{"id":186771,"date":"2017-01-09T04:00:00","date_gmt":"2017-01-09T04:00:00","guid":{"rendered":"https:\/\/eenewseurope.artwhere.co\/solution-de-gestion-thermique-pour-les-espaces-extremement-fins\/"},"modified":"2017-01-09T04:00:00","modified_gmt":"2017-01-09T04:00:00","slug":"solution-de-gestion-thermique-pour-les-espaces-extremement-fins","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/solution-de-gestion-thermique-pour-les-espaces-extremement-fins\/","title":{"rendered":"Solution de gestion thermique pour les espaces extr\u00eamement fins"},"content":{"rendered":"

Le MIT est un composant essentiel dans la majorit\u00e9 des syst\u00e8mes \u00e9lectroniques de puissance. La chaleur des semi-conducteurs doit \u00eatre transf\u00e9r\u00e9e vers un puits thermique avant d’\u00eatre dissip\u00e9e.
\nLe Soft-PGS est une feuille de graphite de 200 \u00b5m d’\u00e9paisseur con\u00e7ue pour \u00eatre utilis\u00e9e comme mat\u00e9riau d’interface thermique pour les modules IGBT. Pouvant \u00eatre compress\u00e9 de 40%, il offre une excellente solution pour r\u00e9duire consid\u00e9rablement la r\u00e9sistance thermique entre le dissipateur thermique et le module IGBT.<\/p>\n

Facile \u00e0 mettre en place, cette feuille de 200 \u00b5m d’\u00e9paisseur repr\u00e9sente des co\u00fbts de main-d’\u0153uvre et d’installation bien plus bas qu’une graisse thermique ou un mat\u00e9riau \u00e0 changement de phase. Elle garantit une stabilit\u00e9 thermique jusqu’\u00e0 400 \u00b0C et pr\u00e9sente une fiabilit\u00e9 \u00e9lev\u00e9e pour les cycles thermiques intenses de -55 \u00b0C \u00e0 +150 \u00b0C. Sa conductivit\u00e9 thermique est garantie \u00e0 400 W\/mK dans la direction X-Y, et \u00e0 30 W\/mK dans la direction Z.
\nUne vaste gamme de feuilles standard est propos\u00e9e pour plusieurs modules IGBT de diff\u00e9rents fournisseurs.<\/p>\n

\u00ab\u00a0La r\u00e9duction du volume du dissipateur thermique conjugu\u00e9e \u00e0 une augmentation des densit\u00e9s de puissance locales entra\u00eene une hausse des contraintes au niveau de l’interface thermique connectant les composants \u00e9lectroniques de puissance au dissipateur thermique. Une couche de MIT p\u00e2teux appliqu\u00e9e en dessous d’un module n’aura jamais une \u00e9paisseur homog\u00e8ne et, par ailleurs, la plupart des solutions thermiques p\u00e2teuses finissent par vieillir et se d\u00e9grader,\u00a0\u00bb explique Simone Saile, Product Manager Thermal Solutions & Ceramic Devices chez Panasonic. \u00ab\u00a0Par rapport aux graisses thermiques et aux MCP, le Soft-PGS convient bien mieux aux surfaces in\u00e9gales et offre une exploitabilit\u00e9, une fiabilit\u00e9 et une stabilit\u00e9 thermique sup\u00e9rieures.\u00a0\u00bb<\/p>\n

eu.industrial.panasonic.com\/soft-pgs<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Mat\u00e9riau d’interface thermique (MIT) \u00e0 compressibilit\u00e9 \u00e9lev\u00e9e, le Soft-PGS de Panasonic Automotive & Industrial Systems est destin\u00e9 \u00e0 r\u00e9duire la r\u00e9sistance thermique de contact entre les surfaces irr\u00e9guli\u00e8res dans les espaces extr\u00eamement fins. Il am\u00e9liore le couplage thermique entre les \u00e9l\u00e9ments producteurs de chaleur (sources thermiques) et les dispositifs de dissipation de chaleur (dissipateurs thermiques).<\/p>\n","protected":false},"author":9,"featured_media":186772,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[881],"tags":[913],"domains":[47],"ppma_author":[1141],"class_list":["post-186771","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-nouveaux-produits","tag-materials-processes-fr","domains-electronique-eci"],"acf":[],"yoast_head":"Solution de gestion thermique pour les espaces extr\u00eamement fins ...<\/title>\n<meta name=\"description\" content=\"Mat\u00e9riau d'interface thermique (MIT) \u00e0 compressibilit\u00e9 \u00e9lev\u00e9e, le Soft-PGS de Panasonic Automotive & Industrial Systems est destin\u00e9 \u00e0 r\u00e9duire la...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/186771\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Solution de gestion thermique pour les espaces extr\u00eamement fins\" \/>\n<meta property=\"og:description\" content=\"Mat\u00e9riau d'interface thermique (MIT) \u00e0 compressibilit\u00e9 \u00e9lev\u00e9e, le Soft-PGS de Panasonic Automotive & Industrial Systems est destin\u00e9 \u00e0 r\u00e9duire la r\u00e9sistance thermique de contact entre les surfaces irr\u00e9guli\u00e8res dans les espaces extr\u00eamement fins. Il am\u00e9liore le couplage thermique entre les \u00e9l\u00e9ments producteurs de chaleur (sources thermiques) et les dispositifs de dissipation de chaleur (dissipateurs thermiques).\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/186771\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2017-01-09T04:00:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci8265_panasonic_1216_soft_pgs_r-scaled.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"2560\" \/>\n\t<meta property=\"og:image:height\" content=\"1994\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Alain Dieul\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta 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