{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"Alain Dieul","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/alaindieul\/","title":"TFP rejoint SERMA Microelectronics","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"mO7LYtfGLH\"><a href=\"https:\/\/www.ecinews.fr\/fr\/tfp-rejoint-serma-microelectronics\/\">TFP rejoint SERMA Microelectronics<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/tfp-rejoint-serma-microelectronics\/embed\/#?secret=mO7LYtfGLH\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0TFP rejoint SERMA Microelectronics\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"mO7LYtfGLH\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci9031_serma.jpg","thumbnail_width":639,"thumbnail_height":465,"description":"SERMA Microelectronics, filiale de SERMA Group, a finalis\u00e9 l\u2019achat de la soci\u00e9t\u00e9 TFP (Thin Fim Products), leader fran\u00e7ais de la fabrication de circuits hyperfr\u00e9quence en technologie couche mince pour les applications spatiales, militaires et civiles. Cette acquisition vient compl\u00e9ter l\u2019expertise de SERMA Microelectronics dans la production de circuits \u00e9lectroniques c\u00e9ramiques, en ajoutant la couche mince \u00e0 la technologie couche \u00e9paisse d\u00e9j\u00e0 maitris\u00e9e en interne. Elle renforce par la m\u00eame occasion le positionnement d\u2019acteur strat\u00e9gique de la base industrielle de d\u00e9fense fran\u00e7aise de SERMA Microelectronics."}