{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"Alain Dieul","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/alaindieul\/","title":"Samsung renforce son activit\u00e9 de fonderie avanc\u00e9e","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"ZVzqwl71DW\"><a href=\"https:\/\/www.ecinews.fr\/fr\/samsung-renforce-son-activite-de-fonderie-avancee\/\">Samsung renforce son activit\u00e9 de fonderie avanc\u00e9e<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/samsung-renforce-son-activite-de-fonderie-avancee\/embed\/#?secret=ZVzqwl71DW\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0Samsung renforce son activit\u00e9 de fonderie avanc\u00e9e\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"ZVzqwl71DW\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci5886_samsung.jpg","thumbnail_width":811,"thumbnail_height":400,"description":"Samsung Electronics Co., Ltd, leader mondial de la technologie avanc\u00e9e des semi-conducteurs, a annonc\u00e9 aujourd'hui avoir ajout\u00e9 la technologie de gravure FinFET de pointe en 11 nanom\u00e8tres (11LPP, Low Power Plus) \u00e0 ses proc\u00e9d\u00e9s de fonderie avanc\u00e9s. La gamme d\u2019options propos\u00e9e aux clients pour leurs produits de la prochaine g\u00e9n\u00e9ration s\u2019\u00e9largit ainsi."}