{"id":38233,"date":"2021-01-11T16:58:23","date_gmt":"2021-01-11T16:58:23","guid":{"rendered":"https:\/\/\/tsmc-et-le-japon-se-partagent-le-cout-dune-usine-de-ci-a-tokyo\/"},"modified":"2021-01-11T16:58:23","modified_gmt":"2021-01-11T16:58:23","slug":"tsmc-et-le-japon-se-partagent-le-cout-dune-usine-de-ci-a-tokyo","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/tsmc-et-le-japon-se-partagent-le-cout-dune-usine-de-ci-a-tokyo\/","title":{"rendered":"TSMC et le Japon se partagent le co\u00fbt d’une usine de CI \u00e0 Tokyo"},"content":{"rendered":"

Le Japon aurait voulu convenir d’une initiative d’installation d’une Fab comme celle sign\u00e9e par TSMC avec les \u00c9tats-Unis (voir TSMC confirme sa Fab 5nm \u00e0 $3,5 milliards en Arizona<\/a>) mais cette demande a \u00e9t\u00e9 rejet\u00e9e, selon le rapport du United Daily News de Taiwan, qui faisait r\u00e9f\u00e9rence \u00e0 des sources anonymes. Le rapport UDN n’indique pas le montant de l’investissement dans l’installation d’encapsulage et de test.<\/span><\/span><\/span><\/p>\n

Il n’en demeure pas moins qu’une capacit\u00e9 d’encapsulage avanc\u00e9e serait \u00e9galement d’une importance strat\u00e9gique. D’un point de vue g\u00e9opolitique, cela serait b\u00e9n\u00e9fique pour le Japon car, ind\u00e9pendamment de ce qui se passe entre la Chine et Ta\u00efwan, le Japon pourrait avoir acc\u00e8s \u00e0 des plaquettes TSMC de pointe fabriqu\u00e9es aux \u00c9tats-Unis et mises en bo\u00eetier au Japon.<\/span><\/span><\/span><\/p>\n

Le Japon avait sollicit\u00e9 l’implication de TSMC sur son sol en 2020 (voir <\/span><\/span><\/span> Now Japan wants a domestic TSMC fab<\/a>) en r\u00e9ponse \u00e0 la tension g\u00e9opolitique croissante dans le monde, et les \u00c9tats-Unis prennent des mesures pour attirer les fabricants de puces sur leur sol ( voir TSMC confirme sa Fab 5nm \u00e0 $3,5 milliards en Arizona<\/a>).<\/span><\/span><\/span><\/p>\n

TSMC a depuis longtemps une politique de fabrication ta\u00efwanaise faisant valoir qu’elle gagne des \u00e9conomies d’\u00e9chelle en se concentrant sur quelques sites \u00e0 Taiwan. Cependant, il a assoupli cette politique de mani\u00e8re pragmatique avec des usines en Chine et aux \u00c9tats-Unis ces derni\u00e8res ann\u00e9es. Le METI du Japon avait sign\u00e9 un accord de coentreprise pr\u00e9paratoire avec TSMC pour cr\u00e9er le Centre japonais de recherche et de d\u00e9veloppement sur les semi-conducteurs avanc\u00e9s (JASRC), selon le rapport. Malgr\u00e9 la puissance japonaise dans les \u00e9quipements et les mat\u00e9riaux de fabrication de semiconducteurs, TSMC a par la suite d\u00e9cid\u00e9 d’abandonner l’id\u00e9e de construire une Fab de circuits int\u00e9gr\u00e9s au Japon, selon le rapport.<\/span><\/span><\/span><\/p>\n

 <\/p>\n

\u00e0 suivre: l’encapsulage en bo\u00eetiers avanc\u00e9s<\/strong><\/em><\/p>\n

\n

Cependant, TSMC prend des mesures strat\u00e9giques pour ajouter l’encapsulage multi-chip h\u00e9t\u00e9rog\u00e8nes \u00e0 son offre de services de fonderie. G\u00e9n\u00e9ralement, le conditionnement et le test des circuits int\u00e9gr\u00e9s \u00e9tait men\u00e9 par un ensemble distinct de fournisseurs de services, \u00e9galement bas\u00e9s \u00e0 Taiwan ou ailleurs en Asie du Sud-Est. Ces soci\u00e9t\u00e9s OSAT exp\u00e9dient ensuite les puces aux fabricants d’\u00e9quipements. Un marqueur clair des intentions de TSMC en mati\u00e8re de conditionnement a \u00e9t\u00e9 \u00e9tabli en 2020, lorsque TSMC a annonc\u00e9 son intention de d\u00e9penser 10 milliards de dollars pour une installation d’assemblage, d’encapsulage et de test de circuits int\u00e9gr\u00e9s \u00e0 Miaoli, dans le nord de Ta\u00efwan (voir <\/span><\/span><\/span> Chiplet-savvy TSMC to build $10 billion assembly and test plant<\/a>) .<\/span><\/span><\/span><\/p>\n

La coentreprise avec le gouvernement japonais serait le moyen pour TSMC de partager son expertise dans la fabrication de composants multi-puces h\u00e9t\u00e9rog\u00e8nes \u00abchiplet\u00bb avec des soci\u00e9t\u00e9s japonaises de semiconducteurs. TSMC et le Japon devraient signer prochainement un protocole de coop\u00e9ration pour la construction de l\u2019usine d’avant-garde d\u2019encapsulage et de test.<\/span><\/span><\/span><\/p>\n

Lire aussi:<\/strong><\/p>\n

TSMC confirme sa Fab 5nm \u00e0 $3,5 milliards en Arizona<\/a><\/span><\/span><\/span><\/p>\n

TSMC pr\u00e9pare le process de fabrication 2nm<\/span><\/span><\/span><\/a><\/p>\n

Related links and articles: <\/strong><\/p>\n

TSMC picks Arizona for 5nm wafer fab <\/a><\/p>\n

Now Japan wants a domestic TSMC fab<\/a><\/p>\n

TSMC dragged to the altar of US manufacturing <\/a><\/p>\n

Chiplet-savvy TSMC to build $10 billion assembly and test plant <\/a><\/p>\n

Opinion: Money’s not the problem for Europe’s semiconductor rebuild <\/a><\/p>\n

Lossmaking Indie Semi to go public in $1.4 billion deal<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Selon un rapport ta\u00efwanais, TSMC, leader mondial des fonderies, cr\u00e9era une coentreprise \u00e0 50\/50 avec le minist\u00e8re japonais de l’\u00c9conomie, du Commerce et de l’Industrie, pour mettre en place une usine d’encapsulage et de test de circuits int\u00e9gr\u00e9s \u00e0 Tokyo.<\/p>\n","protected":false},"author":12,"featured_media":162385,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[880],"tags":[889,920,893,891,909,894,912,895,896,897,898,899,900,901,902,903,919,892,913,904,905,906,907,908,890,916,910,917,911,914,915],"domains":[47],"ppma_author":[1144],"class_list":["post-38233","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites-economiques","tag-analog-fr","tag-artificialintelligence-fr","tag-authentication-encryption-fr","tag-automotive-fr","tag-batteries-power-supplies-fr","tag-boards-embedded-cards-fr","tag-dataacquisition-fr","tag-developmentkits-fr","tag-digitalsignalprocessing-fr","tag-displays-interfaces-fr","tag-distributors-fr","tag-eda-cad-tools-fr","tag-electromechanical-fr","tag-energyharvesting-fr","tag-flexibleelectronics-fr","tag-interconnect-cables-fr","tag-iot-fr","tag-ledlighting-fr","tag-materials-processes-fr","tag-medicalelectronics-fr","tag-memory-data-storage-fr","tag-mpus-mcus-fr","tag-optoelectronics-fr","tag-plds-fpgas-asics-fr","tag-powermanagement-fr","tag-rf-transmission-fr","tag-sensing-conditioning-fr","tag-software-embedded-tools-fr","tag-testandmeasurement-fr","tag-wearables-fr","tag-wireless-communications-fr","domains-electronique-eci"],"acf":[],"yoast_head":"TSMC 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