{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"Alain Dieul","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/alaindieul\/","title":"Tektronix acc\u00e9l\u00e8re le d\u00e9bogage des dispositifs mobiles","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"uovK1Pjm2q\"><a href=\"https:\/\/www.ecinews.fr\/fr\/tektronix-accelere-le-debogage-des-dispositifs-mobiles\/\">Tektronix acc\u00e9l\u00e8re le d\u00e9bogage des dispositifs mobiles<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/tektronix-accelere-le-debogage-des-dispositifs-mobiles\/embed\/#?secret=uovK1Pjm2q\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0Tektronix acc\u00e9l\u00e8re le d\u00e9bogage des dispositifs mobiles\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"uovK1Pjm2q\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci6501_tektronix.jpg","thumbnail_width":1920,"thumbnail_height":1080,"description":"Tektronix a annonc\u00e9 la prise en charge du d\u00e9codage, du d\u00e9clenchement et de l'analyse de protocoles pour l'interface de gestion de l'alimentation du syst\u00e8me de l\u2019Alliance MIPI (SPMI) pour ses MSO (oscilloscopes \u00e0 signaux mixtes) de S\u00e9ries 5 et 6. La nouvelle option logicielle tire parti des capacit\u00e9s de pointe de ces oscilloscopes, notamment la productivit\u00e9 de la configuration tactile, l'un des plus grands \u00e9crans HD 15,6 pouces du march\u00e9 pour afficher plusieurs bus et des tensions de rail d'alimentation \u00e0 faible bruit."}