{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"eeNews Europe","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/eenews-europe\/","title":"Nouvelle technologie de conditionnement pour capteurs MEMS","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"P6hyKK8X6S\"><a href=\"https:\/\/www.ecinews.fr\/fr\/nouvelle-technologie-de-conditionnement-pour-capteurs-mems\/\">Nouvelle technologie de conditionnement pour capteurs MEMS<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/nouvelle-technologie-de-conditionnement-pour-capteurs-mems\/embed\/#?secret=P6hyKK8X6S\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0Nouvelle technologie de conditionnement pour capteurs MEMS\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"P6hyKK8X6S\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/import\/thumbnail134x115 (107).jpg","thumbnail_width":134,"thumbnail_height":115,"description":"Pour la r\u00e9alisation de capteur de pression MEMS, la nouvelle technologie brevet\u00e9e de STMicroelectronics permet d\u2019isoler totalement l\u2019\u00e9l\u00e9ment de d\u00e9tection de pression \u00e0 l\u2019int\u00e9rieur d\u2019un bo\u00eetier enti\u00e8rement moul\u00e9. Cette technologie permettra de r\u00e9pondre aux exigences de la prochaine g\u00e9n\u00e9ration d\u2019appareils portables destin\u00e9s au grand public en termes de formats ultracompacts comme de la cr\u00e9ativit\u00e9 de conception."}