{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"Wisse Hettinga","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/wisse-hettinga\/","title":"IBM d\u00e9voile une puce en technologie 2nm nanosheet","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"CgeDSAMdl9\"><a href=\"https:\/\/www.ecinews.fr\/fr\/ibm-devoile-une-puce-en-technologie-2nm-nanosheet\/\">IBM d\u00e9voile une puce en technologie 2nm nanosheet<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/ibm-devoile-une-puce-en-technologie-2nm-nanosheet\/embed\/#?secret=CgeDSAMdl9\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0IBM d\u00e9voile une puce en technologie 2nm nanosheet\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"CgeDSAMdl9\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/cdn.eenewseurope.com\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/2021-05_06_s20_ibm_2-nanometer_semiconductor_technology.jpg","thumbnail_width":600,"thumbnail_height":350,"description":"Le g\u00e9ant de la technologie IBM a d\u00e9voil\u00e9 ce qu'il dit \u00eatre une perc\u00e9e dans la conception et le process de fabrication des semiconducteurs avec le d\u00e9veloppement de la premi\u00e8re puce au monde annonc\u00e9e avec la technologie nanosheet de 2 nm."}