e9 et \u00e9volutif pour adopter leurs outils et flux EDA pr\u00e9f\u00e9r\u00e9s dans l&rsquo;environnement cloud \u00e0 l&rsquo;aide de mat\u00e9riel \u00e0 la demande. Cela permettra aux concepteurs de puces de s&rsquo;attaquer \u00e0 des charges de travail plus importantes avec une meilleure gestion des ressources, un meilleur d\u00e9lai de mise sur le march\u00e9 et une meilleure qualit\u00e9 des r\u00e9sultats.<\/span><\/span><\/span><\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">\u00ab La suite compl\u00e8te de solutions multiphysiques interop\u00e9rables et \u00e9volutives d&rsquo;Ansys joue un r\u00f4le cl\u00e9 dans le premier flux de conception d&rsquo;IFS pris en charge dans le cloud. Nous sommes impatients de poursuivre notre collaboration de longue date avec Intel pour faire progresser la conception de semiconducteurs en garantissant que les concepteurs de puces peuvent acc\u00e9der aux solutions multiphysiques de r\u00e9f\u00e9rence d&rsquo;Ansys via le cloud, quel que soit le flux de travail EDA choisi \u00bb, a d\u00e9clar\u00e9 John Lee, vice-pr\u00e9sident et directeur g\u00e9n\u00e9ral de l&rsquo;unit\u00e9 commerciale Semiconductor, Electronics, and Optics chez Ansys<\/span><\/span><\/span><\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">\u00ab En rejoignant Intel Foundry Services Cloud Alliance, nous permettons \u00e0 nos clients communs de tirer parti de la puissance de calcul \u00e9volutive du cloud avec notre portefeuille \u00e9prouv\u00e9 en production ainsi que les technologies avanc\u00e9es de process et de conditionnement d&rsquo;Intel dans un environnement de conception s\u00e9curis\u00e9 \u00bb, a d\u00e9clar\u00e9 Mahesh Turaga. , vice-pr\u00e9sident, Cloud Business Development chez Cadence.<\/span><\/span><\/span><\/p>\n<p><a href=\"http:\/\/www.intel.com\">www.intel.com<\/a><\/p>\n<h4>Related articles<\/h4>\n<ul>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/rf-eda-tools-move-to-the-cloud\/\">RF EDA tools move to the cloud\u00a0<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/cadence-ports-3d-solver-to-the-cloud\/\">Cadence ports 3D solver to the cloud<\/a><\/li>\n<\/ul>\n<h4>Other articles on eeNews Europe<\/h4>\n<ul>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/european-tech-drives-boost-to-us-ev-charging-infrastructure\/\">European tech drives boost to US EV charging infrastructure<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/siemens-acquires-us-ai-analytics-firm-for-1-5bn\/\">Siemens acquires US AI analytics firm for $1.5bn<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/globalwafers-to-build-30mm-silicon-wafer-megafactory-in-texas\/\">GlobalWafers to build 300mm silicon wafer megafactory in Texas<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/en\/imec-spinout-swave-raises-e7m-for-3d-display\/\">imec spinout Swave raises \u20ac7m for 3D display<\/a><\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Intel Foundry Services (IFS) a lanc\u00e9 la prochaine phase de son programme d&rsquo;\u00e9cosyst\u00e8me Accelerator avec une alliance pour les outils de conception bas\u00e9s sur le cloud.<\/p>\n","protected":false},"author":34,"featured_media":387945,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[886],"tags":[],"domains":[47],"ppma_author":[1153],"class_list":["post-388352","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Intel booste l&#039;EDA dans le cloud pour son activit\u00e9 de fonderie ...<\/title>\n<meta name=\"description\" content=\"Intel Foundry Services IFS a lanc\u00e9 son programme d&#039;\u00e9cosyst\u00e8me Accelerator avec une alliance pour les outils de conception bas\u00e9s sur le cloud.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/388352\/\" \/>\n<meta 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