{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"eeNews Europe","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/eenews-europe\/","title":"M\u00e9moire Flash parall\u00e8le de 64 Mbits","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"CzJHKgdTDZ\"><a href=\"https:\/\/www.ecinews.fr\/fr\/memoire-flash-parallele-de-64-mbits\/\">M\u00e9moire Flash parall\u00e8le de 64 Mbits<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/memoire-flash-parallele-de-64-mbits\/embed\/#?secret=CzJHKgdTDZ\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0M\u00e9moire Flash parall\u00e8le de 64 Mbits\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"CzJHKgdTDZ\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/import\/eci4359_microchip_sst38vf640xbhi-1024x731.jpg","thumbnail_width":1024,"thumbnail_height":731,"description":"Microchip annonce le lancement d'un nouveau composant de m\u00e9moire Flash, le SST38VF6401B. Le SST38VF6401B est un composant CMOS Advanced MPF+ (Advanced Multi-Purpose Flash Plus) de 4M x16 fabriqu\u00e9 \u00e0 partir de la technologie CMOS SuperFlash ultra performante de Microchip, une cellule de m\u00e9moire flash \u00e0 grille fractionn\u00e9e avec injection par effet tunnel dans un oxyde \u00e9pais, pour une fiabilit\u00e9 et des possibilit\u00e9s de fabrication accrues. Ce circuit int\u00e9gr\u00e9 est conforme au standard JEDEC pour les m\u00e9moires x16 en mati\u00e8re d'affectation des broches."}