{"id":129850,"date":"2018-02-19T18:45:44","date_gmt":"2018-02-19T18:45:44","guid":{"rendered":"https:\/\/\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/"},"modified":"2018-02-19T18:45:44","modified_gmt":"2018-02-19T18:45:44","slug":"ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package","status":"publish","type":"post","link":"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/","title":{"rendered":"ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectronique de \u00ab\u00a0System-In-Package\u00a0\u00bb"},"content":{"rendered":"<p>Cette solution se compose du kit de conception SiP-id (System-in-Package intelligent design), d\u2019un flot de r\u00e9f\u00e9rence enrichi qui inclut des outils de conception de bo\u00eetiers et de v\u00e9rification de circuits int\u00e9gr\u00e9s de Cadence, ainsi que d\u2019une nouvelle m\u00e9thodologie permettant de r\u00e9pondre aux exigences de conception aux niveaux wafer, bo\u00eetier et syst\u00e8me au sein d\u2019un flot automatis\u00e9 et unifi\u00e9. En d\u00e9ployant la m\u00e9thodologie SiP-id d\u2019ASE, les concepteurs peuvent r\u00e9duire les it\u00e9rations de conception et am\u00e9liorer la productivit\u00e9 de fa\u00e7on significative par rapport aux actuels outils de CAO \u00e9lectronique avanc\u00e9s d\u00e9di\u00e9s au packaging, r\u00e9duisant ainsi les d\u00e9lais de conception et de v\u00e9rification des bo\u00eetiers SiP ultra-complexes.<\/p>\n<p><a href=\"http:\/\/www.cadence.com\/\">www.cadence.com<\/a><\/p>\n<h3 class=\"title\"><a href=\"http:\/\/www.electronique-eci.com\/news\/accelerer-le-processus-de-conception-de-circuits-imprimes\">Acc\u00e9l\u00e9rer le processus de conception de circuits imprim\u00e9s<\/a><\/h3>\n","protected":false},"excerpt":{"rendered":"<p>La soci\u00e9t\u00e9 ta\u00efwanaise Advanced Semiconductor Engineering et Cadence Design Systems, Inc annoncent avoir collabor\u00e9 \u00e0 la r\u00e9alisation d\u2019une solution de CAO \u00e9lectronique (EDA) pour le System-in-Package (SIP) capable de relever les d\u00e9fis de conception et de v\u00e9rification des bo\u00eetiers multi-puces de type FOCos (Fan-Out Chip-on-substrate). <\/p>\n","protected":false},"author":9,"featured_media":129851,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[],"tags":[],"domains":[47],"ppma_author":[1141],"class_list":["post-129850","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","domains-electronique-eci"],"acf":[],"yoast_head":"<title>ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectroniq...<\/title>\n<meta name=\"description\" content=\"La soci\u00e9t\u00e9 ta\u00efwanaise Advanced Semiconductor Engineering et Cadence Design Systems, Inc annoncent avoir collabor\u00e9 \u00e0 la r\u00e9alisation d\u2019une solution de...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/129850\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectronique de \u00ab\u00a0System-In-Package\u00a0\u00bb\" \/>\n<meta property=\"og:description\" content=\"La soci\u00e9t\u00e9 ta\u00efwanaise Advanced Semiconductor Engineering et Cadence Design Systems, Inc annoncent avoir collabor\u00e9 \u00e0 la r\u00e9alisation d\u2019une solution de CAO \u00e9lectronique (EDA) pour le System-in-Package (SIP) capable de relever les d\u00e9fis de conception et de v\u00e9rification des bo\u00eetiers multi-puces de type FOCos (Fan-Out Chip-on-substrate).\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/129850\/\" \/>\n<meta property=\"og:site_name\" content=\"EENewsEurope\" \/>\n<meta property=\"article:published_time\" content=\"2018-02-19T18:45:44+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci6182_cadence.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"558\" \/>\n\t<meta property=\"og:image:height\" content=\"318\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Alain Dieul\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Alain Dieul\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/\"},\"author\":{\"name\":\"Alain Dieul\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf\"},\"headline\":\"ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectronique de \u00ab\u00a0System-In-Package\u00a0\u00bb\",\"datePublished\":\"2018-02-19T18:45:44+00:00\",\"dateModified\":\"2018-02-19T18:45:44+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/\"},\"wordCount\":158,\"publisher\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\"},\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/\",\"url\":\"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/\",\"name\":\"ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectronique de \u00ab\u00a0System-In-Package\u00a0\u00bb -\",\"isPartOf\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\"},\"datePublished\":\"2018-02-19T18:45:44+00:00\",\"dateModified\":\"2018-02-19T18:45:44+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.ecinews.fr\/fr\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectronique de \u00ab\u00a0System-In-Package\u00a0\u00bb\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#website\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"name\":\"EENewsEurope\",\"description\":\"Just another WordPress site\",\"publisher\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#organization\",\"name\":\"EENewsEurope\",\"url\":\"https:\/\/www.eenewseurope.com\/en\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"contentUrl\":\"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg\",\"width\":283,\"height\":113,\"caption\":\"EENewsEurope\"},\"image\":{\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf\",\"name\":\"Alain Dieul\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/6d32dc651fbcef3b338066625b118364\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g\",\"caption\":\"Alain Dieul\"}}]}<\/script>","yoast_head_json":{"title":"ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectroniq...","description":"La soci\u00e9t\u00e9 ta\u00efwanaise Advanced Semiconductor Engineering et Cadence Design Systems, Inc annoncent avoir collabor\u00e9 \u00e0 la r\u00e9alisation d\u2019une solution de...","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/129850\/","og_locale":"fr_FR","og_type":"article","og_title":"ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectronique de \u00ab\u00a0System-In-Package\u00a0\u00bb","og_description":"La soci\u00e9t\u00e9 ta\u00efwanaise Advanced Semiconductor Engineering et Cadence Design Systems, Inc annoncent avoir collabor\u00e9 \u00e0 la r\u00e9alisation d\u2019une solution de CAO \u00e9lectronique (EDA) pour le System-in-Package (SIP) capable de relever les d\u00e9fis de conception et de v\u00e9rification des bo\u00eetiers multi-puces de type FOCos (Fan-Out Chip-on-substrate).","og_url":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/129850\/","og_site_name":"EENewsEurope","article_published_time":"2018-02-19T18:45:44+00:00","og_image":[{"width":558,"height":318,"url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci6182_cadence.jpg","type":"image\/jpeg"}],"author":"Alain Dieul","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Alain Dieul","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/#article","isPartOf":{"@id":"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/"},"author":{"name":"Alain Dieul","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf"},"headline":"ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectronique de \u00ab\u00a0System-In-Package\u00a0\u00bb","datePublished":"2018-02-19T18:45:44+00:00","dateModified":"2018-02-19T18:45:44+00:00","mainEntityOfPage":{"@id":"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/"},"wordCount":158,"publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"inLanguage":"fr-FR"},{"@type":"WebPage","@id":"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/","url":"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/","name":"ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectronique de \u00ab\u00a0System-In-Package\u00a0\u00bb -","isPartOf":{"@id":"https:\/\/www.eenewseurope.com\/en\/#website"},"datePublished":"2018-02-19T18:45:44+00:00","dateModified":"2018-02-19T18:45:44+00:00","breadcrumb":{"@id":"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.ecinews.fr\/fr\/ase-et-cadence-livrent-la-premiere-solution-de-cao-electronique-de-system-in-package\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.ecinews.fr\/fr\/"},{"@type":"ListItem","position":2,"name":"ASE et Cadence livrent la premi\u00e8re solution de CAO \u00e9lectronique de \u00ab\u00a0System-In-Package\u00a0\u00bb"}]},{"@type":"WebSite","@id":"https:\/\/www.eenewseurope.com\/en\/#website","url":"https:\/\/www.eenewseurope.com\/en\/","name":"EENewsEurope","description":"Just another WordPress site","publisher":{"@id":"https:\/\/www.eenewseurope.com\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.eenewseurope.com\/en\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"fr-FR"},{"@type":"Organization","@id":"https:\/\/www.eenewseurope.com\/en\/#organization","name":"EENewsEurope","url":"https:\/\/www.eenewseurope.com\/en\/","logo":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/","url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","contentUrl":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/2022\/02\/logo-1.jpg","width":283,"height":113,"caption":"EENewsEurope"},"image":{"@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/568c789a4794bd460460501ba91f5daf","name":"Alain Dieul","image":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.eenewseurope.com\/en\/#\/schema\/person\/image\/6d32dc651fbcef3b338066625b118364","url":"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g","caption":"Alain Dieul"}}]}},"authors":[{"term_id":1141,"user_id":9,"is_guest":0,"slug":"alaindieul","display_name":"Alain Dieul","avatar_url":"https:\/\/secure.gravatar.com\/avatar\/93708ec89b35deb10f4cfbfe144b4e07?s=96&d=mm&r=g","0":null,"1":"","2":"","3":"","4":"","5":"","6":"","7":"","8":""}],"_links":{"self":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/129850"}],"collection":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/comments?post=129850"}],"version-history":[{"count":0,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/posts\/129850\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media\/129851"}],"wp:attachment":[{"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/media?parent=129850"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/categories?post=129850"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/tags?post=129850"},{"taxonomy":"domains","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/domains?post=129850"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/www.ecinews.fr\/fr\/wp-json\/wp\/v2\/ppma_author?post=129850"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}