{"id":227362,"date":"2013-06-17T22:00:00","date_gmt":"2013-06-17T22:00:00","guid":{"rendered":"https:\/\/eenewseurope.artwhere.co\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/"},"modified":"2013-06-17T22:00:00","modified_gmt":"2013-06-17T22:00:00","slug":"stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/","title":{"rendered":"STMicroelectronics signe un accord de grande ampleur avec Rambus"},"content":{"rendered":"<p>Rambus pourra ainsi tirer parti des g&eacute;om&eacute;tries micro&eacute;lectroniques r&eacute;duites et de la faible consommation d&rsquo;&eacute;nergie qu&rsquo;offre la fili&egrave;re FD-SOI dans les noeuds de 28nm et inf&eacute;rieurs pour ses futures solutions d&rsquo;interface m&eacute;moire. Pour sa part, ST a obtenu des termes de licence avec la division de Rambus Cryptography Research, Inc (CRI) lui permettant de d&eacute;ployer dans une plus large gamme de produits les techniques de contremesures contre les attaques DPA (Differential Power Analysis, analyse de consommation diff&eacute;rentielle) ainsi que les circuits de s&eacute;curit&eacute; CryptoFirewall. Les attaques DPA utilisent la surveillance des fluctuations de la consommation &eacute;lectrique d&rsquo;un p&eacute;riph&eacute;rique vis&eacute; et appliquent des m&eacute;thodes statistiques pour extraire des cl&eacute;s cryptographiques et d&rsquo;autres informations secr&egrave;tes. Les contremesures DPA sont notamment utilis&eacute;es pour prot&eacute;ger les cl&eacute;s cryptographiques secr&egrave;tes qui s&eacute;curisent les transactions bancaires, les identit&eacute;s, la t&eacute;l&eacute;vision &agrave; p&eacute;age, les jeux vid&eacute;o, les smartphones, les applications gouvernementales, etc.<br \/>\nLes circuits CryptoFirewall sont des blocs de s&eacute;curit&eacute; mat&eacute;riels complets con&ccedil;us par CRI pour assurer un haut niveau de protection contre un large &eacute;ventail d&rsquo;attaques et tentatives de falsification.<br \/>\nLes termes de ce nouveau partenariat permettent &agrave; ST de renforcer la s&eacute;curit&eacute; de ses circuits int&eacute;gr&eacute;s pour d&eacute;codeurs num&eacute;riques de pointe et passerelles utilis&eacute;s dans des services multim&eacute;dias tels que la t&eacute;l&eacute;vision &agrave; p&eacute;age.<\/p>\n<p>&quot; <em>Cet accord avec Rambus est triplement gagnant pour les deux parties qui peuvent d&eacute;sormais partager et utiliser de fa&ccedil;on &eacute;tendue des technologies importantes rev&ecirc;tant une forte valeur pour notre entreprise, l&rsquo;industrie et nos clients<\/em><em> <\/em>&quot;, a d&eacute;clar&eacute; Gian Luca Bertino, vice-pr&eacute;sident ex&eacute;cutif du groupe Convergence Num&eacute;rique de STMicroelectronics<em>. &laquo; <\/em><em>Tandis que Rambus peut &agrave; pr&eacute;sent acc&eacute;der &agrave; notre technologie r&eacute;volutionnaire de fabrication FD-SOI pour ses projets, ST pourra accro&icirc;tre le niveau de s&eacute;curit&eacute; de ses puissants circuits int&eacute;gr&eacute;s pour d&eacute;codeurs num&eacute;riques et d&eacute;ployer des contremesures DPA dans tous les produits pertinents de sa gamme<\/em><em> <\/em>&raquo;.<\/p>\n<p>&laquo; <em>ST int&egrave;gre la technologie de contremesures DPA depuis plusieurs ann&eacute;es dans ses microcontr&ocirc;leurs s&eacute;curis&eacute;s et s&rsquo;est impos&eacute; comme un leader pour la s&eacute;curit&eacute; des donn&eacute;es<\/em><em> &raquo;<\/em>, a d&eacute;clar&eacute; Paul Kocher, pr&eacute;sident et directeur scientifique de la division Cryptography Research de Rambus. &laquo; <em>Avec ce nouvel accord de grande envergure b&eacute;n&eacute;fique pour les deux parties, notre technologie sera d&eacute;ploy&eacute;e dans un large &eacute;ventail de produits et d&rsquo;applications, et am&eacute;liorera la s&eacute;curit&eacute; des syst&egrave;mes num&eacute;riques au b&eacute;n&eacute;fice des clients<\/em><em>.<\/em> &raquo; En mettant un terme &agrave; toutes les actions en justice en cours, cet accord porte &eacute;galement sur l&rsquo;utilisation par ST des innovations de Rambus dans le domaine des liaisons s&eacute;rie et de ses interfaces m&eacute;moire brevet&eacute;es.\n<\/p>\n<p>\n<a href=\"http:\/\/www.st.com\" target=\"_blank\" title=\"www.st.com\" rel=\"noopener\">www.st.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>STMicroelectronics annonce la signature d&rsquo;un accord de grande envergure avec la soci\u00e9t\u00e9 Rambus, Inc. qui \u00e9tend les accords de licence existants entre les deux entreprises, met un terme \u00e0 toutes les actions en justice en cours, et engage les deux entreprises \u00e0 \u00e9tudier de nouvelles possibilit\u00e9s de collaboration. Cet accord en plusieurs volets permet \u00e0 Rambus d&rsquo;acc\u00e9der \u00e0 l&rsquo;environnement de conception bas\u00e9 sur la technologie Silicium sur isolant totalement d\u00e9pl\u00e9t\u00e9e FD-SOI (Fully Depleted-Silicon-On-Insulator) de ST. <\/p>\n","protected":false},"author":22,"featured_media":227363,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[],"tags":[],"domains":[47],"ppma_author":[1149],"class_list":["post-227362","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","domains-electronique-eci"],"acf":[],"yoast_head":"<title>STMicroelectronics signe un accord de grande ampleur avec Rambus ...<\/title>\n<meta name=\"description\" content=\"STMicroelectronics annonce la signature d&#039;un accord de grande envergure avec la soci\u00e9t\u00e9 Rambus, Inc. qui \u00e9tend les accords de licence existants entre les...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/227362\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"STMicroelectronics signe un accord de grande ampleur avec Rambus\" \/>\n<meta property=\"og:description\" content=\"STMicroelectronics annonce la signature d&#039;un accord de grande envergure avec la soci\u00e9t\u00e9 Rambus, Inc. qui \u00e9tend les accords de licence existants entre les deux entreprises, met un terme \u00e0 toutes les actions en justice en cours, et engage les deux entreprises \u00e0 \u00e9tudier de nouvelles possibilit\u00e9s de collaboration. Cet accord en plusieurs volets permet \u00e0 Rambus d&#039;acc\u00e9der \u00e0 l&#039;environnement de conception bas\u00e9 sur la technologie Silicium sur isolant totalement d\u00e9pl\u00e9t\u00e9e FD-SOI (Fully Depleted-Silicon-On-Insulator) de ST.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/227362\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2013-06-17T22:00:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/import\/thumbnail134x115%20(102).jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"134\" \/>\n\t<meta property=\"og:image:height\" content=\"115\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"eeNews Europe\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" 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Rambus\",\"datePublished\":\"2013-06-17T22:00:00+00:00\",\"dateModified\":\"2013-06-17T22:00:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/\"},\"wordCount\":612,\"publisher\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\"},\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/\",\"url\":\"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/\",\"name\":\"STMicroelectronics signe un accord de grande ampleur avec Rambus -\",\"isPartOf\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\"},\"datePublished\":\"2013-06-17T22:00:00+00:00\",\"dateModified\":\"2013-06-17T22:00:00+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.ecinews.fr\/fr\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"STMicroelectronics signe un accord de grande ampleur avec Rambus\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"name\":\"EENewsEurope\",\"description\":\"Just another WordPress site\",\"publisher\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\",\"name\":\"EENewsEurope\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"contentUrl\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"width\":283,\"height\":113,\"caption\":\"EENewsEurope\"},\"image\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/9eff4051fa9dac8230052de45e32b0f4\",\"name\":\"eeNews Europe\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/fae8f0cb15861c4ae0ed4872e2c9fc22\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/5081509054e28b04ecd976976e723ce0?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/5081509054e28b04ecd976976e723ce0?s=96&d=mm&r=g\",\"caption\":\"eeNews Europe\"}}]}<\/script>","yoast_head_json":{"title":"STMicroelectronics signe un accord de grande ampleur avec Rambus ...","description":"STMicroelectronics annonce la signature d'un accord de grande envergure avec la soci\u00e9t\u00e9 Rambus, Inc. qui \u00e9tend les accords de licence existants entre les...","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/227362\/","og_locale":"fr_FR","og_type":"article","og_title":"STMicroelectronics signe un accord de grande ampleur avec Rambus","og_description":"STMicroelectronics annonce la signature d'un accord de grande envergure avec la soci\u00e9t\u00e9 Rambus, Inc. qui \u00e9tend les accords de licence existants entre les deux entreprises, met un terme \u00e0 toutes les actions en justice en cours, et engage les deux entreprises \u00e0 \u00e9tudier de nouvelles possibilit\u00e9s de collaboration. Cet accord en plusieurs volets permet \u00e0 Rambus d'acc\u00e9der \u00e0 l'environnement de conception bas\u00e9 sur la technologie Silicium sur isolant totalement d\u00e9pl\u00e9t\u00e9e FD-SOI (Fully Depleted-Silicon-On-Insulator) de ST.","og_url":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/227362\/","og_site_name":"EENewsEurope","article_published_time":"2013-06-17T22:00:00+00:00","og_image":[{"width":134,"height":115,"url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/import\/thumbnail134x115 (102).jpg","type":"image\/jpeg"}],"author":"eeNews Europe","twitter_card":"summary_large_image","twitter_misc":{"Written by":"eeNews Europe","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/#article","isPartOf":{"@id":"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/"},"author":{"name":"eeNews Europe","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/9eff4051fa9dac8230052de45e32b0f4"},"headline":"STMicroelectronics signe un accord de grande ampleur avec Rambus","datePublished":"2013-06-17T22:00:00+00:00","dateModified":"2013-06-17T22:00:00+00:00","mainEntityOfPage":{"@id":"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/"},"wordCount":612,"publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"inLanguage":"fr-FR"},{"@type":"WebPage","@id":"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/","url":"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/","name":"STMicroelectronics signe un accord de grande ampleur avec Rambus -","isPartOf":{"@id":"https:\/\/www.eenewseurope.com\/en\/#website"},"datePublished":"2013-06-17T22:00:00+00:00","dateModified":"2013-06-17T22:00:00+00:00","breadcrumb":{"@id":"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.ecinews.fr\/fr\/stmicroelectronics-signe-un-accord-de-grande-ampleur-avec-rambus\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.ecinews.fr\/fr\/"},{"@type":"ListItem","position":2,"name":"STMicroelectronics signe un accord de grande ampleur avec Rambus"}]},{"@type":"WebSite","@id":"https:\/\/www.eenewseurope.com\/en\/#website","url":"https:\/\/www.eenewseurope.com\/en\/","name":"EENewsEurope","description":"Just another WordPress site","publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"fr-FR"},{"@type":"Organization","@id":"https:\/\/www.eenewseurope.com\/en\/#organization","name":"EENewsEurope","url":"https:\/\/www.eenewseurope.com\/en\/","logo":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/","url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","contentUrl":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","width":283,"height":113,"caption":"EENewsEurope"},"image":{"@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/9eff4051fa9dac8230052de45e32b0f4","name":"eeNews Europe","image":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/fae8f0cb15861c4ae0ed4872e2c9fc22","url":"https:\/\/secure.gravatar.com\/avatar\/5081509054e28b04ecd976976e723ce0?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/5081509054e28b04ecd976976e723ce0?s=96&d=mm&r=g","caption":"eeNews Europe"}}]}},"authors":[{"term_id":1149,"user_id":22,"is_guest":0,"slug":"eenews-europe","display_name":"eeNews Europe","avatar_url":"https:\/\/secure.gravatar.com\/avatar\/5081509054e28b04ecd976976e723ce0?s=96&d=mm&r=g","0":null,"1":"","2":"","3":"","4":"","5":"","6":"","7":"","8":""}],"_links":{"self":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/227362"}],"collection":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/users\/22"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/comments?post=227362"}],"version-history":[{"count":0,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/227362\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media\/227363"}],"wp:attachment":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media?parent=227362"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/categories?post=227362"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/tags?post=227362"},{"taxonomy":"domains","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/domains?post=227362"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/ppma_author?post=227362"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}