{"id":144600,"date":"2017-09-11T14:00:26","date_gmt":"2017-09-11T14:00:26","guid":{"rendered":"https:\/\/\/samsung-renforce-son-activite-de-fonderie-avancee\/"},"modified":"2017-09-11T14:00:26","modified_gmt":"2017-09-11T14:00:26","slug":"samsung-renforce-son-activite-de-fonderie-avancee","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/samsung-renforce-son-activite-de-fonderie-avancee\/","title":{"rendered":"Samsung renforce son activit\u00e9 de fonderie avanc\u00e9e"},"content":{"rendered":"<p>Gr\u00e2ce \u00e0 une miniaturisation plus pouss\u00e9e, le 11LPP offre des performances sup\u00e9rieures de 15&nbsp;% avec la m\u00eame consommation d&rsquo;\u00e9nergie et une r\u00e9duction de 10&nbsp;% de la surface de puce par rapport au proc\u00e9d\u00e9 initial 14LPP. En plus de la gravure FinFET de 10&nbsp;nm pour les processeurs mobiles dans les smartphones haut de gamme, l&rsquo;entreprise s&rsquo;attend \u00e0 ce que son proc\u00e9d\u00e9 de 11&nbsp;nm offre une valeur diff\u00e9renci\u00e9e aux smartphones moyenne et haute gamme. La nouvelle technologie de gravure doit \u00eatre pr\u00eate pour la production au premier semestre 2018.<br \/>\nSamsung a \u00e9galement confirm\u00e9 que le d\u00e9veloppement du 7LPP avec la technologie de lithographie EUV (ultraviolet extr\u00eame) se d\u00e9roule selon les pr\u00e9visions, la production initiale \u00e9tant pr\u00e9vue pour le deuxi\u00e8me semestre 2018.<br \/>\nDepuis 2014, Samsung a trait\u00e9 pr\u00e8s de 200&nbsp;000 wafers avec la technologie de lithographie EUV. Fort de son exp\u00e9rience, il a r\u00e9cemment vu des r\u00e9sultats visibles en mati\u00e8re de d\u00e9veloppement de la gravure, en atteignant un rendement de 80&nbsp;% pour la SRAM de 256 m\u00e9gabits. \u00ab&nbsp;Le proc\u00e9d\u00e9 11&nbsp;nm a \u00e9t\u00e9 ajout\u00e9 \u00e0 notre feuille de route pour offrir des options avanc\u00e9es \u00e0 diverses applications&nbsp;\u00bb, a d\u00e9clar\u00e9 Ryan Lee, vice-pr\u00e9sident et directeur du marketing fonderie chez Samsung Electronics.&nbsp; \u00ab&nbsp;La feuille de route de Samsung est ainsi compl\u00e8te pour les trois ann\u00e9es \u00e0 venir en s&rsquo;\u00e9tendant de 14&nbsp;nm \u00e0 11&nbsp;nm, 10&nbsp;nm, 8&nbsp;nm et 7&nbsp;nm&nbsp;\u00bb.<\/p>\n<p>La mise \u00e0 jour r\u00e9cente de la feuille de route fonderie de Samsung, notamment la disponibilit\u00e9 du 11LPP et le d\u00e9veloppement de l&rsquo;EUV en 7&nbsp;nm, sera d\u00e9taill\u00e9e au Samsung Foundry Forum Japan, le 15 septembre 2017 \u00e0 Tokyo. Le Samsung Foundry Forum s&rsquo;est tenu aux \u00c9tats-Unis et en Cor\u00e9e du Sud plus t\u00f4t cette ann\u00e9e. Il pr\u00e9sentait les technologies de gravure avanc\u00e9es de Samsung aux clients et partenaires du monde entier.<\/p>\n<p><a href=\"http:\/\/news.samsung.com\/\" target=\"_blank\" rel=\"noopener\">http:\/\/news.samsung.com<\/a>.<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Samsung Electronics Co., Ltd, leader mondial de la technologie avanc\u00e9e des semi-conducteurs, a annonc\u00e9 aujourd&rsquo;hui avoir ajout\u00e9 la technologie de gravure FinFET de pointe en 11 nanom\u00e8tres (11LPP, Low Power Plus) \u00e0 ses proc\u00e9d\u00e9s de fonderie avanc\u00e9s. La gamme d\u2019options propos\u00e9e aux clients pour leurs produits de la prochaine g\u00e9n\u00e9ration s\u2019\u00e9largit ainsi.<\/p>\n","protected":false},"author":9,"featured_media":144601,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[],"tags":[],"domains":[47],"ppma_author":[1141],"class_list":["post-144600","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","domains-electronique-eci"],"acf":[],"yoast_head":"<title>Samsung renforce son activit\u00e9 de fonderie avanc\u00e9e ...<\/title>\n<meta name=\"description\" content=\"Samsung Electronics Co., Ltd, leader mondial de la technologie avanc\u00e9e des semi-conducteurs, a annonc\u00e9 aujourd&#039;hui avoir ajout\u00e9 la technologie de gravure...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/144600\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Samsung renforce son activit\u00e9 de fonderie avanc\u00e9e\" \/>\n<meta property=\"og:description\" content=\"Samsung Electronics Co., Ltd, leader mondial de la technologie avanc\u00e9e des semi-conducteurs, a annonc\u00e9 aujourd&#039;hui avoir ajout\u00e9 la technologie de gravure FinFET de pointe en 11 nanom\u00e8tres (11LPP, Low Power Plus) \u00e0 ses proc\u00e9d\u00e9s de fonderie avanc\u00e9s. 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