{"id":276678,"date":"2022-03-03T18:37:54","date_gmt":"2022-03-03T17:37:54","guid":{"rendered":"https:\/\/www.ecinews.fr\/?p=276678"},"modified":"2022-03-03T18:37:54","modified_gmt":"2022-03-03T17:37:54","slug":"les-nouveaux-systemes-graphcore-utilisent-le-1er-processeur-3d-wafer-on-wafer","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/les-nouveaux-systemes-graphcore-utilisent-le-1er-processeur-3d-wafer-on-wafer\/","title":{"rendered":"Les nouveaux syst\u00e8mes Graphcore utilisent le 1er processeur 3D wafer on wafer"},"content":{"rendered":"<p><a href=\"https:\/\/www.graphcore.ai\/\">Graphcore<\/a> vient de pr\u00e9senter le premier processeur 3D \u201cwafer on wafer\u201d (technologie de puces empil\u00e9es) au monde : le processeur Bow, pi\u00e8ce ma\u00eetresse de la nouvelle g\u00e9n\u00e9ration de syst\u00e8mes informatiques Bow Pod AI, qui propose des performances 40 % sup\u00e9rieures et une efficacit\u00e9 \u00e9nerg\u00e9tique 16 % plus \u00e9lev\u00e9e pour les applications d\u2019IA existantes. Le tout, pour le m\u00eame prix et sans modifications logicielles. La solution phare Bow Pod offre plus de 89 PetaFLOPS de calcul d\u2019IA (intelligence artificielle), tandis que le Bow POD super\u00e9volutif fournit 350 PetaFLOPS, ce qui permet aux ing\u00e9nieurs en apprentissage automatique de continuer \u00e0 s\u2019adapter \u00e0 la taille en \u00e9volution constante des mod\u00e8les d\u2019IA et d\u2019innover dans le secteur.<\/p>\n<p><strong>R\u00e9sultats concrets<\/strong><br \/>\nLes Bow Pods sont con\u00e7us pour offrir des performances concr\u00e8tes et \u00e9volutives pour de tr\u00e8s nombreuses applications d\u2019IA, des applications GPT et BERT pour le traitement naturel du langage \u00e0 EfficientNet et ResNet pour la vision par ordinateur, en passant par les r\u00e9seaux de neurones graphiques et bien plus encore. Les clients profitent de performances jusqu\u2019\u00e0 40\u00a0% sup\u00e9rieures pour nombre d\u2019applications d\u2019IA dans la m\u00eame fourchette de performances optimales qu\u2019avec les syst\u00e8mes Mk2 IPU-Pod avec Bow\u00a0Pods.\u00a0En plus des gains de 40\u00a0% en performances, les syst\u00e8mes Bow\u00a0Pod proposent \u00e9galement une meilleure efficacit\u00e9 \u00e9nerg\u00e9tique que leurs pr\u00e9d\u00e9cesseurs. Test\u00e9es dans le cadre de nombreuses applications concr\u00e8tes, les Bow\u00a0Pods fournissent un rendement \u00e9lectrique jusqu\u2019\u00e0 16\u00a0% sup\u00e9rieur.<\/p>\n<p><strong>Technologie \u201cwafer on wafer\u201d<\/strong><br \/>\nLes syst\u00e8mes Bow\u00a0Pod sont synonymes d\u2019am\u00e9liorations des performances consid\u00e9rables et de meilleure efficacit\u00e9 \u00e9nerg\u00e9tique gr\u00e2ce \u00e0 l\u2019emploi de semiconducteurs 3D avec le processeur Bow au c\u0153ur des syst\u00e8mes Bow\u00a0Pod.\u00a0Graphcore est le premier sur le march\u00e9 \u00e0 vendre des syst\u00e8mes utilisant la technologie 3D \u201cwafer on wafer\u201d de TSMC, que Graphcore a d\u00e9velopp\u00e9e en collaboration avec eux. Le wafer on wafer est capable de fournir une bande passante bien plus \u00e9lev\u00e9e entre puces en silicium, et est utilis\u00e9 pour optimiser l\u2019efficacit\u00e9 \u00e9nerg\u00e9tique et am\u00e9liorer l\u2019alimentation \u00e0 l\u2019architecture Colossus au niveau des wafers.\u00a0<br \/>\nGr\u00e2ce au wafer on wafer des processeurs Bow, deux wafers sont reli\u00e9s pour g\u00e9n\u00e9rer un nouvelle puce 3D : un wafer pour le traitement de l\u2019IA architecturalement compatible avec le processeur GC200 dot\u00e9 de 1\u00a0472 tuiles IPU-Core ind\u00e9pendants, capable d\u2019ex\u00e9cuter plus de 8\u00a0800 threads avec 900\u00a0Mo de m\u00e9moire int\u00e9gr\u00e9e, et un second wafer avec puce d\u2019alimentation.<br \/>\nEn ajoutant des Deep Trench Capacitors (DTC) \u00e0 la puce d\u2019alimentation (\u00e0 c\u00f4t\u00e9 des noyaux de traitement et de la m\u00e9moire), Graphcore est en mesure d\u2019optimiser les performances de 40\u00a0% et de profiter de 350\u00a0TeraFLOPS de calcul d\u2019IA. En collaborant \u00e9troitement avec TSMC, Graphcore a optimis\u00e9 plusieurs technologies, dont des innovations telles que le BTSV (Back Side Through Silicon Via) et la liaison hybride WoW (Wafer-on-Wafer).<\/p>\n<p><strong>A propos de Graphcore<\/strong><strong><br \/>\n<\/strong>Graphcore est l\u2019inventeur de l\u2019Intelligence Processing Unit (IPU), le microprocesseur le plus sophistique\u0301 au monde, conc\u0327u pour re\u0301pondre aux besoins actuels et futurs charges de travail pour l\u2019intelligence artificielle. Pour passer a\u0300 grande e\u0301chelle, les syste\u0300mes Graphcore offrent la possibilite\u0301 d&rsquo;exe\u0301cuter des mode\u0301lisations a\u0300 l&rsquo;e\u0301chelle d\u2019un serveur ou de partager les ressources de calcul entre plusieurs utilisateurs et ta\u0302ches. Depuis sa cre\u0301ation en 2016, Graphcore a leve\u0301 plus de 710 M$.<\/p>\n<p><a href=\"https:\/\/www.graphcore.ai\/\">www.graphcore.ai<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Graphcore vient de pr\u00e9senter le premier processeur 3D \u201cwafer on wafer\u201d (technologie de puces empil\u00e9es) au monde : le processeur Bow, pi\u00e8ce ma\u00eetresse de la nouvelle g\u00e9n\u00e9ration de syst\u00e8mes informatiques Bow Pod AI, qui propose des performances 40 % sup\u00e9rieures et une efficacit\u00e9 \u00e9nerg\u00e9tique 16 % plus \u00e9lev\u00e9e pour les applications d\u2019IA existantes. Le tout, [&hellip;]<\/p>\n","protected":false},"author":36,"featured_media":276679,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[886],"tags":[936],"domains":[47],"ppma_author":[1154],"class_list":["post-276678","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news-fr","tag-circuits-integres","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Les nouveaux syst\u00e8mes Graphcore utilisent le 1er processeur 3D...<\/title>\n<meta name=\"description\" content=\"Graphcore vient de pr\u00e9senter le premier processeur 3D \u201cwafer on wafer\u201d (technologie de puces empil\u00e9es) au monde : le processeur Bow, pi\u00e8ce ma\u00eetresse...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/276678\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Les nouveaux syst\u00e8mes Graphcore utilisent le 1er processeur 3D wafer on wafer\" \/>\n<meta property=\"og:description\" content=\"Graphcore vient de pr\u00e9senter le premier processeur 3D \u201cwafer on wafer\u201d (technologie de puces empil\u00e9es) au monde : le processeur Bow, pi\u00e8ce ma\u00eetresse de la nouvelle g\u00e9n\u00e9ration de syst\u00e8mes informatiques Bow Pod AI, qui propose des performances 40 % sup\u00e9rieures et une efficacit\u00e9 \u00e9nerg\u00e9tique 16 % plus \u00e9lev\u00e9e pour les applications d\u2019IA existantes. 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