{"id":227650,"date":"2013-07-31T22:00:00","date_gmt":"2013-07-31T22:00:00","guid":{"rendered":"https:\/\/eenewseurope.artwhere.co\/nouvelle-technologie-de-conditionnement-pour-capteurs-mems\/"},"modified":"2013-07-31T22:00:00","modified_gmt":"2013-07-31T22:00:00","slug":"nouvelle-technologie-de-conditionnement-pour-capteurs-mems","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/nouvelle-technologie-de-conditionnement-pour-capteurs-mems\/","title":{"rendered":"Nouvelle technologie de conditionnement pour capteurs MEMS"},"content":{"rendered":"<p>Cette technologie unique pr&eacute;sente les avantages d&rsquo;une encapsulation totale du micro c&acirc;blage (wire bonding) sans risque de corrosion, de l&rsquo;&eacute;limination des risques d&rsquo;endommagement des fils de c&acirc;blage lors des op&eacute;rations de placement (pick and place), de l&rsquo;absence de risque de d&eacute;tachement ou d&eacute;t&eacute;rioration de l&rsquo;embout pendant le montage ainsi que de l&rsquo;absence d&rsquo;impact du processus de soudage sur le capteur, avec &agrave; la cl&eacute;, une solution de conditionnement plus robuste.<br \/>\nLe march&eacute; des capteurs de pression MEMS est en pleine croissance. Ceux destin&eacute;s pour applications grand public, notamment les smartphones et les tablettes num&eacute;riques, repr&eacute;senteront 1,7 milliard d&rsquo;unit&eacute;s et s&rsquo;imposeront comme la principale cible des MEMS au d&eacute;triment du secteur automobile, ajoutant un taux de croissance annuel moyen (CAGR) de 8 % au march&eacute; mondial des capteurs de pression MEMS.<br \/>\n&quot;Cette technologie marque une r&eacute;volution dans l&rsquo;am&eacute;lioration des performances et de la qualit&eacute; des capteurs de pression. STMicroelectronics est &agrave; l&rsquo;origine de l&rsquo;utilisation des bo&icirc;tiers enti&egrave;rement moul&eacute;s sans gel pour la fabrication d&rsquo;acc&eacute;l&eacute;rom&egrave;tres et gyroscopes en grands volumes&quot;, a d&eacute;clar&eacute; Benedetto Vigna, Executive Vice-President et directeur g&eacute;n&eacute;ral du groupe MEMS, Capteurs et Produits Analogiques de STMicroelectronics. &quot;Nous exploitons &agrave; pr&eacute;sent ces connaissances pour r&eacute;volutionner l&rsquo;utilisation de bo&icirc;tiers dans le domaine &eacute;mergent des capteurs de pression, un domaine o&ugrave; STMicroelectronics est le premier &agrave; utiliser une solution enti&egrave;rement moul&eacute;e sans gel pour r&eacute;aliser des capteurs de pression de hautes performances offrant une pr&eacute;cision accrue.&quot;<br \/>\nCette technologie am&eacute;liore la pr&eacute;cision, qui atteint &plusmn;0,2 mbar, tout en continuant &agrave; offrir une d&eacute;rive nulle, un faible bruit de 0,010 mbar eff. et un syst&egrave;me d&rsquo;&eacute;talonnage simplifi&eacute;, ce qui en fait une solution bien adapt&eacute;e &agrave; un large &eacute;ventail d&rsquo;applications industrielles, automobiles et grand public, telles que la navigation &agrave; l&rsquo;int&eacute;rieur de b&acirc;timents et en ext&eacute;rieur, les services de g&eacute;olocalisation, la navigation &agrave; l&rsquo;estime am&eacute;lior&eacute;e par GPS, les fonctions de barom&egrave;tre et altim&egrave;tre, les &eacute;quipements pour stations m&eacute;t&eacute;o et les applications de sant&eacute;.<\/p>\n<\/p>\n<p><a href=\"http:\/\/www.st.com\" target=\"_blank\" title=\"www.st.com\" rel=\"noopener\">www.st.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Pour la r\u00e9alisation de capteur de pression MEMS, la nouvelle technologie brevet\u00e9e de STMicroelectronics permet d\u2019isoler totalement l\u2019\u00e9l\u00e9ment de d\u00e9tection de pression \u00e0 l\u2019int\u00e9rieur d\u2019un bo\u00eetier enti\u00e8rement moul\u00e9. Cette technologie permettra de r\u00e9pondre aux exigences de la prochaine g\u00e9n\u00e9ration d\u2019appareils portables destin\u00e9s au grand public en termes de formats ultracompacts comme de la cr\u00e9ativit\u00e9 de conception.<\/p>\n","protected":false},"author":22,"featured_media":227651,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[],"tags":[],"domains":[47],"ppma_author":[1149],"class_list":["post-227650","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Nouvelle technologie de conditionnement pour capteurs MEMS ...<\/title>\n<meta name=\"description\" content=\"Pour la r\u00e9alisation de capteur de pression MEMS, la nouvelle technologie brevet\u00e9e de STMicroelectronics permet d\u2019isoler totalement l\u2019\u00e9l\u00e9ment de...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/227650\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Nouvelle technologie de conditionnement pour capteurs MEMS\" \/>\n<meta property=\"og:description\" content=\"Pour la r\u00e9alisation de capteur de pression MEMS, la nouvelle technologie brevet\u00e9e de STMicroelectronics permet d\u2019isoler totalement l\u2019\u00e9l\u00e9ment de d\u00e9tection de pression \u00e0 l\u2019int\u00e9rieur d\u2019un bo\u00eetier enti\u00e8rement moul\u00e9. 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