{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"Alain Dieul","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/alaindieul\/","title":"Collaboration strat\u00e9gique pour applications 3D hautes performances","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"SqaZD0RKQo\"><a href=\"https:\/\/www.ecinews.fr\/fr\/collaboration-strategique-pour-applications-3d-hautes-performances\/\">Collaboration strat\u00e9gique pour applications 3D hautes performances<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/collaboration-strategique-pour-applications-3d-hautes-performances\/embed\/#?secret=SqaZD0RKQo\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0Collaboration strat\u00e9gique pour applications 3D hautes performances\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"SqaZD0RKQo\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.ecinews.fr\/wp-content\/uploads\/import\/default\/files\/sites\/default\/files\/images\/eci8837_adi.jpg","thumbnail_width":1260,"thumbnail_height":1260,"description":"Analog Devices, Inc,a annonc\u00e9 une collaboration strat\u00e9gique avec Microsoft Corp. qui s'appuiera sur la technologie de capteur 3D ToF (Time of Flight) de Microsoft pour cr\u00e9er facilement des applications 3D hautes performances. Ces derni\u00e8res se caract\u00e9risent par une mesure de profondeur tr\u00e8s pr\u00e9cise et un fonctionnement ind\u00e9pendant des conditions environnementales. L'expertise technique d'ADI compl\u00e8tera la technologie Azure Kinect de Microsoft pour fournir des solutions ToF de pointe \u00e0 un plus grand nombre d'utilisateurs dans des domaines tels que l'Industrie 4.0, l'automobile, les consoles de jeux, la r\u00e9alit\u00e9 augment\u00e9e ainsi que la vid\u00e9o et la photographie num\u00e9rique."}