{"id":224585,"date":"2012-06-20T22:00:00","date_gmt":"2012-06-20T22:00:00","guid":{"rendered":"https:\/\/eenewseurope.artwhere.co\/chipset-3eme-generation-pour-des-smartphones-moins-epais\/"},"modified":"2012-06-20T22:00:00","modified_gmt":"2012-06-20T22:00:00","slug":"chipset-3eme-generation-pour-des-smartphones-moins-epais","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/chipset-3eme-generation-pour-des-smartphones-moins-epais\/","title":{"rendered":"Chipset 3\u00e8me g\u00e9n\u00e9ration pour des smartphones moins \u00e9pais"},"content":{"rendered":"<p class=\"MsoNormal\" style=\"margin-bottom:0cm;margin-bottom:.0001pt\">Ce circuit r&eacute;pond &agrave; tous les besoins de gestion d&rsquo;&eacute;nergie, de charge et de multiplexage USB. Il offre un compromis optimum entre encombrement et souplesse pour alimenter les processeurs d&rsquo;applications et de bande de base Samsung. Il maximise la dur&eacute;e de vie de la batterie et am&eacute;liore la connectivit&eacute; USB. Capable de g&eacute;rer l&rsquo;&eacute;nergie de plus de 60 canaux, ce chipset offre un rendement de conversion jusqu&rsquo;&agrave; 20% sup&eacute;rieur par rapport &agrave; la g&eacute;n&eacute;ration pr&eacute;c&eacute;dente. Son architecture &agrave; sous-r&eacute;gulation et les uniques r&eacute;gulateurs Green Mode (mode &quot;vert&quot;) associ&eacute;s au processus propri&eacute;taire de fabrication &agrave; basse consommation et &agrave; g&eacute;om&eacute;trie submicronique, prolonge la vie de la batterie en veille comme en fonctionnement. Il permet aussi une charge plus rapide de la batterie avec un minimum d&rsquo;&eacute;chauffement. Son niveau d&rsquo;int&eacute;gration &eacute;lev&eacute; et sa conception avanc&eacute;e permettent de r&eacute;duire l&rsquo;encombrement, l&rsquo;&eacute;paisseur et le nombre de composants externes pour obtenir des smartphones encore plus minces.<\/p>\n<p class=\"MsoNormal\" style=\"margin-bottom:0cm;margin-bottom:.0001pt\">&quot;Les clients exigent la plus petite solution d&rsquo;alimentation possible, avec le meilleur rendement possible, pour permettre aux utilisateurs finaux de profiter de fonctionnalit&eacute;s multim&eacute;dia pendant toute une journ&eacute;e,&quot; d&eacute;clare Chae Lee, Vice-Pr&eacute;sident Senior du groupe Mobilit&eacute; chez Maxim Integrated Products. &quot;Notre Power SoC permet de r&eacute;duire l&rsquo;encombrement li&eacute; &agrave; l&rsquo;alimentation de 30%, tout en offrant un rendement jusqu&rsquo;&agrave; 20% sup&eacute;rieur, par rapport &agrave; la g&eacute;n&eacute;ration pr&eacute;c&eacute;dente.&quot; Ce chipset int&egrave;gre trois Power SoC. Le premier est optimis&eacute; pour alimenter efficacement le processeur d&rsquo;applications Exynos 4412. Le deuxi&egrave;me alimente le processeur de bande de base LTE (4G), pour des communications voix et donn&eacute;es plus fiables et plus rapides. Et enfin, le troisi&egrave;me offre plusieurs fonctions int&eacute;gr&eacute;es, notamment un chargeur de batterie, un driver de moteur &quot;haptique&quot; (retour tactile), et une technologie ModelGauge ultra-pr&eacute;cise capable d&rsquo;optimiser la vie de la batterie, tout en permettant l&rsquo;utilisation d&rsquo;un connecteur USB unique pour charger ou connecter les diff&eacute;rents accessoires.<\/p>\n<p class=\"MsoNormal\" style=\"margin-bottom:0cm;margin-bottom:.0001pt\">&nbsp;<\/p>\n<p><a title=\"www.maxim-ic.com\" target=\"_blank\" href=\"http:\/\/www.maxim-ic.com\" rel=\"noopener\">www.maxim-ic.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Maxim Integrated Products vient d&rsquo;annoncer que le chipset troisi\u00e8me g\u00e9n\u00e9ration TINI Power SoC qui \u00e9quipe le Galaxy S III, pouvait \u00eatre associ\u00e9 au processeur d&rsquo;applications quadruple-coeur Exynos 4412 pour produire des smartphones plus petits, plus minces, et pr\u00e9sentant de meilleurs rendements.<\/p>\n","protected":false},"author":22,"featured_media":224586,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[],"domains":[47],"ppma_author":[1149],"class_list":["post-224585","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Chipset 3\u00e8me g\u00e9n\u00e9ration pour des smartphones moins \u00e9pais ...<\/title>\n<meta name=\"description\" content=\"Maxim Integrated Products vient d&#039;annoncer que le chipset troisi\u00e8me g\u00e9n\u00e9ration TINI Power SoC qui \u00e9quipe le Galaxy S III, pouvait \u00eatre associ\u00e9 au...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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