{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"eeNews Europe","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/eenews-europe\/","title":"RS Components fait \u00e9voluer DesignSpark PCB","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"0nkmGxV198\"><a href=\"https:\/\/www.ecinews.fr\/fr\/rs-components-fait-evoluer-designspark-pcb\/\">RS Components fait \u00e9voluer DesignSpark PCB<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/rs-components-fait-evoluer-designspark-pcb\/embed\/#?secret=0nkmGxV198\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0RS Components fait \u00e9voluer DesignSpark PCB\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"0nkmGxV198\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/import\/eci3034_rs.jpg","thumbnail_width":1300,"thumbnail_height":1100,"description":"R\u00e9alis\u00e9e par RS en partenariat avec Number One Systems, la derni\u00e8re version de DesignSpark PCB fournit des fonctionnalit\u00e9s suppl\u00e9mentaires et permet d'utiliser les outils de simulation SPICE issus de diff\u00e9rents constructeurs majeurs. En plus de cette nouvelle interface pour la simulation, la version 3 contient des am\u00e9liorations telles que le regroupement de composants et d'\u00e9l\u00e9ments de circuits et les calculatrices de conception qui \u00e9valuent les caract\u00e9ristiques de performance du circuit."}