{"id":186775,"date":"2017-01-06T03:00:00","date_gmt":"2017-01-06T03:00:00","guid":{"rendered":"https:\/\/eenewseurope.artwhere.co\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/"},"modified":"2017-01-06T03:00:00","modified_gmt":"2017-01-06T03:00:00","slug":"modules-com-haut-de-gamme-dopant-linformatique-embarquee","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/","title":{"rendered":"Modules COM haut de gamme dopant l&rsquo;informatique embarqu\u00e9e"},"content":{"rendered":"<p>Les applications vis\u00e9es par ces Server-on-Modules COM Express Type 6 haut de gamme r\u00e9sident partout o\u00f9 des flux de donn\u00e9es intensifs doivent \u00eatre trait\u00e9s et affich\u00e9s en temps r\u00e9el. Les march\u00e9s concern\u00e9s seront donc les clouds embarqu\u00e9s de traitement de donn\u00e9es, les serveurs edge et fog, les syst\u00e8mes d&rsquo;imagerie m\u00e9dicale, la vid\u00e9o surveillance et le contr\u00f4le de qualit\u00e9 par la vision. Ils conviennent \u00e9galement aux \u00e9quipements de simulation, aux syst\u00e8mes h\u00f4tes pour la technologie de contr\u00f4le virtualis\u00e9e, aux syst\u00e8mes de vision dans les salles de contr\u00f4le industriel et autres syst\u00e8mes de supervision en usine ainsi qu\u2019au jeu professionnel haut de gamme et \u00e0 la signalisation num\u00e9rique.<\/p>\n<p>Par rapport \u00e0 leurs pr\u00e9d\u00e9cesseurs Skylake, ces modules apportent des fr\u00e9quences et des performances CPU plus \u00e9lev\u00e9es, des traitements graphiques HDR plus dynamiques gr\u00e2ce aux codecs vid\u00e9os 10 bits. De plus, ils prennent en charge la m\u00e9moire Intel Optane 3D super rapide bas\u00e9e sur XPoint. Par comparaison avec les variantes monopuces des processeurs Intel Core Gen 7, les versions double puce \u00e9tablissent le nec plus ultra pour les applications Server-on-Module et les utilisations embarqu\u00e9es haut de gamme avec hyper threading \u00e0 l&rsquo;int\u00e9rieur d&rsquo;une enveloppe thermique embarqu\u00e9e jusqu&rsquo;\u00e0 45 W.<\/p>\n<p>Les applications \u00e0 d\u00e9bit intense b\u00e9n\u00e9ficieront jusqu&rsquo;\u00e0 32 gigaoctets de m\u00e9moire dual channel DDR3 2400, incluant l&rsquo;option ECC. Quant \u00e0 l&rsquo;exp\u00e9rience visuelle, ces modules poss\u00e8dent le dernier traitement graphique Intel HD630 qui prend en charge jusqu&rsquo;\u00e0 trois \u00e9crans ind\u00e9pendants avec jusqu&rsquo;\u00e0 4 k \u00e0 60 Hz via DisplayPort 1.4 et HDMI 2.0, tous deux avec HDCP 2.2 et eDP 1.4. De plus, ils proposent aussi le LVDS et VGA dual channel pour les \u00e9crans existants. Gr\u00e2ce au codage\/d\u00e9codage 10 bits acc\u00e9l\u00e9r\u00e9 en hardware et \u00e0 la gamme dynamique \u00e9lev\u00e9e du HEVC et VP9, les flux HD deviennent plus vifs et r\u00e9alistes dans les deux directions.<\/p>\n<hr \/>\n<p>Ces modules offrent les interfaces d&rsquo;E\/S standards d&rsquo;un brochage de Type 6. Les extensions puissantes comme la m\u00e9moire Intel Optane peuvent \u00eatre connect\u00e9es via les voies PCI Express Gen 3.0. Quatre ports SATA 6G avec prise en charge RAID0\/1 sont propos\u00e9s pour un media de stockage conventionnel. Parmi les autres interfaces d&rsquo;E\/S, ils disposent d\u2019un port Gigabit Ethernet avec prise en charge d&rsquo;Intel AMT, de diff\u00e9rents ports USB 3.0, USB 2.0, HAD, GPIO, LPC, SPI,ainsi que d\u2019un bus I2C et 2 UART. Ils prennent en charge les versions 64 bits de Microsoft Windows 10 et Windows 10 IoT ainsi que tous les syst\u00e8mes d&rsquo;exploitation Linux.<\/p>\n<p><a href=\"http:\/\/www.congatec.com\/en\/products\/com-express-type6\/conga-ts175.html\" target=\"_blank\" rel=\"noopener\">www.congatec.com\/conga-ts175<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>La gamme COM Express Basic de congatec s\u2019\u00e9toffe avec le Computer-on-Module de hautes performances conga-TS175. Dot\u00e9 des puissantes versions double puce des derniers processeurs Intel Xeon et Intel Core Gen 7 (Kaby Lake), il \u00e9tablit une nouvelle r\u00e9f\u00e9rence pour les modules informatiques embarqu\u00e9s haut de gamme et les stations de travail industrielles modulaires qui doivent traiter des volumes massifs.<\/p>\n","protected":false},"author":9,"featured_media":186776,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[894],"domains":[47],"ppma_author":[1141],"class_list":["post-186775","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","tag-boards-embedded-cards-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Modules COM haut de gamme dopant l&#039;informatique embarqu\u00e9e ...<\/title>\n<meta name=\"description\" content=\"La gamme COM Express Basic de congatec s\u2019\u00e9toffe avec le Computer-on-Module de hautes performances conga-TS175. Dot\u00e9 des puissantes versions double puce...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/186775\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Modules COM haut de gamme dopant l&#039;informatique embarqu\u00e9e\" \/>\n<meta property=\"og:description\" content=\"La gamme COM Express Basic de congatec s\u2019\u00e9toffe avec le Computer-on-Module de hautes performances conga-TS175. Dot\u00e9 des puissantes versions double puce des derniers processeurs Intel Xeon et Intel Core Gen 7 (Kaby Lake), il \u00e9tablit une nouvelle r\u00e9f\u00e9rence pour les modules informatiques embarqu\u00e9s haut de gamme et les stations de travail industrielles modulaires qui doivent traiter des volumes massifs.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/186775\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2017-01-06T03:00:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci8264_congatec_module_com_r.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"363\" \/>\n\t<meta property=\"og:image:height\" content=\"257\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Alain Dieul\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Alain Dieul\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/\"},\"author\":{\"name\":\"Alain Dieul\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf\"},\"headline\":\"Modules COM haut de gamme dopant l&rsquo;informatique embarqu\u00e9e\",\"datePublished\":\"2017-01-06T03:00:00+00:00\",\"dateModified\":\"2017-01-06T03:00:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/\"},\"wordCount\":460,\"publisher\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\"},\"keywords\":[\"Boards &amp; Embedded Cards\"],\"articleSection\":[\"Nouveaux produits\"],\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/\",\"url\":\"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/\",\"name\":\"Modules COM haut de gamme dopant l'informatique embarqu\u00e9e -\",\"isPartOf\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\"},\"datePublished\":\"2017-01-06T03:00:00+00:00\",\"dateModified\":\"2017-01-06T03:00:00+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.ecinews.fr\/fr\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Modules COM haut de gamme dopant l&rsquo;informatique embarqu\u00e9e\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"name\":\"EENewsEurope\",\"description\":\"Just another WordPress site\",\"publisher\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\",\"name\":\"EENewsEurope\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"contentUrl\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"width\":283,\"height\":113,\"caption\":\"EENewsEurope\"},\"image\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf\",\"name\":\"Alain Dieul\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/6d32dc651fbcef3b338066625b118364\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g\",\"caption\":\"Alain Dieul\"}}]}<\/script>","yoast_head_json":{"title":"Modules COM haut de gamme dopant l'informatique embarqu\u00e9e ...","description":"La gamme COM Express Basic de congatec s\u2019\u00e9toffe avec le Computer-on-Module de hautes performances conga-TS175. Dot\u00e9 des puissantes versions double puce...","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/186775\/","og_locale":"fr_FR","og_type":"article","og_title":"Modules COM haut de gamme dopant l'informatique embarqu\u00e9e","og_description":"La gamme COM Express Basic de congatec s\u2019\u00e9toffe avec le Computer-on-Module de hautes performances conga-TS175. Dot\u00e9 des puissantes versions double puce des derniers processeurs Intel Xeon et Intel Core Gen 7 (Kaby Lake), il \u00e9tablit une nouvelle r\u00e9f\u00e9rence pour les modules informatiques embarqu\u00e9s haut de gamme et les stations de travail industrielles modulaires qui doivent traiter des volumes massifs.","og_url":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/186775\/","og_site_name":"EENewsEurope","article_published_time":"2017-01-06T03:00:00+00:00","og_image":[{"width":363,"height":257,"url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci8264_congatec_module_com_r.jpg","type":"image\/jpeg"}],"author":"Alain Dieul","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Alain Dieul","Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/#article","isPartOf":{"@id":"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/"},"author":{"name":"Alain Dieul","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf"},"headline":"Modules COM haut de gamme dopant l&rsquo;informatique embarqu\u00e9e","datePublished":"2017-01-06T03:00:00+00:00","dateModified":"2017-01-06T03:00:00+00:00","mainEntityOfPage":{"@id":"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/"},"wordCount":460,"publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"keywords":["Boards &amp; Embedded Cards"],"articleSection":["Nouveaux produits"],"inLanguage":"fr-FR"},{"@type":"WebPage","@id":"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/","url":"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/","name":"Modules COM haut de gamme dopant l'informatique embarqu\u00e9e -","isPartOf":{"@id":"https:\/\/www.eenewseurope.com\/en\/#website"},"datePublished":"2017-01-06T03:00:00+00:00","dateModified":"2017-01-06T03:00:00+00:00","breadcrumb":{"@id":"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.ecinews.fr\/fr\/modules-com-haut-de-gamme-dopant-linformatique-embarquee\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.ecinews.fr\/fr\/"},{"@type":"ListItem","position":2,"name":"Modules COM haut de gamme dopant l&rsquo;informatique embarqu\u00e9e"}]},{"@type":"WebSite","@id":"https:\/\/www.eenewseurope.com\/en\/#website","url":"https:\/\/www.eenewseurope.com\/en\/","name":"EENewsEurope","description":"Just another WordPress site","publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"fr-FR"},{"@type":"Organization","@id":"https:\/\/www.eenewseurope.com\/en\/#organization","name":"EENewsEurope","url":"https:\/\/www.eenewseurope.com\/en\/","logo":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/","url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","contentUrl":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","width":283,"height":113,"caption":"EENewsEurope"},"image":{"@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf","name":"Alain Dieul","image":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/6d32dc651fbcef3b338066625b118364","url":"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g","caption":"Alain Dieul"}}]}},"authors":[{"term_id":1141,"user_id":9,"is_guest":0,"slug":"alaindieul","display_name":"Alain Dieul","avatar_url":"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g","0":null,"1":"","2":"","3":"","4":"","5":"","6":"","7":"","8":""}],"_links":{"self":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/186775"}],"collection":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/comments?post=186775"}],"version-history":[{"count":0,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/186775\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media\/186776"}],"wp:attachment":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media?parent=186775"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/categories?post=186775"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/tags?post=186775"},{"taxonomy":"domains","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/domains?post=186775"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/ppma_author?post=186775"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}