{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"eeNews Europe","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/eenews-europe\/","title":"Nouveaux processus \u00e0 m\u00e9moire flash embarqu\u00e9e et NVM","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"LXYy0cJkyr\"><a href=\"https:\/\/www.ecinews.fr\/fr\/nouveaux-processus-a-memoire-flash-embarquee-et-nvm\/\">Nouveaux processus \u00e0 m\u00e9moire flash embarqu\u00e9e et NVM<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/nouveaux-processus-a-memoire-flash-embarquee-et-nvm\/embed\/#?secret=LXYy0cJkyr\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0Nouveaux processus \u00e0 m\u00e9moire flash embarqu\u00e9e et NVM\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"LXYy0cJkyr\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/import\/silicon-wafer-closeup-3d-scaled.jpg","thumbnail_width":2560,"thumbnail_height":1920,"description":"Toshiba Corporation vient d'annoncer un nouveau processus \u00e0 m\u00e9moire flash embarqu\u00e9e bas\u00e9 sur une technologique logique 65 nm qui consomme moins que les technologies traditionnelles, et un processus m\u00e9moire NVM (Non-Volatile Memory) bas\u00e9 sur une technologie de puissance logique et analogique 130 nm. L'application de processus optimaux \u00e0 diff\u00e9rentes applications, va permettre \u00e0 Toshiba d'\u00e9tendre sa ligne de produits dans des secteurs comme les microcontr\u00f4leurs, les CI de transmission sans-fil, les drivers de commande moteur, et les CI d'alimentation."}