{"id":37935,"date":"2021-01-28T18:00:44","date_gmt":"2021-01-28T18:00:44","guid":{"rendered":"https:\/\/\/flex-logix-associe-son-accelerateur-dinference-ia-avec-une-puce-4-go-a-large-bande-de-winbond\/"},"modified":"2021-01-28T18:00:44","modified_gmt":"2021-01-28T18:00:44","slug":"flex-logix-associe-son-accelerateur-dinference-ia-avec-une-puce-4-go-a-large-bande-de-winbond","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/flex-logix-associe-son-accelerateur-dinference-ia-avec-une-puce-4-go-a-large-bande-de-winbond\/","title":{"rendered":"Flex Logix associe son acc\u00e9l\u00e9rateur d&rsquo;inf\u00e9rence IA avec une puce 4 Go \u00e0 large bande de Winbond"},"content":{"rendered":"<p>La puce LPDDR4X de Winbond est associ\u00e9e \u00e0 la puce d&rsquo;acc\u00e9l\u00e9rateur d&rsquo;inf\u00e9rence de pointe InferX\u2122 X1 de Flex Logix, bas\u00e9e sur une architecture innovante qui comprend un \u00e9ventail d\u2019unit\u00e9s de traitement de tenseur. Elle affiche une vitesse sup\u00e9rieure et une plus faible latence pour un prix inf\u00e9rieur par rapport \u00e0 la solution de calcul de pointe IA actuelle lorsqu&rsquo;elle traite des algorithmes de r\u00e9seau neuronaux complexes tels que YOLOv3 ou Winograd pr\u00e9cision maximum.<\/p>\n<p>\u00ab&nbsp;Nous avons opt\u00e9 pour l&rsquo;acc\u00e9l\u00e9rateur de pointe InferX X1 de Flex Logix car il offrait le meilleur rendement par dollar, ce qui est critique pour piloter des applications courantes \u00e0 grande \u00e9chelle&nbsp;\u00bb a indiqu\u00e9 Robert Chang, directeur technologique du centre marketing de produits DRAM chez Winbond.&nbsp; \u00ab&nbsp;L&rsquo;avantage prix\/performance de l&rsquo;utilisation d&rsquo;InferX avec notre puce LPDDR4X permettrait de d\u00e9ployer de mani\u00e8re significative les applications IA en proposant enfin des capacit\u00e9s d&rsquo;inf\u00e9rence au grand public.&nbsp;\u00bb<\/p>\n<p>Pour permettre le fonctionnement ultra rapide (7,5&nbsp;TOPS maximum) d&rsquo;InferX X1 tout en maintenant une consommation r\u00e9duite, Flex Logix a associ\u00e9 l&rsquo;acc\u00e9l\u00e9rateur avec le W66CQ2NQUAHJ de Winbond, une DRAM LPDDR4X 4&nbsp;Go qui offre un d\u00e9bit de donn\u00e9es maximum de 4&nbsp;267&nbsp;Mbps \u00e0 une fr\u00e9quence d&rsquo;horloge maximum de 2&nbsp;133&nbsp;MHz. Pour permettre une utilisation dans des syst\u00e8mes sur batterie et d&rsquo;autres applications \u00e0 \u00e9nergie limit\u00e9e, le dispositif de la s\u00e9rie W66 fonctionne en mode actif avec des rails d&rsquo;alimentation 1,8&nbsp;V\/1,1&nbsp;V et en mode inactif avec une alimentation 0,6&nbsp;V. Il offre des caract\u00e9ristiques d&rsquo;\u00e9conomie d&rsquo;\u00e9nergie comprenant un rafra\u00eechissement automatique partiel.<\/p>\n<p>La puce LPDDR4X de Winbond fonctionne avec le processeur InferX X1 dans la carte de processeur embarqu\u00e9 PCIe mi-hauteur\/mi-longueur pour des serveurs et des passerelles de pointe. Le syst\u00e8me profite des innovations architecturales de Flex Logix, telles que les chemins de donn\u00e9es optimis\u00e9s reconfigurables qui r\u00e9duisent le trafic entre le processeur et la DRAM afin d&rsquo;augmenter le rendement et r\u00e9duire la latence.<\/p>\n<p>Dana McCarty, vice-pr\u00e9sidente Ventes &amp; Marketing pour les Produits d&rsquo;inf\u00e9rence IA de Flex Logix a d\u00e9clar\u00e9&nbsp;: \u00ab&nbsp;La combinaison du processus InferX X1 unique et de la puce LPDDR4X \u00e0 large bande de Winbond s&rsquo;impose comme une nouvelle r\u00e9f\u00e9rence en mati\u00e8re de performance IA de pointe. Pour la premi\u00e8re fois, des syst\u00e8mes de calcul de pointe abordables peuvent impl\u00e9menter des algorithmes de r\u00e9seaux neuronaux complexes pour atteindre une grande pr\u00e9cision dans la d\u00e9tection d&rsquo;objet et la reconnaissance d&rsquo;image, m\u00eame lors du traitement de flux vid\u00e9os haute d\u00e9finition consommateurs de donn\u00e9es.&nbsp;\u00bb<\/p>\n<p>Le W66CQ2NQUAHJ 4&nbsp;Go est compos\u00e9 de deux matrices 2&nbsp;Go dans une configuration \u00e0 deux canaux. Chaque matrice est organis\u00e9e en huit banques internes qui prennent en charge le fonctionnement concurrent. La puce est log\u00e9e dans un bo\u00eetier WFBGA 200&nbsp;billes qui mesure 10&nbsp;mm x 14,5&nbsp;mm.<\/p>\n<p><a href=\"http:\/\/www.winbond.com\">www.winbond.com<\/a><\/p>\n<p><a href=\"https:\/\/flex-logix.com\/inference\">flex-logix.com\/inference<\/a><\/p>\n<p><a href=\"https:\/\/flex-logix.com\">flex-logix.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Fournisseur mondial de solutions de m\u00e9moire \u00e0 semi-conducteurs, Winbond Electronics Corporation vient d\u2019annoncer que sa technologie DRAM LPDDR4X haute performance et basse consommation prend en charge les derni\u00e8res innovations dans le domaine du calcul de pointe de Flex Logix pour les applications d&rsquo;intelligence artificielle (IA) exigeantes telles que la reconnaissance d&rsquo;objet. <\/p>\n","protected":false},"author":9,"featured_media":161477,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[],"domains":[47],"ppma_author":[1141],"class_list":["post-37935","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Flex Logix associe son acc\u00e9l\u00e9rateur d&#039;inf\u00e9rence IA avec une ...<\/title>\n<meta name=\"description\" content=\"Fournisseur mondial de solutions de m\u00e9moire \u00e0 semi-conducteurs, Winbond Electronics Corporation vient d\u2019annoncer que sa technologie DRAM LPDDR4X haute...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/37935\/\" \/>\n<meta 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