{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"Alain Dieul","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/alaindieul\/","title":"M\u00e9moires DDR4 hautes performances et haute densit\u00e9","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"RyWxXCPKsj\"><a href=\"https:\/\/www.ecinews.fr\/fr\/memoires-ddr4-hautes-performances-et-haute-densite\/\">M\u00e9moires DDR4 hautes performances et haute densit\u00e9<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/memoires-ddr4-hautes-performances-et-haute-densite\/embed\/#?secret=RyWxXCPKsj\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0M\u00e9moires DDR4 hautes performances et haute densit\u00e9\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"RyWxXCPKsj\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci8581_smart.jpg","thumbnail_width":545,"thumbnail_height":525,"description":"SMART Modular Technologies a annonc\u00e9 les nouveaux modules DDR4 en bo\u00eetier MIP (Module In a Package) haute densit\u00e9. Ce nouveau bo\u00eetier \u00e9tend jusqu\u2019\u00e0 16 Go, la gamme propos\u00e9e en bo\u00eetier MIP. Le bo\u00eetier MIP de SMART est un concept innovant, tenant dans un format minuscule, et destin\u00e9 \u00e0 l\u2019IIoT (Industrial Internet of Things), l'informatique embarqu\u00e9e, la vid\u00e9o diffusion et les routeurs mobiles, et autres applications o\u00f9 l\u2019on veut disposer d\u2019une capacit\u00e9 DRAM maximale, dans un volume tr\u00e8s restreint."}