{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"eeNews Europe","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/eenews-europe\/","title":"Microprocesseurs en bo\u00eetier plomb\u00e9 pour applications haute fiabilit\u00e9","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"w0qfyUei5U\"><a href=\"https:\/\/www.ecinews.fr\/fr\/microprocesseurs-en-boitier-plombe-pour-applications-haute-fiabilite\/\">Microprocesseurs en bo\u00eetier plomb\u00e9 pour applications haute fiabilit\u00e9<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/microprocesseurs-en-boitier-plombe-pour-applications-haute-fiabilite\/embed\/#?secret=w0qfyUei5U\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0Microprocesseurs en bo\u00eetier plomb\u00e9 pour applications haute fiabilit\u00e9\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"w0qfyUei5U\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/import\/eci6284_e2v_qoriq_image001_lo-scaled.jpg","thumbnail_width":2560,"thumbnail_height":1942,"description":"Conform\u00e9ment \u00e0 l'accord-cadre avec Freescale Semiconductor, e2v est en mesure de fournir des processeurs QorIQ qualifi\u00e9s ayant subi des processus de d\u00e9-billage et de re-billage, tout en r\u00e9pondant aux  diff\u00e9rentes questions de fiabilit\u00e9 associ\u00e9es au processus, telles que\u00a0 la conformit\u00e9 de la coplanarit\u00e9 des grands bo\u00eetiers comportant plus de 1\u00a0000\u00a0billes, la pr\u00e9cision de pas, les probl\u00e8mes de fiabilit\u00e9 de la  fixation du couvercle et la formation de dendrites autour des billes situ\u00e9es \u00e0 proximit\u00e9 des bords et entre le couvercle et le substrat."}