{"id":230392,"date":"2014-06-29T22:00:00","date_gmt":"2014-06-29T22:00:00","guid":{"rendered":"https:\/\/eenewseurope.artwhere.co\/bornes-pour-circuits-imprimes\/"},"modified":"2014-06-29T22:00:00","modified_gmt":"2014-06-29T22:00:00","slug":"bornes-pour-circuits-imprimes","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/bornes-pour-circuits-imprimes\/","title":{"rendered":"Bornes pour circuits imprim\u00e9s"},"content":{"rendered":"

Offrant des pas de 3.5, 5.0 ou 7.5 mm et trois angles d’orientation du conducteur (90°, 135° ou 180°), équipés de la technologie "PUSH IN", les OMNIMATE LSF-SMD répondent à la diversité des exigences terrain, s’adaptent aux circuits imprimés non traversants et permettent aux fabricants de cartes électroniques d’économiser du temps et de l’argent. Pour améliorer l’efficacité de leur production, les fabricants de cartes électroniques se tournent vers un processus de fabrication entièrement automatisé et en une seule passe, dans lequel les éléments de connexion sont traités en même temps que les autres composants. <\/p>\n

Conçues pour le processus de brasage au four à refusion CMS (composants montés en surface, SMD en anglais), les bornes de la nouvelle gamme Weidmüller PUSH IN OMNIMATE LSF-SMD satisfont toutes les exigences du montage en surface et peuvent être incorporées dans le même processus d’assemblage automatique que tous les autres composants CMS. Elles sont fabriquées en LCP, un matériau isolant résistant aux températures élevées qui peut être utilisé au four à refusion. Le LCP est conforme aux normes de sécurité incendie IEC 60335-1 standard pour appareils domestiques. <\/p>\n

Eléments primordiaux pour le process CMS, les bornes PUSH IN OMNIMATE LSF-SMD sont équipées de deux pattes de soudage par pôle qui garantissent une parfaite stabilité mécanique, conformément au standard IPC-A-610 Class 2. Ne nécessitant pas de harpons supplémentaires, ces bornes de 17.5A pour des sections de 1.5mm² conservent une compacité optimisée. \n<\/p>\n

\n

Dotées du système de connexion "PUSH IN", les bornes OMNIMATE LSF-SMD permettent le raccordement rapide et efficace des dispositifs. La technologie de connexion "PUSH IN" assure la connexion sûre de câbles rigides ou souples de section 0,2 à 1,5 mm2 (AWG 24-16), et ce sans aucun outil. <\/p>\n

Les bornes OMNIMATE LSF-SMD sont disponibles en trois pas principaux : 3.5, 5.0 et 7.5 mm et trois angles de raccordement 90°, 135° ou 180° pour satisfaire toutes les configurations. Les possibilités d’utilisation sont les suivantes : pas de 3.50 mm, 2 à 12 pôles; pas de 5.0 mm, 2 à 8 pôles ; pas de 7.50 mm, 2 à 6 pôles.<\/p>\n

Caractéristiques électriques :<\/strong>
\nIEC: 320 V, 17.5 A, section 0.2 à 1.5 mm2
\nUL: 300 V, 12 A, AWG 24 à 16                   \n<\/p>\n

www.weidmuller.fr<\/a> <\/p>\n","protected":false},"excerpt":{"rendered":"

Les bornes pour circuits imprim\u00e9s OMNIMATE LSF-SMD de Weidm\u00fcller garantissent une connexion efficace tout en offrant la libert\u00e9 n\u00e9cessaire pour une conception flexible et sur mesure. Jusqu’alors traversantes pour un assemblage en \u00a0\u00bb pin in paste \u00ab\u00a0, la s\u00e9rie LSF-SMT devient LSF-SMD avec ses broches \u00e0 plat pour un assemblage 100% CMS enti\u00e8rement automatis\u00e9.<\/p>\n","protected":false},"author":22,"featured_media":230393,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[],"domains":[47],"ppma_author":[1149],"class_list":["post-230392","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","domains-electronique-eci"],"acf":[],"yoast_head":"Bornes pour circuits imprim\u00e9s ...<\/title>\n<meta name=\"description\" content=\"Les bornes pour circuits imprim\u00e9s OMNIMATE LSF-SMD de Weidm\u00fcller garantissent une connexion efficace tout en offrant la libert\u00e9 n\u00e9cessaire pour une...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/230392\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Bornes pour circuits imprim\u00e9s\" \/>\n<meta property=\"og:description\" content=\"Les bornes pour circuits imprim\u00e9s OMNIMATE LSF-SMD de Weidm\u00fcller garantissent une connexion efficace tout en offrant la libert\u00e9 n\u00e9cessaire pour une conception flexible et sur mesure. 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