{"id":222327,"date":"2011-08-29T22:00:00","date_gmt":"2011-08-29T22:00:00","guid":{"rendered":"https:\/\/eenewseurope.artwhere.co\/samsung-developpe-une-memoire-verte-ddr3-32-go-de-classe-30-nm\/"},"modified":"2011-08-29T22:00:00","modified_gmt":"2011-08-29T22:00:00","slug":"samsung-developpe-une-memoire-verte-ddr3-32-go-de-classe-30-nm","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/samsung-developpe-une-memoire-verte-ddr3-32-go-de-classe-30-nm\/","title":{"rendered":"Samsung d\u00e9veloppe une m\u00e9moire verte DDR3 32 Go de classe 30 nm"},"content":{"rendered":"<p>&quot; Ces modules RDIMM 32 Go prennent compl&egrave;tement en charge les contraintes haute densit&eacute; et performance &eacute;lev&eacute;e des serveurs haute capacit&eacute; de la prochaine g&eacute;n&eacute;ration &quot; a d&eacute;clar&eacute; Wanhoon Hong, vice-pr&eacute;sident ex&eacute;cutif, ventes et marketing m&eacute;moire, Device Solutions, Samsung Electronics. &quot; Nous continuerons &agrave; fournir des solutions de m&eacute;moire avec davantage de performance et de densit&eacute;, tout en am&eacute;liorant la valeur partag&eacute;e dans la conception de syst&egrave;mes de serveur toujours plus verts &quot;, a-t-il ajout&eacute;. Le nouveau module RDIMM 32 Go avec la technologie d&rsquo;assemblage TSV 3D repose sur la DDR3 4 Gb de classe 30 nm. Il peut transmettre &agrave; des vitesses pouvant atteindre 1333 m&eacute;gabits par seconde (Mbps), un gain de 70 % par rapport aux modules RDIMM 32 Go quad-rank pr&eacute;c&eacute;dents dont les vitesses op&eacute;rationnelles &eacute;taient de 800 Mbps. En outre, le module de 32 Go ne consomme que 4,5 watts par heure &#8211; soit le niveau de consommation le plus faible des modules de m&eacute;moire adopt&eacute;s pour utilisation dans les serveurs d&rsquo;entreprise. Si on le compare au module LRDIMM (Load-reduced dual-inline memory module) 32 Go de classe 30 nm, qui pr&eacute;sente des avantages dans la construction de solutions de m&eacute;moire 32 Go ou plus, le nouveau module 32 Go permet 30 % environ d&rsquo;&eacute;conomies d&rsquo;&eacute;nergie suppl&eacute;mentaires. Ces &eacute;conomies sont directement imputables &agrave; l&rsquo;adoption de la technologie TSV, qui permet &agrave; un empilement de puces de fonctionner &agrave; des niveaux comparables &agrave; une seule puce silicone en raccourcissant significativement les circuits de transmission, abaissant de ce fait la consommation d&rsquo;&eacute;nergie et permettant une densit&eacute; et une vitesse de fonctionnement plus &eacute;lev&eacute;es.<br \/>\n<a target=\"_blank\" href=\"https:\/\/intranet.tim-europe.com\/owa\/redir.aspx?C=80e2fb1b2a5f4a009842386d799b25d4&amp;URL=http%3a%2f%2fwww.samsung.com%2fGreenMemory\" rel=\"noopener\">www.samsung.com\/GreenMemory<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Samsung vient d&rsquo;annoncer le d\u00e9veloppement de modules RDIMM (Registered Dual Inline Memory) DDR3 (double data rate-3) de 32 Go qui utilisent la 3D gr\u00e2ce \u00e0 la technologie d&rsquo;assemblage TSV (Through Silicon Via). La technologie avanc\u00e9e de classe 30 nm exploite les fonctions de puissance et de performance du module pour fournir une solution m\u00e9moire substantiellement plus verte que les modules pr\u00e9c\u00e9dents \u00e0 base de classe 40 nm. Des \u00e9chantillons phase ES (Engineering Samples) ont \u00e9t\u00e9 distribu\u00e9s pour \u00e9valuation.<\/p>\n","protected":false},"author":22,"featured_media":222328,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[],"tags":[],"domains":[47],"ppma_author":[1149],"class_list":["post-222327","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Samsung d\u00e9veloppe une m\u00e9moire verte DDR3 32 Go de classe 30 nm ...<\/title>\n<meta name=\"description\" content=\"Samsung vient d&#039;annoncer le d\u00e9veloppement de modules RDIMM (Registered Dual Inline Memory) DDR3 (double data rate-3) de 32 Go qui utilisent la 3D gr\u00e2ce \u00e0...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/222327\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Samsung d\u00e9veloppe une m\u00e9moire verte DDR3 32 Go de classe 30 nm\" \/>\n<meta property=\"og:description\" content=\"Samsung vient d&#039;annoncer le d\u00e9veloppement de modules RDIMM (Registered Dual Inline Memory) DDR3 (double data rate-3) de 32 Go qui utilisent la 3D gr\u00e2ce \u00e0 la technologie d&#039;assemblage TSV (Through Silicon Via). La technologie avanc\u00e9e de classe 30 nm exploite les fonctions de puissance et de performance du module pour fournir une solution m\u00e9moire substantiellement plus verte que les modules pr\u00e9c\u00e9dents \u00e0 base de classe 40 nm. 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