{"id":384767,"date":"2022-05-23T17:55:43","date_gmt":"2022-05-23T15:55:43","guid":{"rendered":"https:\/\/www.eenewseurope.com\/?p=384767"},"modified":"2022-05-23T17:55:43","modified_gmt":"2022-05-23T15:55:43","slug":"micron-va-commercialiser-des-memoires-1tbit-3d-nand-a-232-couches","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/micron-va-commercialiser-des-memoires-1tbit-3d-nand-a-232-couches\/","title":{"rendered":"Micron va commercialiser des m\u00e9moires 1Tbit 3D-NAND \u00e0 232 couches"},"content":{"rendered":"<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">Micron Technology va commencer \u00e0 exp\u00e9dier sa prochaine g\u00e9n\u00e9ration de composants de m\u00e9moire 3D-NAND, un composant \u00e0 232 couches, plus tard cette ann\u00e9e avec des densit\u00e9s allant jusqu&rsquo;\u00e0 1 Tbit sur une seule puce. <\/span><\/span><\/span><\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">Scott DeBoer, vice-pr\u00e9sident ex\u00e9cutif de Micron pour la technologie et les produits, a d\u00e9voil\u00e9 une feuille de route pour la 3D-NAND au cours de la prochaine d\u00e9cennie qui irait au-del\u00e0 de 400 couches. <\/span><\/span><\/span><\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">Micron occupe d\u00e9j\u00e0 une position tr\u00e8s forte dans la fabrication en volume de puces flash 96 et 176 couches 3D-NAND. DeBoer a d\u00e9clar\u00e9 que la soci\u00e9t\u00e9 commencerait \u00e0 acc\u00e9l\u00e9rer la fabrication du flash \u00e0 232 couches \u00e0 la fin de l&rsquo;ann\u00e9e calendaire 2022.<\/span><\/span><\/span><\/p>\n<p>&nbsp;<\/p>\n<p><strong>Articles li\u00e9s: <\/strong><\/p>\n<ul>\n<li>\n<p class=\"title\"><a href=\"https:\/\/www.ecinews.fr\/fr\/intel-adi-micron-dans-une-alliance-des-semiconducteurs-us\/\" target=\"_blank\" rel=\"noopener\">Intel, ADI, Micron dans une alliance des semiconducteurs US<\/a><\/p>\n<\/li>\n<li>\n<p class=\"title\"><a href=\"https:\/\/www.ecinews.fr\/fr\/boom-de-34-des-investissements-dans-les-semiconducteurs-en-2021\/\" target=\"_blank\" rel=\"noopener\">Boom de 34% des investissements dans les semiconducteurs en 2021<\/a><\/p>\n<\/li>\n<li>\n<p class=\"title\"><a href=\"https:\/\/www.ecinews.fr\/fr\/la-commission-europeenne-forme-une-alliance-des-processeurs-et-semiconducteurs\/\" target=\"_blank\" rel=\"noopener\">La Commission Europ\u00e9enne forme une alliance des processeurs et semiconducteurs<\/a><\/p>\n<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">La soci\u00e9t\u00e9 a montr\u00e9 une puce m\u00e9moire 3D-NAND de 1 Tbit avec une cellule \u00e0 trois niveaux, mais DeBoer a d\u00e9clar\u00e9 que l&rsquo;objectif de Micron inclurait le maintien du leadership dans la technologie 4 bits par cellule. <\/span><\/span><\/span><\/p>\n<p><span class=\"VIiyi\" lang=\"fr\"><span class=\"JLqJ4b\" data-language-for-alternatives=\"fr\" data-language-to-translate-into=\"en\" data-phrase-index=\"0\" data-number-of-phrases=\"1\"><span class=\"Q4iAWc\">La m\u00e9moire inclurait la technologie CMOS sous matrice et la pile double. Les d\u00e9tails des performances viendront plus tard. DeBoer a d\u00e9clar\u00e9 que les versions \u00e0 232 couches fourniraient une densit\u00e9, une puissance et une bande passante accrues par rapport \u00e0 la g\u00e9n\u00e9ration \u00e0 176 couches. Des disques SSD bas\u00e9s sur des dispositifs 3D-NAND de plus grande capacit\u00e9 sont attendus en 2023.<\/span><\/span><\/span><\/p>\n<p>&nbsp;<\/p>\n<p><a href=\"http:\/\/www.micron.com\">www.micron.com<\/a><\/p>\n<h4>Autres articles sur eeNews Europe<\/h4>\n<ul>\n<li><a href=\"https:\/\/www.eenewsanalog.com\/en\/kioxia-western-digital-develop-162-layer-3d-nand\/\">Kioxia, Western Digital develop 162-layer 3D-NAND<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewsanalog.com\/en\/sk-hynix-joins-micron-on-176-layers-for-3d-nand-flash\/\">SK Hynix joins Micron on 176 layers for 3D-NAND flash<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewsanalog.com\/en\/micron-plans-to-spend-150-billion-on-memory-production\/\">Micron plans to spend $150 billion on memory production<\/a><\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Micron Technology va commencer \u00e0 exp\u00e9dier sa prochaine g\u00e9n\u00e9ration de composants de m\u00e9moire 3D-NAND avec jusqu&rsquo;\u00e0 1Tbit sur une seule puce.<\/p>\n","protected":false},"author":34,"featured_media":383913,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[883],"tags":[889,903,913,905],"domains":[47],"ppma_author":[1153],"class_list":["post-384767","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technologies","tag-analog-fr","tag-interconnect-cables-fr","tag-materials-processes-fr","tag-memory-data-storage-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Micron annonce l&#039;arriv\u00e9e de m\u00e9moires 3D-NAND \u00e0 232-couches ...<\/title>\n<meta name=\"description\" content=\"Micron Technology va commencer \u00e0 exp\u00e9dier sa prochaine g\u00e9n\u00e9ration de composants de m\u00e9moire 3D-NAND avec jusqu&#039;\u00e0 1Tbit sur une seule puce.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, 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