{"id":233884,"date":"2015-08-04T22:00:00","date_gmt":"2015-08-04T22:00:00","guid":{"rendered":"https:\/\/eenewseurope.artwhere.co\/3eme-edition-du-workshop-leading-edge-embedded-nvm\/"},"modified":"2015-08-04T22:00:00","modified_gmt":"2015-08-04T22:00:00","slug":"3eme-edition-du-workshop-leading-edge-embedded-nvm","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/3eme-edition-du-workshop-leading-edge-embedded-nvm\/","title":{"rendered":"3\u00e8me \u00e9dition du workshop \u00a0\u00bb Leading-Edge Embedded NVM \u00ab\u00a0"},"content":{"rendered":"

Ce workshop dédiée aux Mémoires Non-Volatiles embarquées a pour objectif de rassembler les chercheurs et les industriels des deux bouts de la chaîne : designers et fabricants d’un côté et entrepreneurs et utilisateurs finaux de l’autre. e-NVM 2015 proposera sur 3 jours des conférences liés à la thématique autour des sessions suivantes : <\/p>\n

• Technologies de mémoires Flash embarquées (état de l’art et au-delà : fabricants et fondeurs), <\/p>\n

• Technologies émergentes et futures pour les Mémoires non volatiles embarquées <\/p>\n

• Appareils et architectures pour nouvelles technologies embarquées <\/p>\n

• Utilisateurs, focus sur les objets connectés, IoT <\/p>\n

Des orateurs internationaux de renom interviendront :
\nGlobal Foundries (Allemagne), Grace Semiconductor (Chine), ISSI (USA), Leti-CEA (France), Macronix (Taïwan), Panasonic (Japon), Safran\/Morpho (France), Samsung (Corée), SMIC (Chine), SST-Microchip (USA) ou encore STMicroelectronics (France et Italie) seront nos invités et vous présenteront les dernières tendances technologiques dans le domaine. <\/p>\n

Des sessions posters et un espace exposition :
\nLe workshop e-NVM proposera également une " session posters "  (CEA-Leti, LIRMM…) et une partie " Exposition " (Integrated System Solution Inc., ISSI, Starchip…). \n<\/p>\n

www.e-nvm.org<\/a><\/p>\n

\n

\n<\/p>\n

ARCSIS<\/strong>
\nARCSIS, Association pour la Recherche sur les Composants et Systèmes Intégrés Sécurisés a pour vocation d’encourager, accompagner et promouvoir la filière microélectronique et objets communicants en Provence-Alpes-Côte d’Azur au niveau national et international. Véritable relais de valorisation des savoir-faire, ARCSIS offre à ses membres l’opportunité de se découvrir, de s’apprécier et de mettre en commun leurs compétences techniques et humaines.
\nDepuis 2005 ARCSIS, assure la gouvernance du Centre Intégré de Microélectronique PACA (CIM PACA), programme de R&D unique en France, articulé autour de trois plates-formes mutualisées : <\/p>\n

– Caractérisation, dédiée aux recherches avancées sur les matériaux, les micro & nanostructures pour la microélectronique.<\/p>\n

– Micro-PackS qui a pour objectif de soutenir la communauté de la carte à puce en accompagnant son développement.<\/p>\n

– Conception centrée sur le développement de nouveaux designs et la validation de méthodologies pour les SoCs dans le domaine des Solutions Communicantes Sécurisées.<\/p>\n

<\/p>\n

ARCSIS se veut être également la structure associative de référence pour la filière microélectronique et objets communicants sécurisés dans la région PACA au sein du pôle de compétitivité mondial Solutions Communicantes Sécurisées.<\/p>\n

www.arcsis.org<\/a><\/p>\n

<\/p>\n","protected":false},"excerpt":{"rendered":"

Fort de son succ\u00e8s en 2013, ARCSIS (Association pour la Recherche sur les Composants et Syst\u00e8mes Int\u00e9gr\u00e9s S\u00e9curis\u00e9s) lance la 3\u00e8me \u00e9dition du workshop \u00a0\u00bb Leading-Edge Embedded NVM \u00ab\u00a0, du 28 au 30 septembre 2015, au Centre Micro\u00e9lectronique de Provence \u00e0 Gardanne (pr\u00e8s d’Aix-en-Provence, France), avec le soutien de l’\u201cEcole Nationale Sup\u00e9rieure des Mines de Saint-Etienne\u201d.<\/p>\n","protected":false},"author":22,"featured_media":233885,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[],"tags":[],"domains":[47],"ppma_author":[1149],"class_list":["post-233884","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","domains-electronique-eci"],"acf":[],"yoast_head":"3\u00e8me \u00e9dition du workshop " Leading-Edge Embedded NVM " ...<\/title>\n<meta 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