{"id":234786,"date":"2015-11-09T23:00:00","date_gmt":"2015-11-09T23:00:00","guid":{"rendered":"https:\/\/eenewseurope.artwhere.co\/des-circuits-bluetooth-low-energy-beaucoup-plus-rapides\/"},"modified":"2015-11-09T23:00:00","modified_gmt":"2015-11-09T23:00:00","slug":"des-circuits-bluetooth-low-energy-beaucoup-plus-rapides","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/des-circuits-bluetooth-low-energy-beaucoup-plus-rapides\/","title":{"rendered":"Des circuits Bluetooth Low Energy beaucoup plus rapides"},"content":{"rendered":"<p>Ces composants Bluetooth LE int&egrave;grent une pile firmware certifi&eacute;e Bluetooth 4.2. Les d&eacute;veloppeurs peuvent tabler sur des vitesses de transfert de donn&eacute;es jusqu&rsquo;&agrave; 2,5 fois plus rapides et une meilleure s&eacute;curisation de la connexion compatible avec la norme FIPS (Federal Information Processing Standard) de l&rsquo;administration am&eacute;ricaine. Les donn&eacute;es sont envoy&eacute;es et re&ccedil;ues via une liaison Bluetooth utilisant le mode UART &quot;Transparent&quot;, ce qui facilite l&rsquo;int&eacute;gration avec n&rsquo;importe quel processeur ou avec l&rsquo;un des multiples microcontr&ocirc;leurs PIC propri&eacute;taires dot&eacute;s d&rsquo;une interface UART. Le module autorise &eacute;galement le fonctionnement autonome (hostless) pour les applications de balises.<br \/>\nLe profil d&rsquo;alimentation optimis&eacute; de ces composants limite la consommation &eacute;lectrique pour une meilleure long&eacute;vit&eacute; des batteries, tandis que les facteurs de forme compacts, jusqu&rsquo;&agrave; 4 x 4 mm pour les puces RF et 15 x 12 mm pour le module, r&eacute;duisent l&rsquo;encombrement sur la carte. Le module est propos&eacute; en version certifi&eacute;e RF selon les r&eacute;glementations internationales ou en version non certifi&eacute;e (module non blind&eacute;\/sans antenne) pour les syst&egrave;mes d&rsquo;antenne plus compacts ou plus distants qui devront subir un processus de certification du produit fini concernant ses &eacute;missions.<br \/>\nLes modules Bluetooth LE int&egrave;grent tout le mat&eacute;riel, les logiciels et les certifications dont les d&eacute;veloppeurs ont besoin. Ils peuvent profiter du QDID (Qualified Design ID) Bluetooth constructeur pour faire certifier leurs produits selon le standard Bluetooth SIG. Les profils de pile Bluetooth embarqu&eacute;s incluent GAP, GATT, ATT, SMP et L2CAP, ainsi que des services propri&eacute;taires pour UART en mode &laquo;Transparent&raquo;. Tous ces modules sont configurables via les outils propri&eacute;taires bas&eacute;s sur Windows OS.\n<\/p>\n<hr \/>\n<p>La carte fille PICtail\/PICtail Plus Bluetooth Low Energy BM-70-PICTAIL est &eacute;galement pr&eacute;vue pour le module BM70. Cet outil permet de d&eacute;velopper du code pour ce module en le reliant &agrave; un PC via une interface USB, ou en le connectant aux cartes de d&eacute;veloppement pour les microcontr&ocirc;leurs existants de la gamme, comme la carte Explorer 16, la carte Explorer PIC18 et celle d&rsquo;extension d&rsquo;E\/S PIC32.<br \/>\nLe circuit LE IS1870 est encapsul&eacute; en bo&icirc;tier QFN 6 x 6 mm &agrave; 48 broches, tandis que l&rsquo;IS1871 est pr&eacute;vu en bo&icirc;tier QFN 4 x 4 mm &agrave; 32 broches. Les modules BM70 Bluetooth LE &agrave; 30 broches sont propos&eacute;s avec ou sans antenne PCB int&eacute;gr&eacute;e.<\/p>\n<\/p>\n<p><a title=\"www.microchip.com\/Bluetooth-102015a\" target=\"_blank\" href=\"http:\/\/www.microchip.com\/Bluetooth-102015a\" rel=\"noopener\">www.microchip.com\/Bluetooth-102015a<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Conformes au tout nouveau standard Bluetooth 4.2, tout comme aux r\u00e8glementations internationales et aux certifications du Bluetooth Special Interest Group (SIG), les circuits int\u00e9gr\u00e9s RF Bluetooth Low Energy (LE) IS1870 et IS1871 ainsi que le module BM70 viennent compl\u00e9ter le portefeuille existant de composants Bluetooth de Microchip. Les d\u00e9veloppeurs pourront facilement tirer parti de la faible consommation et de la simplicit\u00e9 de la connectivit\u00e9 du Bluetooth LE pour leurs applications d\u2019objets connect\u00e9s (IoT) et de balises Bluetooth.<\/p>\n","protected":false},"author":22,"featured_media":234787,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[],"domains":[47],"ppma_author":[1149],"class_list":["post-234786","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Des circuits Bluetooth Low Energy beaucoup plus rapides ...<\/title>\n<meta name=\"description\" content=\"Conformes au tout nouveau standard Bluetooth 4.2, tout comme aux r\u00e8glementations internationales et aux certifications du Bluetooth Special Interest Group...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/234786\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Des circuits Bluetooth Low Energy beaucoup plus rapides\" \/>\n<meta property=\"og:description\" content=\"Conformes au tout nouveau standard Bluetooth 4.2, tout comme aux r\u00e8glementations internationales et aux certifications du Bluetooth Special Interest Group (SIG), les circuits int\u00e9gr\u00e9s RF Bluetooth Low Energy (LE) IS1870 et IS1871 ainsi que le module BM70 viennent compl\u00e9ter le portefeuille existant de composants Bluetooth de Microchip. Les d\u00e9veloppeurs pourront facilement tirer parti de la faible consommation et de la simplicit\u00e9 de la connectivit\u00e9 du Bluetooth LE pour leurs applications d\u2019objets connect\u00e9s (IoT) et de balises Bluetooth.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/234786\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2015-11-09T23:00:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/cdn.eenewseurope.com\/wp-content\/uploads\/import\/default\/files\/import\/eci7481_microchip_mc1295-bluetooth-4-2hi.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"2100\" \/>\n\t<meta property=\"og:image:height\" content=\"1500\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"eeNews Europe\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" 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