{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"Alain Dieul","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/alaindieul\/","title":"Winbond arrive sur le march\u00e9 HyperRAM","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"w59E50wPGE\"><a href=\"https:\/\/www.ecinews.fr\/fr\/winbond-arrive-sur-le-marche-hyperram\/\">Winbond arrive sur le march\u00e9 HyperRAM<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/winbond-arrive-sur-le-marche-hyperram\/embed\/#?secret=w59E50wPGE\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0Winbond arrive sur le march\u00e9 HyperRAM\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"w59E50wPGE\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci8262_winbond_actu.jpg","thumbnail_width":432,"thumbnail_height":396,"description":"La croissance rapide des march\u00e9s de l\u2019\u00e9lectronique automobile, de l\u2019industrie 4.0 et des applications domotiques intelligentes va donner naissance \u00e0 de nouveaux appareils IoT et des interfaces homme-machine exigeants quant \u00e0 la taille, la consommation et la performance. C\u2019est pourquoi de nombreux fabricants de microcontr\u00f4leurs d\u00e9veloppent de nouvelles g\u00e9n\u00e9rations de processeurs plus performants et moins gourmands en \u00e9nergie. Mais sur le plan du syst\u00e8me global la RAM qui travaille avec le processeur r\u00e9clame elle aussi de nouvelles caract\u00e9ristiques pour s\u2019imposer face aux SDRAM ou pSRAM existantes."}