{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"eeNews Europe","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/eenews-europe\/","title":"Computer-on-Module pour solutions basse puissance \u00e9volutives","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"lIPC1o9b4Y\"><a href=\"https:\/\/www.ecinews.fr\/fr\/computer-on-module-pour-solutions-basse-puissance-evolutives\/\">Computer-on-Module pour solutions basse puissance \u00e9volutives<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/computer-on-module-pour-solutions-basse-puissance-evolutives\/embed\/#?secret=lIPC1o9b4Y\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0Computer-on-Module pour solutions basse puissance \u00e9volutives\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"lIPC1o9b4Y\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/import\/eci3055_kontron.jpg","thumbnail_width":1800,"thumbnail_height":1200,"description":"Le nouveau standard COM introduit par Kontron se caract\u00e9rise par un facteur de forme mince con\u00e7u pour les futures plates-formes ultra-minces qui seront offertes sur \u00e9tag\u00e8res par la soci\u00e9t\u00e9. En \u00e9tendant le mod\u00e8le COM aux architectures RISC, avec des solutions \u00e9volutives, modulaires et pr\u00eates \u00e0 l'emploi, ce nouveau standard comble le vide qui existe entre les offres industrielles propri\u00e9taires et les offres du march\u00e9 grand public."}