{"id":158778,"date":"2022-01-16T15:15:25","date_gmt":"2022-01-16T15:15:25","guid":{"rendered":"https:\/\/eenewseurope.artwhere.co\/tsmc-va-construire-une-fab-3nm-pour-les-puces-dintel\/"},"modified":"2022-01-16T15:15:25","modified_gmt":"2022-01-16T15:15:25","slug":"tsmc-va-construire-une-fab-3nm-pour-les-puces-dintel","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/tsmc-va-construire-une-fab-3nm-pour-les-puces-dintel\/","title":{"rendered":"TSMC va construire une Fab 3nm pour les puces d&rsquo;Intel"},"content":{"rendered":"<p>TSMC \u00e0 l&rsquo;intention de construire une usine de pointe \u00e0 Baoshan, au nord de Hsinchu, pour fabriquer des puces 3 nm pour Intel&nbsp;<\/p>\n<p>Des informations en provenance de Ta\u00efwan indiquent que TSMC pr\u00e9voit l&rsquo;usine dans la r\u00e9gion de Baoshan, au nord de Hsinchu, o\u00f9 se trouvent la majorit\u00e9 de ses usines. Baoshan poss\u00e8de un r\u00e9servoir qui alimente en eau Hsinchu, ce qui a \u00e9t\u00e9 un probl\u00e8me cl\u00e9 pour la production de TSMC au cours de l&rsquo;\u00e9t\u00e9. L&#8217;emplacement donnerait un acc\u00e8s plus facile \u00e0 l&rsquo;eau n\u00e9cessaire \u00e0 la production, et est \u00e9galement proche du campus principal de TSMC, minimisant la fragmentation de la production qui, selon TSMC, augmente les risques et r\u00e9duit l&rsquo;efficacit\u00e9.<\/p>\n<p><strong>Lire aussi:<\/strong><\/p>\n<ul>\n<li><a href=\"https:\/\/www.ecinews.fr\/news\/tsmc-va-investir-100-milliards-sur-3-ans-pour-augmenter-ses-capacites\" target=\"notSet\" rel=\"noopener\">TSMC va investir $100 milliards sur 3 ans pour augmenter ses capacit\u00e9s<\/a><\/li>\n<li><a href=\"https:\/\/www.electronique-eci.com\/news\/intel-sous-traite-la-fabrication-de-ses-core-i3-5nm-tsmc\" target=\"_blank\" rel=\"noopener\">Intel sous-traite la fabrication de ses Core i3 5nm \u00e0 TSMC<\/a><\/li>\n<li><a href=\"https:\/\/www.ecinews.fr\/news\/detruire-tsmc-si-la-chine-envahit-taiwan\" target=\"notSet\" rel=\"noopener\">D\u00e9truire TSMC si la Chine envahit Ta\u00efwan ?<\/a><\/li>\n<\/ul>\n<p>Cela fait suite \u00e0 un accord d&rsquo;Intel avec avec TSMC pour la fabrication du processeur Core i3 sur son process&nbsp;5 nm, ( voir&nbsp;<a href=\"https:\/\/www.electronique-eci.com\/news\/intel-sous-traite-la-fabrication-de-ses-core-i3-5nm-tsmc\" target=\"_blank\" rel=\"noopener\">Intel sous-traite la fabrication de ses Core i3 5nm \u00e0 TSMC<\/a>)&nbsp;convenu avant que Pat Gelsinger ne re-vienne chez&nbsp;Intel en tant que CEO. Il a recentr\u00e9 Intel sur la fabrication, notamment en construisant de nouvelles Fabs&nbsp;\u00e0 Chandler, en Arizona, ce qui a mis en doute de futurs accords avec TSMC.<\/p>\n<p>La construction et l&rsquo;\u00e9quipement d&rsquo;une usine de 3 nm prendront jusqu&rsquo;\u00e0 deux ans avant de commencer&nbsp;la production, bien que cela puisse \u00eatre fait plus rapidement que les constructions pr\u00e9vues par Intel aux \u00c9tats-Unis, car TSMC aura d\u00e9j\u00e0 des commandes en place pour les machines de lithographie UV extr\u00eames (EUV) d&rsquo;ASML qui sont essentielles pour la technologie 3 nm, en particulier avec le r\u00e9cent incendie chez&nbsp;ASML \u00e0 Berlin. Intel a eu du mal avec la mise en service de son process&nbsp;EUV en dessous de 7 nm.<\/p>\n<p>Tout cela fait partie des \u00e9normes investissements de capacit\u00e9 annonc\u00e9s par les plus grands fabricants de puces pour faire face \u00e0 la p\u00e9nurie de puces. TSMC a \u00e9t\u00e9 \u00e0 la t\u00eate du d\u00e9veloppement de la technologie de process&nbsp;3 nm, dont la production devrait commencer plus tard cette ann\u00e9e.&nbsp;&nbsp;<\/p>\n<p><a href=\"http:\/\/www.intel.com\" target=\"_blank\" rel=\"noopener\">www.intel.com<\/a>; <a href=\"http:\/\/www.tsmc.com\" target=\"_blank\" rel=\"noopener\">www.tsmc.com<\/a><\/p>\n<p><strong>Articles li\u00e9s<\/strong><\/p>\n<ul>\n<li><a href=\"https:\/\/www.ecinews.fr\/news\/lindependance-de-lue-dans-les-semiconducteurs-pas-faisable\" target=\"_blank\" rel=\"noopener\">L&rsquo;ind\u00e9pendance de l&rsquo;UE dans les semiconducteurs, pas faisable?<\/a><\/li>\n<li><a href=\"https:\/\/www.ecinews.fr\/news\/la-chine-tentee-par-lannexion-de-taiwan-pour-ses-semiconducteurs\" target=\"_blank\" rel=\"noopener\">La Chine tent\u00e9e par l&rsquo;annexion de Ta\u00efwan pour ses semiconducteurs ?<\/a><\/li>\n<li><a href=\"https:\/\/www.eenewseurope.com\/news\/has-semiconductor-market-fundamentally-changed\" target=\"_blank\" rel=\"noopener\">Has the semiconductor market fundamentally changed?<\/a><\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<hr \/>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>TSMC \u00e0 l&rsquo;intention de construire une usine de pointe \u00e0 Baoshan, au nord de Hsinchu, pour fabriquer des puces 3 nm pour Intel <\/p>\n","protected":false},"author":22,"featured_media":158779,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[880],"tags":[913,906],"domains":[47],"ppma_author":[1149],"class_list":["post-158778","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualites-economiques","tag-materials-processes-fr","tag-mpus-mcus-fr","domains-electronique-eci"],"acf":[],"yoast_head":"<title>TSMC va construire une Fab 3nm pour les puces d&#039;Intel ...<\/title>\n<meta name=\"description\" content=\"TSMC \u00e0 l&#039;intention de construire une usine de pointe \u00e0 Baoshan, au nord de Hsinchu, pour fabriquer des puces 3 nm pour Intel\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/158778\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"TSMC va construire une Fab 3nm pour les puces d&#039;Intel\" \/>\n<meta property=\"og:description\" content=\"TSMC \u00e0 l&#039;intention de construire une usine de pointe \u00e0 Baoshan, au nord de Hsinchu, pour fabriquer des puces 3 nm pour Intel\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/158778\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2022-01-16T15:15:25+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/tsmc_fab2_2.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"729\" \/>\n\t<meta property=\"og:image:height\" content=\"481\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"eeNews Europe\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"eeNews Europe\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/tsmc-va-construire-une-fab-3nm-pour-les-puces-dintel\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/tsmc-va-construire-une-fab-3nm-pour-les-puces-dintel\/\"},\"author\":{\"name\":\"eeNews Europe\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#\/schema\/person\/9eff4051fa9dac8230052de45e32b0f4\"},\"headline\":\"TSMC va construire une Fab 3nm pour les puces d&rsquo;Intel\",\"datePublished\":\"2022-01-16T15:15:25+00:00\",\"dateModified\":\"2022-01-16T15:15:25+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/tsmc-va-construire-une-fab-3nm-pour-les-puces-dintel\/\"},\"wordCount\":432,\"publisher\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/#organization\"},\"keywords\":[\"Materials &amp; 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